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Ko, Hwaseong-Si

Byung-Hoon Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20110021932BLOOD VESSEL PRESSING CUFF, BLOOD PRESSURE MEASURING APPARATUS INCLUDING THE BLOOD VESSEL PRESSING CUFF, AND BLOOD PRESSURE MEASURING METHOD USING THE BLOOD PRESSURE MEASURING APPARATUS - A blood vessel pressing cuff includes a strap surrounding a body part, a first actuator disposed on the strap and including a first shape memory alloy which changes to a first shape memorized in advance, at a temperature equal to or higher than a first temperature, and a second actuator disposed on the strap and including a second shape memory alloy which changes to a second shape memorized in advance, at a temperature equal to or higher than a second temperature that is different from the first temperature. If the first shape memory alloy changes to the first shape, pressure applied to the body part surrounded by the strap is increased. Even when the first shape memory alloy changes to the first shape, if the second shape memory alloy changes to the second shape, the pressure applied to the body part surrounded by the strap is reduced.01-27-2011

Chun-Seok Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20090268112DISPLAY APPARATUS WITH TRANSISTORS CONNECTED TO SUB-PIXEL ELECTRODES - A display apparatus includes a plurality of pixel regions. Each of the pixel regions includes a first sub-pixel region, a second sub-pixel region and a boost capacitor. The first sub-pixel region and the second sub-pixel region are electrically connected to the boost capacitor. The boost capacitor causes voltages the first and second sub-pixel regions to be at different voltages to increase the viewing angle of the display apparatus. One electrode of the boost capacitor, a coupling electrode, is formed over a storage capacitance line made of an opaque metal such that an additional boost capacitor (Cboost) may be formed without decreasing the aperture ratio of the pixel region. Other features are also provided.10-29-2009
20100123713DISPLAY DEVICE AND DRIVING METHOD THEREOF - A display device includes a first pixel and a second pixel. The first pixel and the second pixel are defined by a first gate bus line, a second gate bus line, a first power supply line and a second power supply line. A data bus line between the first supply line and the second supply line divides the first pixel from the second pixel line. Accordingly, the pixel shares a data bus line or a power supply line with adjacent pixel. Advantageously, thereby, more space between lines prevents defects caused during fabricating the display device and improve a reliability of the display device.05-20-2010

Patent applications by Chun-Seok Ko, Hwaseong-Si KR

Han-Bong Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20090206318Nonvolatile memory device and method of manufacturing the same - A nonvolatile memory device, including a lower electrode on a semiconductor substrate, a phase change material pattern on the lower electrode, an adhesion pattern on the phase change material pattern and an upper electrode on the adhesion pattern, wherein the adhesion pattern includes a conductor including nitrogen.08-20-2009

Hyun Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20090152924Headrest for Vehicle - The present invention discloses a headrest for a vehicle which is constructed in such a way that a headrest boy 06-18-2009
20100133857Apparatus for Locking Table of Seat Back - An apparatus for locking a table of a seat back to selectively secure the table in multiple stages, may include a base, a shaft coupled to the base and the table, an actuating arm fastened to the shaft and rotatable with the shaft, the actuating arm having actuating gear teeth, a locking arm rotatably provided on the base, wherein the locking arm includes locking gear teeth and the locking gear teeth is selectively engaged with the actuating gear teeth by the actuating arm such that when the actuating arm is rotated in a forward direction, the actuating gear teeth is engaged with the locking gear teeth or pass over the locking gear teeth according to rotational degree of the actuating arm, and a locking arm holding unit co-axially coupled with the actuating arm to the base and selectively activated by the actuating arm.06-03-2010

Hyung-Ho Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20090239158Method of maintaining mask for semiconductor process - A method of maintaining a mask for a semiconductor process, the method includes providing a first structure and a second structure being attached to each other via a thermosetting material, detaching the first and second structures from each other, and performing an ashing process on the first structure.09-24-2009
20100068631Photomask including ion trapping layer and method of manufacturing semiconductor device using the photomask - A photomask includes an ion trapping layer and a method of manufacturing a semiconductor device uses the photomask. The photomask includes a transparent substrate and an ion trapping layer formed on a first region of the transparent substrate to trap ions present near the transparent substrate. In manufacturing a semiconductor device, a photosensitive film formed on a substrate is exposed through the photomask in which the ion trapping layer is formed on the transparent substrate, and the substrate is processed using the photosensitive film obtained as the result of the exposure.03-18-2010
20110023914METHOD AND APPARATUS FOR CLEANING PHOTOMASK - Provided is a method and apparatus for cleaning a photomask. The photomask including a first region and a second region surrounding the first region, a pattern to be protected disposed on the first region, and a material to be removed exists on the second region. A cleaning liquid is sprayed from an inside region of the second region toward an outer region of the second region to remove the material, and a gas is blown from the first region toward the second region to protect the pattern.02-03-2011

Patent applications by Hyung-Ho Ko, Hwaseong-Si KR

Jae-Hyok Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20100214705Electrostatic discharge protection element and electrostatic discharge protection circuit including the same - An electrostatic discharge (ESD) protection element includes a first diode, a second diode, and a poly resistor. The first diode is connected between a first voltage and an input/output (I/O) pad. The second diode is connected between the I/O pad and a second voltage. The poly resistor is formed on the second diode.08-26-2010

Ji-Han Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20100155919High-density multifunctional PoP-type multi-chip package structure - Provided is a high-capacity multifunctional multichip package (MCP) structure in which a multifunctional MCP capable of, for example, high-speed image processing and communications, is mounted on a high-capacity memory package capable of storing various data, e.g., moving images, pictures, or music files. The high-capacity memory package may be efficiently applied to a mass storage of a mobile device. However, an eight-stage-plus chip stacking structure should overcome yield loss during assembly and test processes. To do this, a memory package may be divided into a pair of package to form upper and lower package stacks. To physically connect the pair of packages, molding members may be installed opposite each other and fixed to each other using an adhesive member. Also, to electrically connect the pair of packages, one of the packages may be formed using a flexible PCB substrate capable of bending. The flexible PCB substrate of the one of the packages may be connected to both sides of the other of the packages, and the two packages may be thermally bonded to each other under pressure using solder balls and ball lands.06-24-2010

Jong-Woo Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20090189141Phase change memory device and method of forming the same - A phase change memory device and a method of forming the same include a conductive pattern formed on a substrate. A lower electrode contact is disposed on the conductive pattern. The phase change pattern is disposed on the lower electrode contact. An upper electrode is disposed on the phase change pattern. An area of an upper surface of the lower electrode contact is smaller than an area of a lower surface of the lower electrode contact.07-30-2009

Kwang Min Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20110080752SIDE-ILLUMINATING PROJECTION LAMP AND HEADLIGHT HAVING THE SAME - A side-illuminating projection lens and a headlight having the same, in which a side-illuminating lamp is implemented with a projection lamp that illuminates to the side of a vehicle by radiating light in the radial direction, wherein sideways-radiated light is projected in the radial direction and is thus smoothly combined with forward-radiated light, thereby improving the driver's vision.04-07-2011

Min-Chang Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20100214705Electrostatic discharge protection element and electrostatic discharge protection circuit including the same - An electrostatic discharge (ESD) protection element includes a first diode, a second diode, and a poly resistor. The first diode is connected between a first voltage and an input/output (I/O) pad. The second diode is connected between the I/O pad and a second voltage. The poly resistor is formed on the second diode.08-26-2010

Seung-Bum Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20100226187Semiconductor memory device - A semiconductor memory device includes a memory cell array having a plurality of memory cells coupled between a plurality of word lines and a plurality of bit line pairs, a bit line selection circuit configured to transmit data between a selected bit line pair and a local input/output line pair in response to a column selection signal, a local global input/output gate circuit configured to transmit data between the local input/output line pair and a global input/output line pair in response to a local global input/output selection signal, and a controller configured to drive the word lines, output the column selection signal having a first voltage level to the bit line selection circuit, and output the local global input/output selection signal having a second voltage level that is lower than the first voltage level to the local global input/output gate circuit, in response to an external address signal and an external command.09-09-2010

Patent applications by Seung-Bum Ko, Hwaseong-Si KR

Tae-Hwan Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20100172262APPARATUS AND METHOD FOR DELAY TIME COMPUTATION AND DELAY COMPENSATION BETWEEN BASE STATION AND REMOTE RADIO FREQUENCY UNIT IN BROADBAND WIRELESS ACCESS SYSTEM - An apparatus and method for delay time computation and delay compensation between a Base Station (BS) and a remote Radio Frequency (RF) unit in a broadband wireless access system are provided. In a method of operating an apparatus for determining a delay time to compensate for delay between a BS modem card and a remote RF unit in a wireless access system, the method includes determining a process delay time required when traffic data is output from the BS modem card to an antenna of the remote RF unit in a state where a reference cable having a length short enough to neglect a cable delay time is connected between the BS modem card and the remote RF unit, determining a cable delay time required when a sync pulse signal is transmitted through a cable used in actual system operation between the BS modem card and the remote RF unit, and determining a time for outputting traffic data at an earlier time from a modem included in the BS modem card by using the determined process delay time and cable delay time.07-08-2010

Yong-Ho Ko, Hwaseong-Si KR

Patent application numberDescriptionPublished
20080237314Method of joining electronic package capable of prevention for brittle fracture - Disclosed is a method of joining electronic package parts, comprising the steps of: reflowing lead-free solders containing alloy elements on top of each of the electronic package parts having a surface treated with copper or nickel; and mounting the surface treated electronic parts on the lead-free solders then reflowing the lead-free solders to generate intermetallic compound between the lead-free solders and the surface treated portion of each of the electronic parts.10-02-2008