Patent application number | Description | Published |
20110095316 | LED PACKAGE STRUCTURE - An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge. | 04-28-2011 |
20110156085 | SEMICONDUCTOR PACKAGE - A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed. | 06-30-2011 |
20110186891 | SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE - A plurality of reflective nanometer-structures formed on the reflective surface of a semiconductor light emitting device package increases light emitting efficiency. Every pitch between each reflective nanometer-structure has an interval P shorter than the half wavelength of the visible light. Moreover, each of the plurality of reflective nanometer-structures has a depth H, wherein the ratio of the depth H over the interval P is not less than 2. | 08-04-2011 |
20120094405 | METHOD FOR MANUFACTURING LED PACKAGE - A method for manufacturing an LED package includes following steps: providing a substrate, wherein the substrate includes a plurality of package carriers and each package carrier includes two lead frames. Each package carrier includes a first surface and a recession surrounded by a bottom wall and a sidewall is defined on the first surface. Mount an LED chip on the bottom wall and electrical connecting the LED chip and the two lead frames, form an encapsulation in the recession; form a hydrophobic layer on the package carrier and the encapsulation; cut the substrate into a plurality of LED package structure. | 04-19-2012 |
20120104442 | LED AND MANUFACTURING METHOD - An LED includes a substrate, an LED chip setting on the substrate and a reflection cup surrounding the LED chip on the substrate. The LED chip electrically connects with two electrodes setting on the substrate. The reflection cup is filled with an encapsulating material. A fluorescent layer is formed by heating the encapsulating material and deposits on an end of the encapsulation away from the LED chip. The fluorescent layer is used for converting light from the LED chip into a specific wavelength. | 05-03-2012 |
20120119244 | LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes a substrate, an LED chip, and an encapsulation. The substrate includes a first surface. The LED chip is mounted on the first surface of the substrate. The encapsulation covers the LED chip. The encapsulation includes a transparent main body and a number of carbon nanotubes distributed in the transparent main body; the carbon nanotubes are arranged substantially extending along a same direction whereby light generated by the LED chip is polarized prior to radiation out of the encapsulation. | 05-17-2012 |
20150243861 | SEMICONDUCTOR LIGHTING MODULE PACKAGE - A semiconductor lighting module package includes a substrate, a lead frame located on the substrate, and a semiconductor lighting element. The lead frame has a carrier portion and a connecting portion spaced from the carrier portion. The semiconductor lighting element is electrically connected with the carrier portion and the connecting portion respectively. A plurality of nanoscale reflectors are formed on the carrier portion. A plurality of nanoscale reflectors are formed on the connecting portion. Shapes of the nanoscale reflectors formed on the carrier portion are different from shapes of the nanoscale reflectors formed on the connecting portion. | 08-27-2015 |
Patent application number | Description | Published |
20140111970 | BACKLIGHT MODULE - A backlight module is provided, including a back plate, a diffusion plate, multiple lighting bars mounted on the back plate and at least one lighting module mounted on each of the lighting bars, where each of the lighting modules has an LED forward light source and at least one pair of LED non-forward light sources, and the pair of LED non-forward light sources is mounted on the side of the LED forward light source, and light emitted from the LED forward light source and light emitted from each of the pair of LED light sources are spliced together to form a diffusing light shape. Therefore, the backlight module of the present invention has reduced lighting bars to decrease the weight, volume and cost of the whole backlight module and liquid-crystal display device, and overcome the problems of non-uniform brightness of conventional backlight modules. | 04-24-2014 |
20140192557 | EDGE-LIT BACKLIGHT MODULE - Disclosed is an edge-lit backlight module having a rectangular back panel with a reflective microstructure, and a first light portion with an inclined plane or a camber is provided for reflecting lights emitted from a plurality of LEDs and with a relatively smaller normal included angle, and a second light portion is provided for reflecting a light with a slightly greater included angle, and a third light portion is provided for reflecting the light with the greatest included angle to guide lights of different intensities to different paths and project the lights to every position of a front panel, so as to achieve a light extraction efficiency with a uniform distribution of luminous intensity of an LED light source. | 07-10-2014 |