Patent application number | Description | Published |
20110021932 | BLOOD VESSEL PRESSING CUFF, BLOOD PRESSURE MEASURING APPARATUS INCLUDING THE BLOOD VESSEL PRESSING CUFF, AND BLOOD PRESSURE MEASURING METHOD USING THE BLOOD PRESSURE MEASURING APPARATUS - A blood vessel pressing cuff includes a strap surrounding a body part, a first actuator disposed on the strap and including a first shape memory alloy which changes to a first shape memorized in advance, at a temperature equal to or higher than a first temperature, and a second actuator disposed on the strap and including a second shape memory alloy which changes to a second shape memorized in advance, at a temperature equal to or higher than a second temperature that is different from the first temperature. If the first shape memory alloy changes to the first shape, pressure applied to the body part surrounded by the strap is increased. Even when the first shape memory alloy changes to the first shape, if the second shape memory alloy changes to the second shape, the pressure applied to the body part surrounded by the strap is reduced. | 01-27-2011 |
20110306892 | APPARATUS AND METHOD FOR MEASURING A BIOLOGICAL SIGNAL - Provided is a method and apparatuses for measuring a biological signal, in which a biological signal of an examinee is detected via at least one interface that touches skin of the examinee, and a dummy signal is detected via a dummy interface Noise that is generated by a fluctuation in the electrical characteristics of the at least one interface is removed from the biological signal using the biological signal and the dummy signal. | 12-15-2011 |
20120041292 | ELECTRODE FOR A LIVING BODY AND DEVICE FOR DETECTING A BIO-SIGNAL - Provided are an electrode for a living body and a device for detecting bio-signals using the electrode. The electrode includes an insulation sheet that has at least one via hole, an electrode unit formed in the at least one via hole, and a guiding unit for guiding the attachment of a signal processing unit. | 02-16-2012 |
20120172695 | ELECTRODE MEMBER AND APPARATUS FOR MEASURING BIOSIGNAL INCLUDING THE ELECTRODE MEMBER - An electrode member for a body is provided. The electrode member includes a first sheet member having at least one hole formed therein, at least one second sheet member respectively disposed in the at least one hole, at least one metal contact point disposed on the first sheet member, and at least one electrode respectively disposed on the at least one second sheet member. | 07-05-2012 |
20120245912 | METHOD OF AND APPARATUS FOR DETERMINING OPTIMAL PARAMETERS FOR MEASURING BIOLOGICAL SIGNALS BASED ON VIRTUAL BODY MODEL - A method of determining optimal parameters for measuring biological signals of a real body by using a virtual body model modeling a virtual body simulating the real body includes generating a plurality of virtual biological signals of the virtual body using the virtual body model by changing parameters that determine characteristics of the virtual biological signals; selecting at least one of the virtual biological signals based on a characteristic of one of the biological signals of the real body; and outputting at least one parameter used to generate the selected at least one virtual biological signal as at least one optimal parameter for measuring the one biological signal of the real body. | 09-27-2012 |
20130053675 | APPARATUS AND METHOD FOR MEASURING BIOELECTRIC SIGNALS - A bioelectric signal measurement apparatus includes a first interface configured to detect a bioelectric signal of a testee through electrical interfacing with a skin of the testee; a second interface configured to detect a signal different from the bioelectric signal through electrical interfacing with the skin, the second interface electrically interfacing with the skin in a state that is different from a state in which the first interface electrically interfaces with the skin; and a signal processor configured to remove, from the detected bioelectric signal, a motion artifact between the first interface and the skin using the detected signal different from the bioelectric signal. | 02-28-2013 |
20130079619 | BIOSIGNAL MEASURING APPARATUS AND METHOD OF MEASURING BIOSIGNAL - A biosignal measuring apparatus and a method of measuring a biosignal is provided. A biosignal measuring apparatus includes a first interfacing unit including two or more first interfaces configured to detect first signals from a subject, a second interfacing unit including two or more second interfaces and a connecting unit, the second interfaces being configured to detect noise from the subject, the connecting unit being configured to connect the second interfaces, and a biosignal extracting unit configured to extract a biosignal of the subject from the first signals by using signals output from the second interfacing unit. | 03-28-2013 |
20130181874 | COMMUNICATION SYSTEM - A wearable communication system including an antenna pattern configured to transmit or receive a radio-frequency (RF) signal, a main board configured to control the wearable communication system, and a power supply unit configured to supply power to the main board, wherein the antenna pattern is spaced apart from the main board and the power supply unit. | 07-18-2013 |
20130204110 | ELECTRODE FOR MEASURING BIO POTENTIAL, METHOD OF MANUFACTURING THE ELECTRODE, AND SYSTEM FOR MEASURING PHYSIOLOGICAL SIGNAL - An electrode for measuring a bio potential includes a conductive adhesive having one side configured to have at least two metal electrodes attached thereto while the electrode is being used, and another side configured to be attached to a living body while the electrode is being used, the conductive adhesive having a predetermined area and a predetermined thickness; and a supporting element configured to support the conductive adhesive while the conductive adhesive is attached to the living body; wherein an impedance is formed between the at least two metal electrodes while the at least two metal electrodes are attached to the side of the conductive adhesive, the impedance depending on a thickness of the conductive adhesive and having a value that prevents the at least two metal electrodes from being shorted together. | 08-08-2013 |
20140121566 | METHOD AND APPARATUS FOR CALCULATING AMOUNT OF EXERCISE PERFORMED - A method of calculating an amount of exercise performed includes measuring noise based on a relative difference in displacement between a skin of a user and a sensor attached to the skin of the user, and determining a number of steps taken by the user based on the measured noise. | 05-01-2014 |
20140137647 | ONE REPETITION MAXIMUM (1RM) ESTIMATING APPARATUS AND METHOD - A one repetition maximum (1RM) estimating apparatus includes a potential signal receiving unit configured to receive a potential signal of a muscle from a sensor attached to a user, and a 1RM estimating unit configured to estimate a 1RM of the user based on the potential signal. | 05-22-2014 |
20140142448 | APPARATUS AND METHODS FOR REMOTE CARDIAC DISEASE MANAGEMENT - An apparatus and method for remotely managing a disease. The apparatus includes a sensor having a first determining unit for determining whether a measured biosignal has a normal waveform, and a transmitter for transmitting the biosignal to a server when the biosignal is determined to have an abnormal waveform. | 05-22-2014 |
20140176390 | ANTENNA AND METHOD FOR MANUFACTURING ANTENNA - An antenna and a method of manufacturing the antenna are provided. The antenna may include an antenna surface, a ground plane, and an air layer comprising a porous structure. | 06-26-2014 |
20140188188 | SYSTEM AND METHOD FOR SKELETAL MUSCLE STIMULATION - A system and method for skeletal muscle stimulation is provided for increasing muscle mass by stimulating a muscle in an optimal condition through a stimulus signal from an electrical stimulation device disposed at a stimulation position. | 07-03-2014 |
20140221807 | SENSOR PLATFORM AND METHOD OF PREPARING THE SAME - Provided is a sensor platform and a method of preparing the same. The sensor platform may include a hydrogel sheet comprising a net structure; an electrolyte applied to the net structure; and a plurality of electrodes disposed on the hydrogel sheet. | 08-07-2014 |
20150102939 | WEARABLE BODY SENSOR AND SYSTEM INCLUDING THE SAME - A body sensor, a system including the body sensor and a method of transmitting a biosignal are provided. A wearable body sensor includes a conductive electrode configured to conduct a biosignal from a body, a main board comprising a radio frequency (RF) communication circuit to generate an RF signal based on the biosignal, and an antenna disposed on the RF communication circuit to radiate the RF signal. | 04-16-2015 |
20150148646 | ELECTRODE AND DEVICE FOR DETECTING BIOSIGNAL AND METHOD OF USING THE SAME - An electrode, a biosignal detecting device and a method of measuring a biosignal are provided. The electrode includes an ion conductive member configured to be attached to a body surface, a nonconductive member including a through hole and disposed on the ion conductive member, a conductive member disposed on the nonconductive member, and a nonpolarizable conductive member configured to electrically couple the ion conductive member to the conductive member. | 05-28-2015 |
20160113564 | EXERCISE MANAGING METHOD AND APPARATUS - An exercise managing method and an exercise managing apparatus are provided. The exercise managing method involves determining, with a processor, a cumulative heart rate (HR) indicating a cumulative sum of HRs of a user, analyzing an exercise performed by the user based on the cumulative HR, and providing a result of the analyzing to the user. | 04-28-2016 |
20160113575 | APPARATUS FOR DETERMINING EXERCISE CAPABILITY OF USER AND OPERATING METHOD THEREOF - An apparatus determining an exercise capability of an individual by obtaining heart rate information of the individual, detecting a characteristic point from the heart rate information, and obtaining information to be used to determine the exercise capability of the individual based on the characteristic point. | 04-28-2016 |
Patent application number | Description | Published |
20120224028 | METHOD OF FABRICATING MICROLENS, AND DEPTH SENSOR INCLUDING MICROLENS - A method of fabricating a microlens includes forming layer of photoresist on a substrate, patterning the layer of photoresist, and then reflowing the photoresist pattern. The layer of photoresist is formed by coating the substrate with liquid photoresist whose viscosity is 150 to 250 cp. A depth sensor includes a substrate and photoelectric conversion elements at an upper portion of the substrate, a metal wiring section disposed on the substrate, an array of the microlenses for focusing incident light as beams onto the photoelectric conversion elements and which beams avoid the wirings of the metal wiring section. The depths sensor also includes a layer presenting a flat upper surface on which the microlenses are formed. The layer may be a dedicated planarization layer or an IR filter, interposed between the microlenses and the metal wiring section. | 09-06-2012 |
20120268566 | THREE-DIMENSIONAL COLOR IMAGE SENSORS HAVING SPACED-APART MULTI-PIXEL COLOR REGIONS THEREIN - A three-dimensional color image sensor includes color pixels and depth pixels therein. A semiconductor substrate is provided with a depth region therein, which extends adjacent a surface of the semiconductor substrate. A two-dimensional array of spaced-apart color regions are provided within the depth region. Each of the color regions includes a plurality of different color pixels therein (e.g., red, blue and green pixels) and each of the color pixels within each of the spaced-apart color regions are spaced-apart from all other color pixels within other color regions. | 10-25-2012 |
20130010072 | SENSOR, DATA PROCESSING SYSTEM, AND OPERATING METHOD - An image sensor includes a unit pixel including a plurality of color pixels with a depth pixel. A first signal line group of first signal lines is used to supply first control signals that control operation of the plurality of color pixels, and a separate second signal line group of second signal lines is used to supply second control signals that control operation of the depth pixel. | 01-10-2013 |
20130119438 | PIXEL FOR DEPTH SENSOR AND IMAGE SENSOR INCLUDING THE PIXEL - A unit pixel of a depth sensor including a light-intensity output circuit configured to output a pixel signal according to a control signal, the pixel signal corresponding to a first electric charge and a second electric charge, a first light-intensity extraction circuit configured to generate the first electric charge and transmit the first electric charge to the light-intensity output circuit, the first electric charge varying according to an amount of light reflected from a target object and a second light-intensity extraction circuit configured to generate the second electric charge and transmit the second electric charge to the light-intensity output circuit, the second electric charge varying according to the amount of reflected light. The light-intensity output circuit includes a first floating diffusion node. Accordingly, it is possible to minimize waste of a space, thereby manufacturing a small-sized pixel. | 05-16-2013 |
20130148097 | DISTANCE MEASURING SENSOR - A distance measuring sensor includes a substrate doped with a first impurity, first and second charge storage regions spaced apart from each other in the substrate and doped with a second impurity, a photoelectric conversion region doped with the second impurity between the first and the second charge storage regions and configured to receive light to generate charges, a first dielectric layer covering the first and second charge storage regions and the photoelectric conversion region, a second dielectric layer on the first dielectric layer, and first and second transfer gates spaced apart from each other on the first dielectric layer and between the first and second charge storage regions. Each of the first and second transfer gates may cover a portion of the second dielectric layer and may be configured to selectively transfer the charges generated in the photoelectric conversion region to the first and second charge storage regions. | 06-13-2013 |
20150069244 | UNIT PIXELS, DEPTH SENSORS AND THREE-DIMENSIONAL IMAGE SENSORS INCLUDING THE SAME - A unit pixel of a depth sensor includes a light-receiver configured to perform photoelectric conversion of an incident light to output an electrical signal and at least two sensors adjacent to the light-receiver to receive the electrical signal from the light-receiver such that a line connecting the sensors forms an angle greater than zero degrees with respect to a first line, the first line passing through a center of the light-receiver in a horizontal direction. | 03-12-2015 |
Patent application number | Description | Published |
20090239158 | Method of maintaining mask for semiconductor process - A method of maintaining a mask for a semiconductor process, the method includes providing a first structure and a second structure being attached to each other via a thermosetting material, detaching the first and second structures from each other, and performing an ashing process on the first structure. | 09-24-2009 |
20100068631 | Photomask including ion trapping layer and method of manufacturing semiconductor device using the photomask - A photomask includes an ion trapping layer and a method of manufacturing a semiconductor device uses the photomask. The photomask includes a transparent substrate and an ion trapping layer formed on a first region of the transparent substrate to trap ions present near the transparent substrate. In manufacturing a semiconductor device, a photosensitive film formed on a substrate is exposed through the photomask in which the ion trapping layer is formed on the transparent substrate, and the substrate is processed using the photosensitive film obtained as the result of the exposure. | 03-18-2010 |
20110023914 | METHOD AND APPARATUS FOR CLEANING PHOTOMASK - Provided is a method and apparatus for cleaning a photomask. The photomask including a first region and a second region surrounding the first region, a pattern to be protected disposed on the first region, and a material to be removed exists on the second region. A cleaning liquid is sprayed from an inside region of the second region toward an outer region of the second region to remove the material, and a gas is blown from the first region toward the second region to protect the pattern. | 02-03-2011 |
20110297182 | METHOD OF MEGASONIC CLEANING OF AN OBJECT - A megasonic cleaning method and a megasonic cleaning apparatus are provided. Microcavitation bubbles may be formed by applying an electromotive force to a cleaning solution using a megasonic energy in a separate room from an object to be cleaned. The microcavitation bubbles having a stable oscillation among the formed microcavitation bubbles may be moved to the object to be cleaned. A surface of the object to be cleaned may be cleaned using the microcavitation bubbles having the stable oscillation. Particles attached onto the surface of the object to be cleaned may be effectively removed while preventing pattern damage. | 12-08-2011 |
20120148944 | PHOTOMASKS AND METHODS OF MANUFACTURING THE SAME - In a method of manufacturing a photomask pattern, a light-shielding layer pattern and an anti-reflective layer pattern are formed sequentially on a transparent substrate. Oxidation and nitridation processes are performed on a sidewall of the light-shielding layer pattern to form a protection layer pattern on a lateral portion of the light-shielding layer pattern. | 06-14-2012 |
20130008476 | METHOD OF MEGASONIC CLEANING OF AN OBJECT - A megasonic cleaning method and a megasonic cleaning apparatus are provided. Microcavitation bubbles may be formed by applying an electromotive force to a cleaning solution using a megasonic energy in a separate room from an object to be cleaned. The microcavitation bubbles having a stable oscillation among the formed microcavitation bubbles may be moved to the object to be cleaned. A surface of the object to be cleaned may be cleaned using the microcavitation bubbles having the stable oscillation. Particles attached onto the surface of the object to be cleaned may be effectively removed while preventing pattern damage. | 01-10-2013 |
20130186436 | APPARATUS FOR CLEANING PHOTOMASK - Provided is a method and apparatus for cleaning a photomask. The photomask including a first region and a second region surrounding the first region, a pattern to be protected disposed on the first region, and a material to be removed exists on the second region. A cleaning liquid is sprayed from an inside region of the second region toward an outer region of the second region to remove the material, and a gas is blown from the first region toward the second region to protect the pattern. | 07-25-2013 |
20150037544 | REFLECTIVE PHOTOMASK BLANK, REFLECTIVE PHOTOMASK, AND INTEGRATED CIRCUIT DEVICE MANUFACTURED BY USING REFLECTIVE PHOTOMASK - A reflective photomask blank, a reflective photomask and an integrated circuit device manufactured by using a reflective photomask, include a multi-layered reflection layer; a capping layer on the multi-layered reflection layer and including a first transition metal; a passivation film contacting at least a portion of the capping layer on a side opposite to the multi-layered reflection layer and including a second transition metal and a nitrogen (N) atom; and a light absorption pattern covering a portion of the capping layer. | 02-05-2015 |
20160109794 | PHOTOMASK AND METHOD OF FORMING THE SAME AND METHODS OF MANUFACTURING ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE PHOTOMASK - A phase shift mask includes a substrate, a second phase shift pattern on the substrate, the second phase shift pattern extending to an outermost perimeter of the substrate, the second phase shift pattern being formed of a material that is semi-transmissive to light of a first wavelength and the substrate being substantially transparent to the light of the first wavelength such that the mask transmits about 2 to about 10% of the light of the first wavelength at the second phase shift pattern, and a first phase shift pattern on the substrate, the second phase shift pattern being disposed between the outermost perimeter of the substrate and the first phase shift pattern. | 04-21-2016 |
Patent application number | Description | Published |
20100155919 | High-density multifunctional PoP-type multi-chip package structure - Provided is a high-capacity multifunctional multichip package (MCP) structure in which a multifunctional MCP capable of, for example, high-speed image processing and communications, is mounted on a high-capacity memory package capable of storing various data, e.g., moving images, pictures, or music files. The high-capacity memory package may be efficiently applied to a mass storage of a mobile device. However, an eight-stage-plus chip stacking structure should overcome yield loss during assembly and test processes. To do this, a memory package may be divided into a pair of package to form upper and lower package stacks. To physically connect the pair of packages, molding members may be installed opposite each other and fixed to each other using an adhesive member. Also, to electrically connect the pair of packages, one of the packages may be formed using a flexible PCB substrate capable of bending. The flexible PCB substrate of the one of the packages may be connected to both sides of the other of the packages, and the two packages may be thermally bonded to each other under pressure using solder balls and ball lands. | 06-24-2010 |
20110272805 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MODULE - A semiconductor package, a semiconductor device, and a semiconductor module, the semiconductor package including a substrate, the substrate having a plurality of inner pads; a semiconductor chip attached to the substrate, the semiconductor chip being electrically connected to the inner pads; a plurality of lands on the substrate, the plurality of lands being electrically connected to the inner pads; and at least one bypass interconnection on the substrate, wherein the plurality of lands includes a first land and a second land, the bypass interconnection is connected to the first land and the second land, and the first land is spaced apart from the second land by a distance of about three times or greater an average distance between adjacent lands of the plurality of lands. | 11-10-2011 |
20130009304 | CHIP-STACKED SEMICONDUCTOR PACKAGE - A chip-stacked semiconductor package including a stacked chip structure including a plurality of separate chips stacked on each other; a flexible circuit substrate having the stacked chip structure mounted on a first side of the flexible circuit substrate in a first region of the flexible circuit substrate, and being electrically connected to at least one of the plurality of separate chips of the stacked chip structure by folding a second region of the flexible circuit substrate; a sealing portion sealing the stacked chip structure and the flexible circuit substrate; and an external connecting terminal on a second side of the flexible circuit substrate. | 01-10-2013 |
20130270717 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package includes a circuit board comprising a first surface and a second surface opposite the first surface. A first semiconductor chip is stacked on the first surface and a second semiconductor chip stacked on the first semiconductor chip. A region of the second chip protrudes beyond a side of the first semiconductor chip. A support underpins the protruding region of the second chip. The support may be, for example, dry film solder resist dam. | 10-17-2013 |
20140103517 | PACKAGE SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A package substrate includes a substrate including a top surface and a bottom surface facing each other, the top surface including a first region where a semiconductor chip is mounted and a second region surrounding the first region, and a dummy post on the second region of the top surface to protrude upward from the top surface. | 04-17-2014 |
20150102507 | SEMICONDUCTOR PACKAGE - Provided is a semiconductor package that may prevent deformation of stacked semiconductor chips and minimize a semiconductor package size. The semiconductor package includes a package base substrate, a lower chip stacked on the package base substrate, an upper chip stacked on the lower chip, and a first die attach film (DAF) attached to a bottom surface of the upper chip to cover at least a portion of the lower chip. The first DAF may be a multi-layer film including a first attaching layer contacting the bottom surface of the upper chip and a second attaching layer attached to a bottom of the first attaching layer to cover at least a portion of a side surface of the lower chip. | 04-16-2015 |
Patent application number | Description | Published |
20130278134 | WHITE LIGHT EMITTING DEVICE AND DISPLAY APPARATUS - A white light emitting device includes: a blue light emitting diode (LED) which emits blue light; and a resin packing unit which encapsulates the blue LED, wherein the resin packing unit includes a first wavelength conversion material which, in response to being excited by the blue light, emits green light, a second wavelength conversion material which, in response to being excited by the blue light, emits red light, and a complex compound which absorbs light of a region in which the green light and the red light are mixed, the light of the region being included in white light implemented through a mixture of the green light and the red light excited together with the blue light. | 10-24-2013 |
20140213003 | GAN TYPE LIGHT EMITTING DIODE DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a GaN type LED device and a method of manufacturing the same. More particularly, there are provided a GaN type LED device including an LED chip; and a submount eutectic-bonded with the LED chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form. Further, the present invention provides a method of manufacturing the GaN type LED device. | 07-31-2014 |
20150085529 | WHITE LIGHT EMITTING DEVICE AND DISPLAY APPARATUS - A white light emitting device includes: a blue light emitting diode (LED) which emits blue light; and a resin packing unit which encapsulates the blue LED, wherein the resin packing unit includes a first wavelength conversion material which, in response to being excited by the blue light, emits green light, a second wavelength conversion material which, in response to being excited by the blue light, emits red light, and a complex compound which absorbs light of a region in which the green light and the red light are mixed, the light of the region being included in white light implemented through a mixture of the green light and the red light excited together with the blue light. | 03-26-2015 |
Patent application number | Description | Published |
20130109148 | METHODS OF FORMING A PATTERN AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME | 05-02-2013 |
20130224929 | METHOD OF FORMING A CONTACT AND METHOD OF MANUFACTURING A PHASE CHANGE MEMORY DEVICE USING THE SAME - Provided are a method of forming a contact and a method of manufacturing a phase change memory device using the same. The method of forming a contact includes forming on a substrate an insulating layer pattern having first sidewalls extending in a first direction and second sidewalls extending in a second direction perpendicular to the first direction and which together delimit contact holes, forming semiconductor patterns in lower parts of the contact holes, forming isolation spacers on the semiconductor pattern and side surfaces of the first sidewalls to expose portions of the semiconductor patterns, and etching the exposed portions of the semiconductor patterns using the isolation spacers as a mask to divide the semiconductor patterns into a plurality of finer semiconductor patterns. | 08-29-2013 |
20130234090 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a first semiconductor layer extending in a first direction on a substrate, a plurality of second semiconductor layers spaced apart in the first direction on the first semiconductor layer, and an insulation layer structure surrounding side walls of the first semiconductor layer and the plurality of second semiconductor layers. The first semiconductor layer may have a first conductivity type, and the plurality of second semiconductor layers may have a second conductivity type. | 09-12-2013 |
20130234279 | SEMICONDUCTOR DEVICE WITH BURIED WORD LINE STRUCTURES AND METHOD OF MANUFACTURING THE SAME - A semiconductor device with buried word line structures and methods of forming the semiconductor device are provided. The semiconductor device includes a plurality of insulating line patterns extending in a direction in a substrate, a plurality of word lines alternately with ones of the plurality of insulating line patterns, the plurality of word lines extending in the direction and comprising a metal, a plurality of first doped regions on respective ones of the plurality of the word lines and between two adjacent ones of the plurality of insulating line patterns, an interlayer insulating film on the plurality of insulating line patterns and the plurality of first doped regions, the interlayer insulating film including a plurality of openings exposing upper surfaces of ones of the plurality of first doped regions and a plurality of second doped regions contacting respective ones of the plurality of first doped regions within the openings. | 09-12-2013 |
20160020249 | MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME - An MRAM device comprises an insulating interlayer comprising a flat first upper surface on a first region and a second region of a substrate. A pattern structure comprising pillar-shaped magnetic tunnel junction (MTJ) structures and a filling layer pattern between the MTJ structures is formed on the insulating interlayer of the first region. The pattern structure comprises a flat second upper surface that is higher than the first upper surface. Bit lines are formed on the pattern structure that contact top surfaces of the MTJ structures. An etch-stop layer is formed on the pattern structure between the bit lines of the first region and the first upper surface of the first insulating interlayer of the second region. A first portion of an upper surface of the etch-stop layer on the first region is higher than a second portion of the upper surface of the etch-stop layer on the second region. | 01-21-2016 |
Patent application number | Description | Published |
20120152887 | Method Of Manufacturing Nanoimprint Stamp - Methods of manufacturing a nanoimprint stamp are provided. The method may include forming a pattern on a surface of a master substrate, depositing an etch barrier layer on a surface of a stamp substrate, coating a photoresist on one of the surfaces of the master substrate and the stamp substrate on which an etch barrier layer is formed, forming a photoresist pattern by pressing the master substrate against the stamp substrate, forming a hard mask by etching the etch barrier layer using the photoresist pattern, and etching the stamp substrate using the hard mask as an etch mask. | 06-21-2012 |
20120168404 | METHODS OF FABRICATING NANOIMPRINT STAMP - A method of fabricating a nanoimprint stamp includes forming a resist pattern having a nano size width on a stamp substrate by performing imprint processes repeatedly. In the imprint processes, resist layers that are selectively etched are sequentially used. The stamp substrate is etched using the resist pattern as an etch mask. | 07-05-2012 |
20130042779 | STAMP, METHOD OF MANUFACTURING THE SAME, AND IMPRINTING METHOD USING THE STAMP - A stamp includes at least one protrusion on a protrusion pattern, and an end portion of the at least one protrusion may have a non-planarized surface. The end portion of the protrusion may have a concave structure, that is, the end portion includes a center region and an edge region, and the edge region is higher than the center region. | 02-21-2013 |
20130147096 | Imprinting Stamp And Nano-Imprinting Method Using The Same - An imprinting stamp and a nano-imprinting method using the imprinting stamp are provided. The imprinting stamp includes a first substrate; one or more field regions on the first substrate, the first substrate including nano-patterns; and a first dummy pattern region on the first substrate and adjacent to the field region, the dummy pattern region including first dummy patterns having greater dimensions than that of the nano-patterns, the first dummy patterns being a plurality of polygons, each of the polygons having a vertex pointing in a first direction proceeding from the field region toward the first dummy pattern region. | 06-13-2013 |
20130187309 | STAMP, METHOD OF FABRICATING THE STAMP, AND IMPRINT METHOD USING THE SAME - A stamp includes a transparent body having an inner chamber containing an inlet/outlet tube configured to have a fluid injected and removed therefrom. | 07-25-2013 |
20130292865 | TEMPLATE SYSTEM AND NANO-IMPRINT METHOD USING THE SAME - A template system, and a nano-imprint method using the same, include a template having a nano-pattern and configured to transfer the nano-pattern to a resin material on a substrate, and a pressure controlling apparatus configured to change a pressure of the template with respect to the substrate according to an intensity of bubbles captured between the substrate and the template. | 11-07-2013 |
20140054264 | METHOD OF MANUFACTURING NANOIMPRINT STAMP - Methods of manufacturing a nanoimprint stamp are provided. The method may include forming a pattern on a surface of a master substrate, depositing an etch barrier layer on a surface of a stamp substrate, coating a photoresist on one of the surfaces of the master substrate and the stamp substrate on which an etch barrier layer is formed, forming a photoresist pattern by pressing the master substrate against the stamp substrate, forming a hard mask by etching the etch barrier layer using the photoresist pattern, and etching the stamp substrate using the hard mask as an etch mask. | 02-27-2014 |
20140158662 | NANOIMPRINT STAMP HAVING ALIGNMENT MARK AND METHOD OF FABRICATING THE SAME - A nanoimprint stamp having an alignment mark includes a transparent substrate having a plurality of convex portions, and a semitransparent layer on each of the plurality of convex portions. The semitransparent layer has a transmittance of about 20% to about 80% with respect to ultraviolet rays. | 06-12-2014 |
20150144918 | METHOD OF MANUFACTURING OPTICAL FILM FOR REDUCING COLOR SHIFT, ORGANIC LIGHT-EMITTING DISPLAY APPARATUS USING OPTICAL FILM FOR REDUCING COLOR SHIFT, AND METHOD OF MANUFACTURING THE SAME - An optical film manufacturing method includes forming a master in which a shape corresponding to a plurality of micro-lens patterns is engraved, forming a low refractive index pattern layer in which the plurality of micro-lens patterns are formed, by using the master, forming a high refractive index material layer that has a higher refractive index than a refractive index of the low refractive index pattern layer, and imprinting the low refractive index pattern layer on the high refractive index material layer to form a high refractive index pattern layer, on a first surface of a substrate. | 05-28-2015 |
Patent application number | Description | Published |
20120257768 | NOISE REMOVAL METHOD AND SYSTEM - A method and system for removing noise due to bias electric power (MIC_Bias) or Time Division Multiple Access (TDMA) noise are provided. The system includes an interface with a microphone contact, for connecting to an accessory, an Analog-to-Digital (AD) converter for converting an analog voltage level, input via the microphone contact, into a digital voltage level, an audio processing unit for processing an audio signal input via the microphone contact, a switch for at least one of connecting and disconnecting the microphone contact and the AD converter, and a controller. The controller compares the digital voltage level with voltage levels stored in a look up table. The controller identifies a type of accessory connected to the interface. The controller also switches off the switch to prevent noise from being introduced into the audio signal via a wire connecting the microphone contact and the AD converter. | 10-11-2012 |
20130012274 | SECOND MICROPHONE DEVICE OF A MOBILE TERMINAL - A second microphone device of a mobile terminal, and more particularly, a second microphone device of a mobile terminal for preventing various limitations caused by mounting of a second microphone, is provided. The second microphone device includes an ear jack connector having an insertion space, a microphone hole connected at one end to the insertion space, and a second microphone connected at the other end of the microphone hole, thereby improving ambient noise removal performance of the mobile terminal without adversely affecting its appearance. | 01-10-2013 |
20150244845 | SECOND MICROPHONE DEVICE OF A MOBILE TERMINAL - A second microphone device of a mobile terminal, and more particularly, a second microphone device of a mobile terminal for preventing various limitations caused by mounting of a second microphone, is provided. The second microphone device includes an ear jack connector having an insertion space, a microphone hole connected at one end to the insertion space, and a second microphone connected at the other end of the microphone hole, thereby improving ambient noise removal performance of the mobile terminal without adversely affecting its appearance. | 08-27-2015 |