Patent application number | Description | Published |
20080234915 | CONTROL DEVICE FOR HYBRID VEHICLE DRIVING DEVICE, AND CONTROL METHOD FOR THE DRIVING DEVICE - A hybrid vehicle driving device is capable of causing a motor-powered travel of a hybrid vehicle in which only an electric motor is used as a drive force source, by driving the electric motor with electric power from an electric storage device while a rotational driving of an internal combustion engine has been stopped. A control device for the hybrid vehicle driving device includes a rotational drive portion that determines whether or not supply of a lubrication oil to at least a portion of the power transmission device by the lubrication oil supply device is necessary based on a travel distance in the motor-powered travel following a stop of the rotational driving of the internal combustion engine, and rotationally drives the internal combustion engine based on determination as to need for the supply of the lubrication oil. | 09-25-2008 |
20090139825 | TOROUE FLUCTUATION ABSORBER - A torque fluctuation absorber, including: an output plate that is rotatably disposed; a first rotating plate disposed for movement in the direction of rotation of the output plate relatively from the output plate; a first elastic member engaged with the output plate and the first rotating plate and capable of transmitting the power applied to the first rotating plate to the output plate; a second elastic member to which the power from a power source is applied and capable of transmitting the power to the first rotating plate; and a power transmission control mechanism. The power transmission control mechanism is located radially outside the first elastic member about an axis of rotation. The second elastic member is spaced from the first elastic member and the power transmission control mechanism in the direction of the axis of rotation. The first elastic member and the second elastic member are arranged radially offset. | 06-04-2009 |
20100179010 | HYBRID VEHICLE POWER TRANSMISSION DEVICE AND HYBRID VEHICLE - A hybrid vehicle power transmission device provided with a power distribution mechanism composed of a planetary gear device for distributing motive power of a drive source to a motor and an output shaft is further provided with a damper device in a power transmission path between the power distribution mechanism and a first motor. Consequently, the damper device receives only reaction torque dealt by the first motor through the power distribution mechanism with respect to drive torque of an engine. Thus, since the torque transmitted to the damper device is smaller than the drive torque of the engine, the torque capacity of the damper device can be decreased and the size of the damper device can be reduced. As a result, the overall size of the power transmission device can be similarly reduced. | 07-15-2010 |
Patent application number | Description | Published |
20100053013 | EBG STRUCTURE, ANTENNA DEVICE, RFID TAG, NOISE FILTER, NOISE ABSORPTIVE SHEET AND WIRING BOARD WITH NOISE ABSORPTION FUNCTION - An EBG (Electromagnetic Bandgap) structure includes a magnetic material portion at least in part. It is preferable to arrange the magnetic material portion close to or, if possible, in contact with a conductor forming the EBG structure, for example, at least a portion of a ground conductor, a conductor producing a capacitance, and/or a conductor producing an inductance, such as a via. Examples of the magnetic material portion include a ferrite plating film, a composite magnetic material layer including magnetic powder and resin binder, and the like. | 03-04-2010 |
20110183130 | FERRITE-PROVIDED BODY AND FABRICATION METHOD THEREOF - This provides a fabrication method for fabricating a ferrite-provided body comprising a base member | 07-28-2011 |
20110217531 | BODY WITH MAGNETIC FILM ATTACHED AND MANUFACTURING METHOD THEREFOR - A fabrication method for fabricating a magnetic film provided body includes preparing a base body and forming a magnetic film on the base body. The magnetic film includes organic film(s) and ferrite film(s) alternately layered. The formation of the magnetic film alternately includes forming a ferrite film through a ferrite plating method, the ferrite film having a thickness of 20 μm or less, and forming an organic film having a thickness of 0.1 μm to 20 μm, both inclusive, and a ratio t/E of 0.025 μm/GPa or more, where “t” indicates the thickness of the organic film while “E” indicates Young's modulus of the organic film. | 09-08-2011 |
Patent application number | Description | Published |
20090047507 | Multilayer printed circuit board - A multilayer printed circuit board includes an inner magnetic layer essentially consisting of magnetic material. The inner magnetic layer may be formed by an action of chemical bond or van der Waals force. The inner magnetic layer may comprise a plurality of magnetic units, each of which provides magnetism, and may be formed by magnetically coupling the magnetic units with each other by using a strong interaction. The inner magnetic layer may essentially consist of a ferrite film. The ferrite film may be formed directly on the inner conductive layer by means of an electroless plating method. The ferrite film may essentially consist of an oxide metal composition, the metal composition being represented by the formula of Fe | 02-19-2009 |
20090061256 | Ferrite thin film, method of manufacturing the same and electromagnetic noise suppressor using the same - An electromagnetic noise suppressor including a ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by a plating method in the presence of a magnetic field. | 03-05-2009 |
20140055208 | RESONATOR, MULTILAYER BOARD AND ELECTRONIC DEVICE - A resonator is connected to a first plane which is one of a power plane and a ground plane, wherein the power plane and the ground plane are apart from each other in an up-down direction. The resonator comprises a connecting portion and a body portion. The connecting portion is connected to the first plane. The connecting portion extends in the up-down direction beyond a second plane, which is a remaining one of the power plane and the ground plane, while not being in electrical contact with the second plane. The body portion is connected to the connecting portion while not being in contact with the second plane. The body portion is arranged so that the second plane is located between the body portion and the first plane in the up-down direction. | 02-27-2014 |
Patent application number | Description | Published |
20110212574 | PROCESSING METHOD FOR PACKAGE SUBSTRATE - A processing method for a package substrate having a base substrate partitioned by a plurality of crossing division lines to form a plurality of chip forming areas where a plurality of semiconductor chips are respectively formed and molded with resin. The package substrate has a resin surface and an electrode surface opposite to the resin surface. The processing method includes a warp correcting step of cutting the package substrate from the resin surface or the electrode surface along the division lines by using a cutting blade to form a cut groove, thereby correcting a warp of the package substrate, and a grinding step of grinding the resin surface of the package substrate in the condition where the electrode surface of the package substrate is held on a holding table after performing the warp correcting step, thereby reducing the thickness of the package substrate to a predetermined thickness. | 09-01-2011 |
20110256665 | STACKED WAFER MANUFACTURING METHOD - A manufacturing method for a stacked wafer composed of a mother wafer and a stacking wafer bonded together. The mother wafer has a plurality of first semiconductor devices and the stacking wafer has a plurality of second semiconductor devices respectively corresponding to the first semiconductor devices. The manufacturing method includes the steps of bonding the front side of a substrate through a bonding layer to the front side of the stacking wafer, next grinding the back side of the stacking wafer to reduce the thickness of the stacking wafer to a predetermined thickness, next stacking the unit of the stacking wafer and the substrate bonded together on the mother wafer in the condition where the back side of the stacking wafer is opposed to the front side of the mother wafer, thereby bonding electrodes exposed to the back side of each second semiconductor device to electrodes of each first semiconductor device formed on the front side of the mother wafer, and finally grinding the substrate bonded to the front side of the stacking wafer to thereby remove the substrate. | 10-20-2011 |
20110256667 | STACKED WAFER MANUFACTURING METHOD - A manufacturing method for a stacked wafer configured by bonding a mother wafer having a plurality of first semiconductor device and a stacking wafer having a plurality of second semiconductor devices. The manufacturing method includes the steps of attaching a protective member to the front side of the stacking wafer to protect the second semiconductor devices, next grinding the back side of the stacking wafer, next bonding the front side of a reinforcing wafer through a bonding layer to the back side of the stacking wafer, next dividing the stacking wafer together with the reinforcing wafer into the plural second semiconductor devices, next bonding the front side of each second semiconductor device to the front side of the mother wafer to thereby connect the electrodes of each second semiconductor device to the electrodes of the corresponding first semiconductor device of the mother wafer, and finally grinding the reinforcing wafer bonded to the back side of each second semiconductor device to thereby remove the reinforcing wafer. | 10-20-2011 |
20130056857 | DEVICE CHIP AND MANUFACTURING METHOD THEREFOR - A manufacturing method for a device chip having a substrate, a device formed on the front side of the substrate, and chip identification information marked inside the substrate includes preparing a device wafer having a base wafer and a plurality of devices formed on the front side of the base wafer so as to be partitioned by division lines, next applying a laser beam having a transmission wavelength to the device wafer from the back side thereof in the condition where the focal point of the laser beam is set inside the base wafer at the positions respectively corresponding to the devices, thereby forming a plurality of modified layer marks as the chip identification information inside the base wafer at the positions respectively corresponding to the devices, and finally dividing the device wafer along the division lines to obtain a plurality of device chips. | 03-07-2013 |
Patent application number | Description | Published |
20120256337 | CATHODE ACTIVE MATERIAL PRECURSOR PARTICLE, METHOD FOR PRODUCING THEREOF AND METHOD FOR PRODUCING CATHODE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY - The cathode active material precursor particle, which forms, through incorporation of lithium thereinto, a cathode active material particle for use in a lithium secondary battery, the cathode active material particle containing a lithium complex oxide having a layered rock salt structure, is characterized in that the precursor particle has an aspect ratio, which is a ratio of long axis diameter to short axis diameter, of 1.0 or more and less than 2 and is formed so that the (003) planes of the lithium-incorporated cathode active material particle are substantially uniaxially oriented. | 10-11-2012 |
20120258365 | CATHODE ACTIVE MATERIAL PRECURSOR PARTICLE, CATHODE ACTIVE MATERIAL PARTICLE FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY - The invention provides lithium secondary battery cathode active material particle, which is formed as a secondary particle that is a mass of a plurality of single-crystal primary particles of a lithium-nickel-based complex oxide having a layered rock salt structure, wherein the primary particles have a mean particle size of 0.01 to 5 μm, and the secondary particle has an aspect ratio, which is a ratio of long axis diameter to short axis diameter, of 1.0 or more and less than 2 and a mean particle size of 1 to 100 μm, wherein the ( | 10-11-2012 |
20120258369 | LITHIUM SECONDARY BATTERY AND CATHODE ACTIVE MATERIAL THEREFOR - The lithium secondary battery cathode active material having a layered rock salt structure is characterized in that the material is formed of a plurality of primary particles having a mean particle size of 0.01 to 5 μm, and contains secondary particles having a mean particle size of 1 to 100 μm and an aspect ratio, which is a ratio of long axis diameter to short axis diameter, of 1.0 or more and less than 2; and that the primary particles forming the secondary particles have a (003) plane orientation degree of 50% or higher. | 10-11-2012 |
20130263771 | CRYSTAL PRODUCTION METHOD - A crystal production method according to the present invention includes a film formation and crystallization step of spraying a raw material powder containing a raw material component to form a film containing the raw material component on a seed substrate containing a single crystal at a predetermined single crystallization temperature at which single crystallization of the raw material component occurs, and crystallizing the film containing the raw material while maintaining the single crystallization temperature. In the film formation and crystallization step, preferably, the single crystallization temperature is 900° C. or higher. Furthermore, in the film formation and crystallization step, preferably, the raw material powder and the seed substrate are each a nitride or an oxide. | 10-10-2013 |
Patent application number | Description | Published |
20130121743 | TAPE PRINTER - The disclosure discloses a tape printer that includes a cartridge holder, a cartridge sensor, a feeding device, a printing device, a communication device, and a controller. The controller is configured to detect attribute information of a tape cartridge, identify a model of the mounted tape cartridge, and acquire corresponding current model information, acquire latest model information of the tape cartridge, from an information providing device related to the tape cartridge, generate purchase support information based on the acquired current model information and the acquired latest model information, when the tape cartridge of a model indicated by the current model information or the latest model information is newly purchased, and control the printing device so that the generated purchase support information is formed into print on a print-receiving tape. | 05-16-2013 |
20130301063 | PRINT LABEL PRODUCING APPARATUS, CONTENTS PROCESSING PROGRAM, AND CONTENTS PROCESSING METHOD - The disclosure discloses a print label producing apparatus. The apparatus includes a producing apparatus side attaching/detaching portion to and from which a nonvolatile storage device can be attached and detached, an attachment determining portion configured to determine whether or not the storage device is attached to the producing apparatus side attaching/detaching portion, a selection information write portion configured to write unique selection material information to the storage device in an attached state, and a contents acquisition portion configured to acquire contents stored in the storage device and corresponding to the selection material information when the attachment determining portion determines that the storage device is attached to the producing apparatus side attaching/detaching portion. | 11-14-2013 |
20140328747 | ZINC OXIDE SPUTTERING TARGET AND METHOD FOR PRODUCING SAME - Provided is a zinc oxide sputtering target, which can effectively suppress the occurrence of break or crack in the target during sputtering to enable production of a zinc oxide transparent conductive film with high productivity. The zinc oxide sputtering target is composed of a zinc oxide sintered body comprising zinc oxide crystal grains, wherein the zinc oxide sputtering target has a sputter surface having a (100) crystal orientation degree of 50% or more. | 11-06-2014 |