Patent application number | Description | Published |
20090015465 | MIXER CIRCUIT AND RADAR TRANSCEIVER - A mixer circuit includes: a rat race circuit including a ring-shaped transmission line with a first terminal, a second terminal, a third terminal, and a fourth terminal, the first to fourth terminals being disposed, in that order, clockwise along the transmission line and equally spaced λ | 01-15-2009 |
20090237166 | HIGH FREQUENCY POWER AMPLIFIER - A high frequency power amplifier comprises: a multi-finger transistor with transistor cells electrically connected in parallel; an input side matching circuit connected to gate electrodes of the transistor cells; and resonant circuits respectively connected between the gate electrode of a transistor cell and the input side matching circuit. The resonant circuit resonates at a second harmonic of the operating frequency of the transistor or within a predetermined range of frequencies having a center at the second harmonic of the operating frequency, and becomes a high-impedance load at the second harmonic, or an open load. | 09-24-2009 |
20100052799 | VOLTAGE CONTROLLED OSCILLATOR, MMIC, AND HIGH FREQUENCY WIRELESS DEVICE - A voltage controlled oscillator having low phase noise and including: a variable resonator including a varactor and a control voltage terminal; and an open-end stub connected in parallel to the variable resonator, the open-end stub having a length shorter than or equal to an odd multiple of one quarter of a wavelength of a harmonic signal plus one sixteenth of the wavelength of the harmonic signal, and longer than or equal to an odd multiple of one quarter of the wavelength of the harmonic signal minus one sixteenth of the wavelength of the harmonic signal. In this structure, a high Q value is realized for a fundamental wave frequency. Fluctuation in a control voltage due to a harmonic signal is controlled. | 03-04-2010 |
20100060362 | CASCODE CIRCUIT - A cascode circuit for a high-gain or high-output millimeter-wave device that operates with stability. The cascode circuit including two cascode-connected transistors includes: a first high electron mobility transistor (HEMT) including a source that is grounded; a second HEMT including a source connected to a drain of the first HEMT; a reflection gain restricting resistance connected to the gate of the second HEMT, for restricting reflection gain; and an open stub connected to a side of the reflection gain restricting resistance which is opposite the side connected to the second HEMT, for short-circuiting high-frequency signals at a predetermined frequency and nearby frequencies. | 03-11-2010 |
20100117711 | SEMICONDUCTOR CHIP AND RADIO FREQUENCY CIRCUIT - A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit. | 05-13-2010 |
20100315177 | EVEN HARMONIC MIXER - Provided is an even harmonic mixer which is reduced in cost and size. The even harmonic mixer includes: a transducer in which a conductor of a microstrip line is connected to a ground plane of a waveguide, for transducing an RF signal transmitted in a waveguide mode into a transmission mode of the microstrip line; an anti-parallel diode pair which is cascade-connected to a microstrip line side of the transducer, and formed on a semiconductor substrate; a branching circuit for branching an LO signal and an IF signal; an open-end stub which is disposed between the transducer and the anti-parallel diode pair, and has a line length of about ½ wavelength at an RF signal frequency; and an open-end stub which is disposed between the anti-parallel diode pair and the branching circuit, and has a line length of about ¼ wavelength at the RF signal frequency. | 12-16-2010 |
20110175686 | HIGH FREQUENCY SECOND HARMONIC OSCILLATOR - A high frequency second harmonic oscillator includes a transistor, a first signal line connected at a first end to the base or gate of the transistor, a first shunt capacitor connected at a first end to a second end of the first signal line and at a second end to ground, a second signal line connected at a first end to the collector or drain of the transistor, a second shunt capacitor connected at a first end to a second end of the second signal line and at a second end to ground, and a high capacitance capacitor connected between the first signal line and the second signal line. The first signal line has a length equal to an odd integer multiple of one quarter of the wavelength of a fundamental signal, plus or minus one-sixteenth of the wavelength of the fundamental signal. | 07-21-2011 |
20120025366 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a semiconductor device comprises: forming a circuit pattern and a first metal film on a first major surface of a body wafer; forming a through-hole penetrating the body wafer from a second major surface of the body wafer and reaching the first metal film; forming a second metal film on a part of the second major surface of the body wafer, on an inner wall of the through-hole, and on the first metal film exposed in the through-hole; forming a recess on a first major surface of a lid wafer; forming a third metal film on the first major surface of the lid wafer including inside the recess of the lid wafer; with the recess facing the circuit pattern, and the first metal film contacting the third metal film, joining the lid wafer to the body wafer; and dicing the joined body wafer and lid wafer along the through-hole. | 02-02-2012 |
20120094481 | METHOD OF MANUFACTURING AIRBRIDGE - In making an airbridge structure, a second resist layer is applied over a first resist layer. The resist layers are exposed and developed to have a predetermined width W | 04-19-2012 |
20120299178 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a main body chip; a circuit pattern on a front surface of the main body chip and including a first pad; a cap chip including a first recess in a front surface of the cap chip and a second recess in a back surface of the cap chip, the cap chip being joined to the main body chip with the first recess facing the circuit pattern; a second pad on a bottom surface of the first recess of the cap chip; a first metallic member inlaid in the second recess of the cap chip; a first through electrode electrically connecting the second pad to the first metallic member through the cap chip; and a bump electrically connecting the first pad to the second pad. | 11-29-2012 |
20130032817 | POWER AMPLIFIER - A power amplifier includes a semiconductor substrate including transistor cells, a drain electrode for the transistor cells located on the semiconductor substrate, a drain pad located on the semiconductor substrate and connected to the drain electrode, an ion-implanted resistance located in the semiconductor substrate and extending along and in contact with the drain pad, a floating electrode located on the semiconductor substrate and in contact with the ion-implanted resistance, and an output matching circuit located outside the semiconductor substrate. The power amplifier further includes a wire connecting the drain pad to the output matching circuit. | 02-07-2013 |
20140117411 | MONOLITHIC INTEGRATED CIRCUIT - A monolithic integrated circuit includes: a substrate having a diode region and a transistor region; a first semiconductor layer on the substrate in the diode region and in the transistor region; a second semiconductor layer on the first semiconductor layer in the diode region and in the transistor region; a third semiconductor layer on the second semiconductor layer in the transistor region, but not located in the diode region; a first electrode in the diode region and connected to the first semiconductor layer; a second electrode in the diode region and connected to the second semiconductor layer; and a source electrode, a gate electrode, and a drain electrode which are on the third semiconductor layer. | 05-01-2014 |