| Patent application number | Description | Published |
|---|
| 20100134043 | LIGHTING DEVICE - In a lighting device, a first LED is formed by sealing a blue LED element by a first resin, the first resin having a first phosphor included in the first resin so as to raise a correlation color temperature of an emitted light color; and a second LED is formed by sealing a blue LED element by a second resin, the second resin having a second phosphor included in the second resin so as to lower a correlation color temperature of an emitted light color. The lighting device emits light from white light of a color having a first correlation color temperature to white light of a color having a second correlation color temperature, and the first correlation color temperature is higher than the second correlation color temperature. Consequently, various tones of white light can be more easily adjusted and controlled over a long period. | 06-03-2010 |
| 20100320483 | LIGHT-EMITTING DIODE APPARATUS - An LED apparatus includes a base having thermal conductivity, an insulative substrate provided on one surface of the base and including electrodes provided on a surface of the substrate, at least one base-mounting area that is an exposed part of the base, exposed within a pass-through hole provided in the substrate, a plurality of LED elements mounted on the base in the base-mounting area and some of the LED elements in a unit electrically connected to the electrodes in series, a plurality of the units are electrically connected in parallel, and a frame disposed to surround the base-mounting area and configured to form a light-emitting area. | 12-23-2010 |
| 20110019420 | LIGHT-EMITTING DIODE APPARATUS - An LED light source apparatus comprises a circular base having thermal conductivity, an insulative substrate concentric with the base and including a pass-through hole provided to pass through an upper surface and a lower surface of the substrate, at least one mounting area formed having a central portion of an upper surface of the base exposed from the pass-through hole of the substrate, and a plurality of LED elements mounted on the mounting area and electrically connected to electrodes provided on the upper surface of the substrate, the pass-through hole being formed in a circular shape concentric with the base and the substrate. | 01-27-2011 |
| Patent application number | Description | Published |
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| 20080224155 | LIGHT-EMITTING DIODE UNIT - An LED unit including a frame ( | 09-18-2008 |
| 20080254650 | LIGHT-EMITTING DIODE AND METHOD FOR PRODUCING IT - An LED includes a printed circuit board, at least one LED element including a junction and mounted on the printed circuit board, a first sealing member disposed to cover side surfaces of the LED element, and a second sealing member disposed to cover side surfaces of the LED element. The first sealing member is configured to reflect and shield light emitted from the junction of the LED element, and the second sealing member is configured to transmit light emitted from the LED element. | 10-16-2008 |
| 20090108283 | ILLUMINATION DEVICE AND METHOD FOR MANUFACTURING THE SAME - An illumination device includes a circuit board ( | 04-30-2009 |
| 20090109631 | ELECTRONIC-COMPONENT-MOUNTING BOARD - The electronic-component-mounting board according to the present invention includes: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a upper surface of the metal plate; an electronic component which is mounted on the high-heat-dissipation substrate and is electrically connected to the circuit pattern; and one external connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic-component-mounting board and an external device. The external-connection terminal is formed of a material having a thermal conductivity less than that of the metal plate and has at least one external electrode to which a lead wire is soldered. Therefore, the lead wire can be connected by soldering even on the high-heat-dissipation substrate. Accordingly, the reliability of the electrical connection is improved, and reduction in size and thickness of the electronic-component-mounting board can be achieved. In addition, the cost of the electronic-component-mounting board can be reduced. | 04-30-2009 |
