Patent application number | Description | Published |
20080205019 | Method for Mutually Connecting Circuit Boards - A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings. | 08-28-2008 |
20080283280 | Method for Connecting Printed Circuit Boards - To provide a method for connecting printed circuit boards with high connection reliability, while avoiding the problem of shorting even with a fine pitch. A method for connecting printed circuit boards (PCB) containing metal wiring, or connecting a printed circuit board (PCB) containing metal wiring with a metal lead wire or a metal contact, which method includes a step of thermocompression bonding of an adhesive film with connectors, the adhesive film being composed of an adhesive composition comprising a thermoplastic resin and organic particles, wherein the viscosity decreases as the applied thermocompression force increases at a temperature of 100-250° C. | 11-20-2008 |
20090127692 | METHOD OF CONNECTING A SEMICONDUCTOR PACKAGE TO A PRINTED WIRING BOARD - A method of electrically connecting a bump array package to a wiring board, comprising the steps of:
| 05-21-2009 |
20090321015 | ADHESIVE COMPOSITION COMPRISING POLYHYDROXYETHER AND ORGANIC PARTICLES, AND METHOD FOR CONNECTING CIRCUIT BOARD USING THE SAME - To provide an adhesive composition which can exhibit high adhesion to a circuit board and also has ability capable of releasing the connection to the circuit board connected and reconnecting the circuit board (repairing properties). An adhesive composition comprising: (i) one or more aromatic-group-containing polyhydroxy ether resins, (ii) a compound having an alkoxysilyl group and an imidazole group in the molecule, and (iii) organic particles, wherein the content of the organic particles is 50% by weight or more based on the weight of the adhesive composition. | 12-31-2009 |
20100197368 | CABLE HARNESS BODY - To provide a connecting means that can facilitate electrical connection between the circuit boards mounted in an electronic apparatus and can attain the miniaturization of connecting parts. A cable harness body comprising a plurality of cables for electrically connecting circuit boards mounted in an electronic apparatus and the terminal members disposed on both ends of said cables, wherein at least one of said terminal members is comprised of a flexible circuit board and an adhesive layer on the surface of the electric connecting part of said flexible circuit board. | 08-05-2010 |
20100206623 | NONCONDUCTIVE ADHESIVE COMPOSITION AND FILM AND METHODS OF MAKING - To provide a nonconductive adhesive film, for electrically connecting a flexible printed circuit board to a circuit board, which is superior in both storage stability and curability and which suppresses the formation of air bubbles at the time of press bonding. A nonconductive adhesive film substantially comprising a heat-curable epoxy resin, a latent curing agent, and organic elastic fine particles of an average particle size of approximately 1 μm or less, a film being formed by aggregation of the organic elastic fine particles, is provided. | 08-19-2010 |
20110000700 | METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE - A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board. | 01-06-2011 |
20110163569 | TERMINAL MOUNTING STRUCTURE AND METHOD - To provide a terminal mounting structure, the electrical continuation and the joining strength of which are sufficiently high although the structure is simple, further the reliability of which is high even when it is used over a long period of time and to provide a terminal mounting method therefor. A terminal ( | 07-07-2011 |