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Kogoi

Hisao Kogoi, Toyama-Shi JP

Patent application numberDescriptionPublished
20110044888FINE PARTICULATE TITANIUM DIOXIDE, AND PRODUCTION PROCESS AND USE THEREOF - A process for producing a fine particulate titanium dioxide, comprising charging a fine particulate titanium dioxide powder in a resin bag, spraying water droplets having a liquid droplet diameter of 5 to 500 μm to the powder in the bag, and closing the bag for storing the powder in the bag.02-24-2011

Hisao Kogoi, Chichibu-Shi JP

Patent application numberDescriptionPublished
20100028240PROCESS FOR PRODUCING SILICON CARBIDE SINGLE CRYSTAL - A method for producing an SiC single crystal comprises providing a low temperature region and a high temperature region in a crystal growth crucible (02-04-2010
20100092366WATER-BASED POLISHING SLURRY FOR POLISHING SILICON CARBIDE SINGLE CRYSTAL SUBSTRATE, AND POLISHING METHOD FOR THE SAME - A water-based polishing slurry for polishing a silicon carbide single crystal, wherein the slurry comprises abrasive particles having a mean particle size of 1 to 400 nm and an inorganic acid, and the slurry has a pH of less than 2 at 20° C.04-15-2010
20110111171SEED CRYSTAL FOR SILICON CARBIDE SINGLE CRYSTAL GROWTH, METHOD FOR PRODUCING THE SEED CRYSTAL, SILICON CARBIDE SINGLE CRYSTAL, AND METHOD FOR PRODUCING THE SINGLE CRYSTAL - A seed crystal for silicon carbide single crystal growth (05-12-2011

Hisao Kogoi, Toyama JP

Patent application numberDescriptionPublished
20080260625Fine Particulate Titanium Dioxide, and Production Process and Use Thereof - A high-purity ultrafine particulate titanium dioxide with a reduced fluctuation of the adsorbed water content which is a large mass fluctuation factor in a fine particulate powder body, is provided. The fine particulate titanium dioxide has a BET specific surface area of 10 to 200 m10-23-2008
20090188701Inorganic powder, resin composition filled with the powder and use thereof - The present invention relates to an inorganic powder having a frequency-size distribution with multiple peaks, wherein the peaks are present at least in the particle size regions from 0.2 to 2 μm and from 2 to 63 μm, preferably with the maximum particle size being 63 μm or less, the average particle size being from 4 to 30 μm, and the mode size being from 2 to 35 μm. The inorganic powder of the present invention is useful as a filler for a high thermally conductive member in electronic component-mounted circuit board required to have electrical insulating property and heat radiating performance, in that a heat radiating member comprising the powder can have thermal conductivity, the powder can provide a resin composition having excellent withstand voltage characteristics for forming an insulative composition into a thin film and can be filled in the resin composition at a high density so as to improve heat radiating performance of the resin composition.07-30-2009

Patent applications by Hisao Kogoi, Toyama JP