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Kodera, Kanagawa

Akira Kodera, Kanagawa JP

Patent application numberDescriptionPublished
20090134036Electrolytic Processing Method and Electrolytic Processing Apparatus - An electrolytic processing method makes it possible to preferentially process a diffusion barrier layer while suppressing processing of an interconnect metal, thereby enabling omission of CMP or a lowering of processing pressure in CMP. The electrolytic processing method comprises: bringing a surface of a substrate (W) into contact with an electrolytic solution (05-28-2009

Hideki Kodera, Kanagawa JP

Patent application numberDescriptionPublished
20100206485VACUUM ADSORPTION CONTROL MECHANISM DEVICE, FILM PASTING DEVICE, METHOD OF PASTING FILM, AND DISPLAY DEVICE - An object of the present invention is to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure. A vacuum suction control mechanism apparatus according to the present invention includes a first member including a plurality of suction holes formed in a surface thereof, the plurality of suction holes being connectable to a decompression source, and a second member capable of contacting the plurality of suction holes, the second member being movable relative to the first member, wherein the second member includes connecting member connecting some of the suction holes, the number of which corresponds to a relative position between the first member and the second member, to the decompression source.08-19-2010
20100214504VACUUM ADSORPTION CONTROL MECHANISM DEVICE, FILM APPLYING DEVICE, AND DISPLAY DEVICE - An object of the present invention is to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure. A vacuum suction control mechanism apparatus according to the present invention includes a bonding head including a space defined therein, a plurality of suction holes attracting a film, the plurality of suction holes extending from a surface of the bonding head to the space defined in the bonding head, a movable piece partitioning the space into two regions, the movable piece being movable relative to the bonding head within the space in contact with the suction holes, and a connection portion connectable to a decompression source, the connection portion being provided in a first region of the two regions.08-26-2010

Katsuyoshi Kodera, Kanagawa JP

Patent application numberDescriptionPublished
20100067777EVALUATION PATTERN GENERATING METHOD, COMPUTER PROGRAM PRODUCT, AND PATTERN VERIFYING METHOD - An evaluation pattern generating method including dividing a peripheral area of an evaluation target pattern into a plurality of meshes; calculating an image intensity of a circuit pattern when the evaluation target pattern is transferred onto a wafer by a lithography process in a case where a mask function value is given to a predetermined mesh; calculating a mask function value of the mesh so that a cost function of the image intensity, in which an optical image characteristic amount that affects a transfer performance of the evaluation target pattern to the wafer is set to the image intensity, satisfies a predetermined reference when evaluating a lithography performance of the evaluation target pattern; and generating an evaluation pattern corresponding to the mask function value.03-18-2010
20100261121PATTERN FORMING METHOD - To provide a pattern forming method comprising: laminating a resist layer on a substrate; forming a diffraction pattern having an opening opened at a predetermined pitch p for diffracting exposure light on an upper layer side of the resist layer; performing whole image exposure with respect to the diffraction pattern in which a refractive index with respect to the exposure light is n, with diffracted light acquired by irradiation of exposure light having a wavelength λ from above the diffraction pattern, which is then diffracted by the diffraction pattern; and forming a desired pattern on a lower layer side of the resist pattern by using a resist pattern formed by developing the resist layer, wherein the predetermined pitch p, the wavelength λ, and the refractive index n satisfy a condition of p>λ/n.10-14-2010
20100304279MANUFACTURING METHOD OF PHASE SHIFT MASK, CREATING METHOD OF MASK DATA OF PHASE SHIFT MASK, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A phase shift mask having a plurality of mask patterns or mask data thereof is prepared, and an overlapped focus range in each of the mask patterns in a case where a result of exposure to each of the mask patterns, obtained by an exposure experiment or a lithography simulation, meets a desired dimension is obtained. A digging depth is determined at discretion based on the obtained overlapped focus range.12-02-2010
20110029937PATTERN EVALUATING METHOD, PATTERN GENERATING METHOD, AND COMPUTER PROGRAM PRODUCT - A pattern evaluating method includes generating a proximity pattern that affects a resolution performance of a circuit pattern around a lithography target pattern of the circuit pattern to be formed on the substrate, generating distribution information on a distribution of an influence degree to the resolution performance of the circuit pattern by using the lithography target pattern, calculating the influence degree to the resolution performance of the circuit pattern by the proximity pattern as a score by comparing the distribution information with the proximity pattern, and evaluating whether the proximity pattern is placed at an appropriate position in accordance with the circuit pattern based on the score.02-03-2011
20110065028PATTERN GENERATING METHOD, MANUFACTURING METHOD OF MASK, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - According to the embodiments, each of a main pattern of a mask to be transferred onto a substrate by using a lithography process, a first assist pattern that improves a resolution of an on-substrate pattern obtained by transferring the main pattern onto the substrate, and a second assist pattern that suppresses a transfer property of the first assist pattern onto the substrate is placed as a mask pattern.03-17-2011

Kenji Kodera, Kanagawa JP

Patent application numberDescriptionPublished
20100178851POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus for polishing a periphery of a substrate includes a substrate holder configured to rotate the substrate, a first polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a first polishing tool into contact with the periphery of the substrate when rotated by the substrate holder, and a second polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a second polishing tool into contact with the periphery of the substrate when rotated by the substrate holder. The polishing layer of the first polishing tool has hard first abrasive grains, and the polishing layer of the second polishing tool has second abrasive grains that are softer than the first abrasive grains.07-15-2010

Tetsuro Kodera, Kanagawa JP

Patent application numberDescriptionPublished
20090097882PRODUCTION APPARATUS AND PRODUCTION METHOD OF WIRED MEMBER USING ELECTROPHOTOGRAPHIC METHOD - Disclosed is a production apparatus of a wired member, including: a mask forming unit that forms a mask on a transfer substrate by using a toner in accordance with an electrophotographic method so as to be transferable to a member to be wired, the mask corresponding to a wiring pattern to be formed on the member to be wired; a mask transferring unit that transfers the mask formed on the transfer substrate by the toner to the member to be wired; a conductive film forming unit that supplies a conductive material onto the mask-transferred side of the member to be wired to form a film of the conductive material thereon; and a mask removing unit that removes the mask from the member to be wired on which the film of the conductive material has been formed.04-16-2009
20110038653FIXING DEVICE, FIXING METHOD, AND IMAGE FORMING APPARATUS - According to an aspect of the invention, a fixing device includes a first laser unit and a second laser unit. The first laser unit outputs a first laser beam to irradiate a visible image formed of image forming material on a recording medium with the first laser beam. The second laser unit outputs a second laser beam to irradiate the visible image with the second laser beam after being irradiated with the first laser beam. The first laser beam and the second laser beam is configured to satisfy relations: W1t2, W1 is an optical output per unit area of the first laser beam, W2 is an optical output per unit area of the second laser beam, t1 is an irradiation time per unit area of the first laser beam, and t2 is an irradiation time per unit area of the second laser beam.02-17-2011
20110044740LASER FIXING APPARATUS AND IMAGE FORMING APPARATUS - A laser fixing apparatus includes: a laser light generator that generates laser light to be projected onto a recording medium. A first condenser reflects and condenses the light generated by reflection of the laser light at an irradiation position of the recording medium, such that the reflected and condensed light is re-projected at the irradiation position and/or near the irradiation position02-24-2011

Patent applications by Tetsuro Kodera, Kanagawa JP