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Ko, Hsinchu
Cheng-Ta Ko, Hsinchu TW
Chih-Chang Ko, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20120099869 | Optical LNB capable of fast position-adjusting - An optical LNB capable of fast position-adjusting is employed in an LNBF. The optical LNB includes a down-converting device coupled to an OMT of the LNBF for down-converting a polarized signal for generating a first intermediate frequency signal, a branching device for branching the first intermediate frequency signal for generating a second and a third intermediate frequency signals, an electrical/optical converting device coupled to the branching device for converting the second intermediate frequency signal into an optical signal, and a power end for receiving power from a power supply and outputting the third intermediate frequency signal. | 04-26-2012 |
Chun-Ming Ko, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20110024326 | IC PACKAGE TRAY EMBEDDED RFID - A carrier tray as described herein includes a container having pockets for holding electrical components such as integrated circuits during manufacturing, and a device coupled to the container for tracking usage of the carrier tray into and out of process chambers used for performing particular processes on the electrical components carried therein. Stations and methods of using the carrier tray are also described herein. | 02-03-2011 |
Hsuan-Chung Ko, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090153162 | Sharing conversion board for testing chips - The invention relates to a device interface board for testing chips, which is cooperatively installed with one of a plurality of probe cards. Each of the plurality of probe cards is provided with a specified wiring area and a first public signal area, the specified wiring area being electrically connected with the first public signal area. The first public signal area of each of the plurality of probe cards is located in a same particular area, and the specified wiring area of each of the plurality of probe cards is electrically connected with a testing jig and is different depending on a different testing jig. The device interface board comprises a chip test area and a second public signal area, in which the chip test area is used to carry a chip under test and is electrically connected with the second public signal area, whereby, through electrical connection between the device interface board and the first public signal area of each of the plurality of probe cards, test signals are transferred between the testing jig and the chip under test, and testing of chips under test having the same model are accomplished between different testing jigs. | 06-18-2009 |
Kuan-Chou Ko, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090103057 | AUTOMATIC IRIS DIAPHRAGM MODULE - An automatic iris diaphragm module is adapted to a projector having a casing, and is capable of adjusting a size of luminous flux of a light source of the projector. The automatic iris diaphragm module is provided with a chassis, a fixed mask, a movable mask, a drive rack, and a motor. The chassis is fixed on the casing. The fixed mask is fixed on the chassis and has an opening. The movable mask is slidably disposed on the fixed mask. The drive rack is fixed on the movable mask. The motor is fixed on the chassis and has a driving gear engaging with the drive rack for driving the drive rack to make the movable mask slide relative to the fixed mask, for adjusting the size of the luminous flux of the light source through the opening. | 04-23-2009 |
Ting-Chia Ko, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090162960 | Method for manufacturing high efficiency light-emitting diodes - A method for manufacturing a light-emitting device comprising the steps of cutting a light-emitting unit by a laser beam, and cleaning the light-emitting unit by an acid solution to remove by-products resulted from the laser cutting. | 06-25-2009 |
| 20110281383 | METHOD FOR MANUFACTURING HIGH EFFICIENCY LIGHT-EMITTING DIODES - A method for manufacturing a light-emitting device comprising the steps of: providing a substrate comprising a first surface and a second surface; forming a plurality of cutting lines on the substrate by a laser beam; cleaning the substrate by a chemical solution; and forming a light-emitting stack on an first surface of the substrate after cleaning the substrate. | 11-17-2011 |
| 20120068214 | OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optoelectronic device is provided that includes a substrate having a surface and a normal direction perpendicular to the surface, a first semiconductor layer formed on the surface, and at least one hollow component formed between the first semiconductor layer and the surface. A method of fabricating an optoelectronic device is also provided that includes providing a substrate having a surface and a normal direction perpendicular to the surface, forming a first semiconductor layer on the surface, patterning the first semiconductor layer, forming a second semiconductor layer on the substrate and cover the patterned first semiconductor layer, and forming at least one hollow component formed between the first semiconductor layer and the surface. A height of the hollow component varies along with a first direction perpendicular to the normal direction and/or a width of the hollow component varies along with a second direction parallel with the normal direction. | 03-22-2012 |
Ting-Chu Ko, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090004851 | SALICIDATION PROCESS USING ELECTROLESS PLATING TO DEPOSIT METAL AND INTRODUCE DOPANT IMPURITIES - A selective electroless plating operation provides for the selective deposition of a metal film only on exposed silicon surfaces of a semiconductor substrate and not on other surfaces such as dielectric surfaces. The plating solution includes metal ions and advantageously also includes dopant impurity ions. The pure metal or metal alloy film formed on the exposed silicon surfaces is then heat treated to form a metal silicide on the exposed silicon surfaces and to drive the dopant impurities to the interface formed between the exposed silicon surfaces and the metal silicide film. | 01-01-2009 |
| 20090191684 | Novel Approach to Reduce the Contact Resistance - A method for fabricating a semiconductor device is disclosed. First, a semiconductor substrate having a doped region(s) is provided. Thereafter, a pre-amorphous implantation process and neutral (or non-neutral) species implantation process is performed over the doped region(s) of the semiconductor substrate. Subsequently, a silicide is formed in the doped region(s). By conducting a pre-amorphous implantation combined with a neutral species implantation, the present invention reduces the contact resistance, such as at the contact area silicide and source/drain substrate interface. | 07-30-2009 |
Tsung-Hsi Ko, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20080239120 | IMAGE-SENSING MODULE AND MANUFACTURING METHOD THEREOF, AND IMAGE CAPTURE APPARATUS - An image-sensing module is provided. The image-sensing module includes a substrate, a plurality of image-sensing units, a plurality of micro lenses and a focusing unit. The image-sensing units are disposed on the substrate and the micro lenses are respectively disposed on one of the image-sensing units. The focusing unit is disposed on the substrate and covers the micro lenses. A top surface of the focusing unit is a curved surface. Furthermore, a method of manufacturing the image-sensing module and an image capture apparatus are provided. | 10-02-2008 |
| 20090305451 | MANUFACTURING METHOD OF WAFER LEVEL CHIP SCALE PACAKGE OF IMAGE-SENSING MODULE - A manufacturing method of a wafer level chip scale package of an image-sensing module is provided. The method includes providing. a wafer having a plurality of die regions, and a plurality of sensing units is formed on a surface of the wafer in each die region. A plurality of lens units is formed on the sensing units, wherein each lens unit includes a lens and an edge wall that are integrally formed. A light-shielding film is also formed on a surface of at least one edge wall of at least one lens units. A dicing process is then performed on the wafer to form a plurality of image sensor chips. | 12-10-2009 |
Tsun-Kai Ko, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090162960 | Method for manufacturing high efficiency light-emitting diodes - A method for manufacturing a light-emitting device comprising the steps of cutting a light-emitting unit by a laser beam, and cleaning the light-emitting unit by an acid solution to remove by-products resulted from the laser cutting. | 06-25-2009 |
| 20110281383 | METHOD FOR MANUFACTURING HIGH EFFICIENCY LIGHT-EMITTING DIODES - A method for manufacturing a light-emitting device comprising the steps of: providing a substrate comprising a first surface and a second surface; forming a plurality of cutting lines on the substrate by a laser beam; cleaning the substrate by a chemical solution; and forming a light-emitting stack on an first surface of the substrate after cleaning the substrate. | 11-17-2011 |
| 20120068214 | OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optoelectronic device is provided that includes a substrate having a surface and a normal direction perpendicular to the surface, a first semiconductor layer formed on the surface, and at least one hollow component formed between the first semiconductor layer and the surface. A method of fabricating an optoelectronic device is also provided that includes providing a substrate having a surface and a normal direction perpendicular to the surface, forming a first semiconductor layer on the surface, patterning the first semiconductor layer, forming a second semiconductor layer on the substrate and cover the patterned first semiconductor layer, and forming at least one hollow component formed between the first semiconductor layer and the surface. A height of the hollow component varies along with a first direction perpendicular to the normal direction and/or a width of the hollow component varies along with a second direction parallel with the normal direction. | 03-22-2012 |
Tung Yi Ko, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20090168389 | HIGH FREQUENCY COMMUNICATION APPARATUS AND WATERPROOF STRUCTURE THEREOF AND MANUFACTURING METHOD FOR WATERPROOF STRUCTURE - A waterproof structure of a high frequency communication apparatus accommodates a waveguide, the waveguide comprising a waveguide channel and an extending portion connected to the waveguide channel. The waterproof structure comprises a case body and a case cover. The case cover bonds with the case body to form an inner space accommodating the waveguide and an opening through which the extending portion penetrates outwards. The case body and the case cover are bonded by glue, and the extending portion and the case body and the case cover around the opening are bonded by glue, thereby preventing moisture incursion. | 07-02-2009 |
| 20100026423 | WAVEGUIDE - A waveguide includes a first waveguide member and a second waveguide member. The second waveguide member is combined with the first waveguide member to form a through hole. The first waveguide member includes a first shell and two first wing portions connected to the first shell, and the two first wing portions form a first plane. The second waveguide member includes a second shell and two second wing portions connected to the second shell, and the two second wing portions form a second plane. Bulged strips are formed at the inner rims of the second plane neighboring the through hole and extend along a longitudinal direction of the through hole, and the bulged strips protrude the second plane. | 02-04-2010 |
| 20100039186 | ADJUSTABLE ASSEMBLY APPARATUS OF WAVEGUIDE MULTIPLEXER AND WAVEGUIDE PHASE SHIFTER - An adjustable assembly apparatus includes a waveguide phase shifter and a waveguide multiplexer. The waveguide phase shifter has a first flange structure and the waveguide multiplexer has a second flange structure. The second flange structure and the first flange structure are embedded, and the polarization directions of the waveguide phase shifter and the waveguide multiplexer are orthogonal. In an embodiment, the first flange structure includes a bulge, the second flange structure includes a recess, and the bulge is embedded in the recess. The polarization directions of the bulge of the waveguide phase shifter and the recess of the waveguide multiplexer differ by 90 degrees. | 02-18-2010 |
| 20100061690 | WATERPROOF COMMUNICATION APPARATUS - A waterproof communication apparatus comprises a core assembly having at least one seam, configured to transmit an electromagnetic wave; and a seamless enclosure enclosing the core assembly, configured to prevent the ingress of atmospheric moisture through the at least one seam into the inside of the core assembly. In one embodiment, the core assembly and the enclosure are made of metallic materials, and a metallurgical bond is formed between the core assembly and the enclosure. | 03-11-2010 |
| 20100109820 | WATERPROOF COMMUNICATION APPARATUS - A waterproof communication apparatus comprises a core part and an external part. The core part is a combination having at least one seam, and is used to transmit electromagnetic waves. The external part covers the core part to prevent environmental moisture from entering the inside of the communication apparatus through the seam. A pair of engaging parts having complementary shapes is equipped with the seam of the combination so as to further prevent the molten material of the external part from entering the inside of the communication apparatus during the manufacturing process. In another embodiment, the core part and external part are made of metals and are combined by a metallurgic method. | 05-06-2010 |
Yi-Hsien Ko, Hsinchu TW
| Patent application number | Description | Published |
|---|---|---|
| 20100156820 | Variable Size Sensing System and Method for Redefining Size of Sensing Area thereof - In a variable size sensing system and a method for redefining the size of a sensing area thereof, the sensing system includes four elements, a mark and two image sensing devices. The four elements are consecutively connected and thereby forming a frame. Two of the four elements have variable lengths so as to adjust the size of the frame. The inner edge of the frame defines a sensing area of a parallelogram shape. The sensing system has a first and a second working mode. The sensing area has a first size and a second size when the sensing system is in the first working mode and the second working mode respectively, wherein the first size is predetermined and smaller than the second size. The mark is used to mark a fixed length. When the sensing system is changed from the first working mode to the second working mode, the mark sensed by the image sensing devices can be utilized to redefine the size of the sensing area in the sensing system. | 06-24-2010 |
| 20100171694 | Electronic Apparatus with Virtual Data Input Device - An electronic apparatus with a virtual data input device includes a first body, a second body, a sensing plane, an image sensing module and a processor. A display is disposed on the second body. The sensing plane is disposed on the first body and configured for generating an initiating signal when a user presses the sensing plane. The image sensing module is disposed on the second body and configured for sensing the pressing action on the sensing plane by the user and generating an image signal that carries the information of the pressed position on the sensing plane. The processor is electrically connected with the sensing plane and the image sensing module, and configured for processing the image signal after the initiating signal is generated so that data corresponding to the pressing action of the user is input to the electronic apparatus. | 07-08-2010 |
| 20110001727 | Optical Touch Display - An optical touch display includes a display panel, a light source module, and a sensing module. The display panel has a first edge, a second edge, a third edge and a fourth edge. The light source module is disposed beside the first edge and the second edge of the display panel. The light source module is configure for providing a first parallel light and a second parallel light passing through above a display surface of the display panel. The first parallel light passes from the first edge of the display panel through the third edge of the display panel, and the second parallel light passes from the second edge of the display panel through the fourth edge of the display panel. The sensing module is disposed beside the third edge and the fourth edge of the display panel for sensing the first parallel light and the second parallel light. The optical touch display has advantageous of high reliability and low cost. | 01-06-2011 |