| Patent application number | Description | Published |
|---|
| 20090114433 | MULTI-LAYERED CERAMIC BOARD AND METHOD OF MANUFACTURING THE SAME - There is provided a multi-layered ceramic board and a method of manufacturing the same. A multi-layered ceramic board according to an aspect of the invention may include: an internal layer having a plurality of first dielectric sheets laminated, each of the first dielectric sheets prepared by mixing glass powder with a predetermined amount of alumina powder; and an external layer having at least one second dielectric sheet laminated on the surface of the internal layer, the second dielectric sheet prepared by mixing glass powder with alumina powder in a smaller amount than the first dielectric sheet, wherein via hole conductors and internal electrodes provided in the internal layer are electrically connected to a surface electrode provided on the surface of the external layer, and the internal layer, the external layer, the via hole conductors, the internal layer, and the surface electrode are fired at a predetermined temperature. | 05-07-2009 |
| 20090114434 | METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHRINKAGE CERAMIC SUBSTRATE USING THE SAME - There is provided a method of manufacturing a non-shrinkage ceramic substrate, and a non-shrinkage ceramic substrate using the same. A method of manufacturing a non-shrinkage ceramic substrate by firing a ceramic laminate including an internal electrode circuit pattern according to an aspect of the invention may include: laminating at least one constraining ceramic sheet on each of the upper and lower surfaces of the ceramic laminate to form constraining layers; performing a primary firing process on the ceramic laminate having the constraining layers thereon; polishing the surface of the ceramic laminate from which the constraining layers are removed; forming ceramic paste on the polished surface of the ceramic laminate while exposing connection terminals of the internal electrode circuit pattern to the outside environment through openings in the ceramic paste; forming a surface electrode on the surface of the ceramic paste by patterning so that the surface electrode is electrically connected to the connection terminals; and performing a secondary firing process so that the surface electrode adheres to the ceramic paste. | 05-07-2009 |
| 20090159179 | METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE - A method of manufacturing a multilayer ceramic substrate according to an aspect of the invention may include: manufacturing a ceramic laminate including a glass component; laminating constraining layers on upper and lower parts of the ceramic laminate; performing primary firing within a first temperature range that does not allow crystallization of the glass component included in the ceramic laminate; removing the constraining layers and forming an external electrode on the ceramic laminate after the primary firing is completed; and performing secondary firing of the ceramic laminate having the external electrode formed thereon within a second temperature range higher than the first temperature range. | 06-25-2009 |
| 20110034606 | COMPOSITE DIELECTRIC COMPOSITION HAVING SMALL VARIATION OF CAPACITANCE WITH TEMPERATURE AND SIGNAL-MATCHING EMBEDDED CAPACITOR PREPARED USING THE SAME - Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ΔC/C×100(%), of not more than 5%. The composite dielectric composition of the present invention can be used in preparation of the signal-matching embedded capacitor due to a small variation of capacitance with temperature. | 02-10-2011 |
| 20110064952 | CERAMIC SUBSTRATE AND METHOD OF FABRICATING THE SAME - A method of fabricating a ceramic substrate includes: preparing a firing theta; forming a ceramic laminated body comprising at least one internal confinement layer on the ceramic theta; providing a temperature-compensation ceramic layer on at least one of a top surface of the ceramic laminated body and a bottom surface of the ceramic laminated body contacting the firing theta, the temperature-compensation ceramic layer having a different initial firing shrinkage temperature than the ceramic laminated body; and firing the ceramic laminated body. | 03-17-2011 |
