Patent application number | Description | Published |
20140046765 | RICH MEDIA MOBILE ADVERTISING DEVELOPMENT PLATFORM - Some embodiments of the invention provide a mobile advertisement content development and management platform which may enable users without programming expertise to create mobile advertisement content suitable for display by, and distribution to, a wide variety of mobile devices and platforms. The platform may, for example, assist users with various aspects of creating rich media mobile advertisement content, associating a set of advertisements with one or more campaigns, managing ongoing campaigns, and/or measuring the effectiveness of campaigns and individual mobile advertisements. | 02-13-2014 |
20140046766 | RICH MEDIA MOBILE ADVERTISING DEVELOPMENT PLATFORM - Some embodiments of the invention provide a mobile advertisement content development and management platform which may enable users without programming expertise to create mobile advertisement content suitable for display by, and distribution to, a wide variety of mobile devices and platforms. The platform may, for example, assist users with various aspects of creating rich media mobile advertisement content, associating a set of advertisements with one or more campaigns, managing ongoing campaigns, and/or measuring the effectiveness of campaigns and individual mobile advertisements. | 02-13-2014 |
20140046767 | RICH MEDIA MOBILE ADVERTISING DEVELOPMENT PLATFORM - Some embodiments of the invention provide a mobile advertisement content development and management platform which may enable users without programming expertise to create mobile advertisement content suitable for display by, and distribution to, a wide variety of mobile devices and platforms. The platform may, for example, assist users with various aspects of creating rich media mobile advertisement content, associating a set of advertisements with one or more campaigns, managing ongoing campaigns, and/or measuring the effectiveness of campaigns and individual mobile advertisements. | 02-13-2014 |
Patent application number | Description | Published |
20080315214 | Solderless Integrated Package Connector and Heat Sink for LED - Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body. | 12-25-2008 |
20110049545 | LED PACKAGE WITH PHOSPHOR PLATE AND REFLECTIVE SUBSTRATE - After flip chip LEDs are mounted on a submount wafer and their growth substrates removed, a phosphor plate is affixed to the exposed top surface of each LED. A reflective material, such as silicone containing at least 5% TiO | 03-03-2011 |
20130248913 | HIGHLY REFLECTIVE COATING ON LED SUBMOUNT - A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer. | 09-26-2013 |
Patent application number | Description | Published |
20080290362 | Illumination Device with a Wavelength Converting Element Held by a Support Structure Having an Aperture - An illumination device includes a light source, such as one or more light emitting diodes and a wavelength converting element that is mounted on an opaque support structure. The support structure includes an aperture with which the wavelength converting element is aligned so that the converted light is emitted through the aperture. The wavelength converting element may be a rigid structure, such as a luminescent ceramic and the aperture may be a hole through the support structure. The support structure may hold the wavelength converting element so that it is physically separated from the light source, or alternatively, the support structure may place the wavelength converting element in physical contact with the light source. | 11-27-2008 |
20110195583 | WAVELENGTH CONVERTING LAYER FOR A LIGHT EMITTING DEVICE - A layer of wavelength converting material is formed by supplying energy to a particle of wavelength converting material and causing the particle to contact a surface such that the energy causes the particle to adhere to the surface. In some embodiments, the wavelength converting material is a phosphor and the surface is a surface of a semiconductor light emitting device. | 08-11-2011 |
20110205049 | ADAPTIVE LIGHTING SYSTEM WITH III-NITRIDE LIGHT EMITTING DEVICES - A device includes a light source, a sensor, and a controller. The light source includes at least one light emitting device connected to a mount. The light emitting device comprises a plurality of segments with neighboring segments spaced less than 200 microns apart. In some embodiments, the plurality of segments are grown on a single growth substrate. Each segment includes a III-nitride light emitting layer disposed between an n-type region and a p-type region. The mount is configured such that at least two segments may be independently activated. The controller is coupled between the sensor and the mount. The controller is operable to receive an input from the sensor and based on the input, selectively illuminate at least one segment in the light source. | 08-25-2011 |