| Patent application number | Description | Published |
|---|
| 20080203897 | Light Source Comprising Led Arranged in Recess - A light source comprising a substrate ( | 08-28-2008 |
| 20080278061 | Light Emitting Diode Module - The present invention relates to a LED module ( | 11-13-2008 |
| 20080290354 | Light Emitting Diode Assembly - A light emitting diode (LED) assembly, comprising a metal substrate ( | 11-27-2008 |
| 20080315238 | Porous Circuitry Material for Led Submounts - A submount comprising a ceramic substrate and a circuitry arranged thereon is provided. The circuitry comprises an electrically conducting porous material comprising at least one noble metal doped with at least one non-noble metal, the surface of at least portions of said electrically conducting porous material comprises oxides of said non-noble metals, and said ceramic substrate is bonded to said porous electrically conducting material via said oxides of said non-noble metals. | 12-25-2008 |
| 20080316764 | Lighting Device and Method for Directing Light - An LED module is described with a base | 12-25-2008 |
| 20090078948 | ILLUMINATOR AND METHOD FOR PRODUCING SUCH ILLUMINATOR - The present invention relates to an illuminator ( | 03-26-2009 |
| 20090134409 | COMPOSITE LED MODULES - The present invention provides a composite multi-color light emitting diode device comprising a first light emitting diode unit and a second light emitting diode unit that is arranged on top of the first light emitting diode unit. Thereby, a composite light emitting diode device, capable of emitting two different wavelengths of electromagnetic radiation is provided. It is furthermore possible to arrange a third light emitting diode unit. The third light emitting diode unit can be arranged on top of the second light emitting diode unit, thereby providing a stack of three light emitting diode units, or it can be arranged on the first light emitting diode unit, thereby providing two light emitting diode units side-by-side on top of the first light emitting diode unit. | 05-28-2009 |
| 20100012367 | PRINTED CIRCUIT BOARD ARRANGEMENT - The present invention relates to a printed circuit board arrangement with a multi-layer substrate ( | 01-21-2010 |
| 20110100683 | ELECTRONIC TEXTILE - The invention relates to an electronic textile comprising a textile substrate having a substrate electrode, and an electronic component having a component electrode. The component electrode is in electrically conductive contact with the substrate electrode via a coupling layer having a directionally dependent conductance so as to preferentially allow an electrical current to flow between the substrate electrode and the component electrode. As the coupling layer does not have to be patterned to prevent the occurrence of parasitic electrical currents, the electrically conductive contact between the substrate electrode and the component electrode has an improved reliability. | 05-05-2011 |
