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Knauss
Daniel Knauss, Madison, WI US
| Patent application number | Description | Published |
|---|---|---|
| 20090098548 | MODULATORS OF ENZYMATIC NUCLEIC ACID ELEMENTS MOBILIZATION - The present invention discloses a nucleic acid cleavage assay for members of the transposase/integrase superfamily. A method of using the assay to screen for modulators of the nucleic acid cleavage activity is also disclosed. The present invention further provides a method for screening for modulators of binding of a transposase/integrase to its corresponding recognition sequence. In addition, the present invention provides a method of identifying a modulator for a particular transposase/integrase such as HIV integrase based on modulators of other members of the transposase/integrase superfamily. Also disclosed are Tn5 transposase inhibitors and HIV integration inhibitors. | 04-16-2009 |
Joseph R. Knauss, Boca Raton, FL US
| Patent application number | Description | Published |
|---|---|---|
| 20110272390 | ENERGY SAVING FOOD FINISHING APPLIANCE AND METHOD - A new style commercial salamander/cheese melter that will normally be off until product is placed under a gas burner, a heating time is selected and a start button is pressed. The burner lights, heats to infrared within 5 seconds (fast heat up), melts cheese or finishes a dish quickly, and then shuts off completely when a timing cycle has expired, freeing up the operator to do other activities and preventing over cooking of the product being finished. | 11-10-2011 |
Marianne E. Knauss, Longwood, FL US
| Patent application number | Description | Published |
|---|---|---|
| 20090055985 | Calathea plant named 'TWYCA0019 2' | 02-26-2009 |
Mike Knauss, Calhoun, GA US
| Patent application number | Description | Published |
|---|---|---|
| 20110233090 | BUNDLE WRAPPING APPARATUS AND ASSOCIATED METHODS - Various embodiments of the present invention provide devices and processes for packaging elongate items in shippable bundles using a corrugated slip sheet and wrapping material. The elongate items may then be stacked within a frame. The frame with the stacked elongate items may then be wrapped with a wrapping material. Next, the stack of elongate items with the wrapping material may be removed from the frame as a single unitized bundle for storage and subsequent shipment. | 09-29-2011 |
Raymond G. Knauss, Wappingers Falls, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20090181532 | INTEGRATION SCHEME FOR EXTENSION OF VIA OPENING DEPTH - An interconnect structure having an incomplete via opening is processed to deepen a via opening and to expose a metal line. In case the interconnect structure comprises a metal pad or a blanket metal layer, the metal pad or the metal layer is removed selective to an underlying dielectric layer to expose the incomplete via opening. Another dielectric layer is formed within the incomplete via opening to compensated for differences in the total dielectric thickness above the metal line relative to an optimal dielectric stack. A photoresist is applied thereupon and patterned. An anisotropic etch process for formation of a normal via opening may be employed with no or minimal modification to form a proper via opening and to expose the metal line. A metal pad is formed upon the metal line so that electrical contact is provided between the metal pad and the metal line. | 07-16-2009 |