| Patent application number | Description | Published |
|---|
| 20100018630 | Method of manufacturing composite wiring board - In a method for manufacturing a composite wiring board, a through hole is formed in a sheet having a shrinkage-suppressing effect, and the through hole is filled with conductive paste to obtain a sheet for formation of a conductor. The sheet for formation of the conductor and a green sheet for a substrate in their laminated state are fired to obtain a ceramic substrate having a surface provided with a sintered metal conductor. A fired product of the sheet having the shrinkage-suppressing effect is removed from the surface of the ceramic substrate. Finally, a resin layer is formed on the surface of the ceramic substrate. | 01-28-2010 |
| 20100080981 | GLASS CERAMIC SUBSTRATE - The present invention provides glass ceramic substrates | 04-01-2010 |
| 20100151217 | ELECTRONIC PART - There are provided electronic parts with excellent strength and high insulation resistance. According to a preferred embodiment, the electronic part comprises an inner layer section and outer layer sections formed covering the surfaces of the inner layer section, wherein the inner layer section and outer layer sections have a construction with a filler component dispersed in a glass component, the transverse strength of the inner layer section is at least 330 MPa, and the inner layer section has a thermal expansion coefficient larger than that of the outer layer sections. | 06-17-2010 |
| 20100244987 | Ceramic electronic component - Provided is a ceramic electronic component that, even if it is formed by building up dielectric layers of different compositions, can ensure that the built-up dielectric layers are prevented from separating from each other. The ceramic electronic component according to the present invention has: a first dielectric layer containing, as major components thereof, BaO, Nd | 09-30-2010 |
| 20100248927 | Dielectric ceramic composition - To provide a dielectric ceramic composition which is free from variation in breakdown voltage, and has excellent electric properties. The dielectric ceramic composition according the present invention includes: as a main component, a component represented by a composition formula {α(xBaO-yNd | 09-30-2010 |
| 20110223431 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and a boundary reaction layer. The first dielectric layer is a layer containing BaO, Nd | 09-15-2011 |
| 20110242728 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and an intermediate layer. The first dielectric layer is a layer containing BaO, Nd | 10-06-2011 |
