| Patent application number | Description | Published |
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| 20120080790 | APPARATUS AND METHOD FOR UNIFORM METAL PLATING - Apparatus and methods for uniform metal plating onto a semiconductor wafer, such as GaAs wafer, are disclosed. One such apparatus can include an anode and a showerhead body. The anode can include an anode post and a showerhead anode plate. The showerhead anode plate can include holes sized to dispense a particular plating solution, such as plating solution that includes gold, onto a wafer. The showerhead body can be coupled to the anode post and the showerhead anode plate. The showerhead body can be configured to create a seal sufficient to substantially prevent a reduction of pressure in the plating solution flowing from the anode post to holes of the showerhead anode plate. | 04-05-2012 |
| 20120083050 | DETECTING A DEPOSITION CONDITION - Apparatus and methods for detecting evaporation conditions in an evaporator for evaporating metal onto semiconductor wafers, such as GaAs wafers, are disclosed. One such apparatus can include a crystal monitor sensor configured to detect metal vapor associated with a metal source prior to metal deposition onto a semiconductor wafer. This apparatus can also include a shutter configured to remain in a closed position when the crystal monitor sensor detects an undesired condition, so as to prevent metal deposition onto the semiconductor wafer. In some implementations, the undesired condition can be indicative of a composition of a metal source, a deposition rate of a metal source, impurities of a metal source, position of a metal source, position of an electron beam, and/or intensity of an electron beam. | 04-05-2012 |
| 20120083118 | METHODS OF EVAPORATING METAL ONTO A SEMICONDUCTOR WAFER IN A TEST WAFER HOLDER - Apparatus and methods for evaporating metal onto semiconductor wafers are disclosed. One such apparatus can include an evaporation chamber that includes a wafer holder, such as a dome, and a test wafer holder that is separate and spaced apart from the wafer holder. In certain implementations, the test wafer can be coupled to a cross beam supporting at least one shaper. A metal can be evaporated onto production wafers positioned in the wafer holder while metal is evaporated on a test wafer positioned in a test wafer holder. In some instances, the production wafers can be GaAs wafers. The test wafer can be used to make a quality assessment about the production wafers. | 04-05-2012 |
| Patent application number | Description | Published |
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| 20090277165 | DEVICE FOR COOLING A GAS FLOW OF AN INTERNAL COMBUSTION ENGINE - A device for cooling a gas flow of an internal combustion engine comprises a housing, an inlet and an outlet for a gas of the internal combustion engine which is to be cooled, an inlet and an outlet for a liquid coolant, an exchanger means for heat transfer between the gas and the coolant, a first wall section of the housing, wherein the first wall section is arranged between the coolant and the gas flow, and a second wall section of the housing, wherein the second wall section is arranged between the coolant and the atmosphere, wherein the first wall section and the second wall section are integrally formed in one piece. | 11-12-2009 |
| 20110247320 | DEVICE FOR REDUCING CORROSIVE CONSTITUENTS IN AN EXHAUST GAS CONDENSATE OF AN INTERNAL COMBUSTION ENGINE - A device for reducing corrosive constituents in an exhaust gas condensate of an internal combustion engine is provided, in which the exhaust gas of the internal combustion engine is recirculated to the internal combustion engine via an exhaust gas recirculation system having an exhaust gas cooler and at least one exhaust gas recirculation line. To protect the exhaust gas recirculation system along with intake air components and the internal combustion engine from the corrosive effects of the exhaust gas condensate, the exhaust gas recirculation system has at least one neutralization unit for neutralizing the corrosive constituents of the exhaust gas condensate, which is connected to at least one component arranged downstream, through which the exhaust gas, which has been freed of nearly all corrosive constituents, flows. | 10-13-2011 |
