| Patent application number | Description | Published |
|---|
| 20080254635 | Method for Accelerated Etching of Silicon - A method for the plasma-free etching of silicon using the etching gas ClF | 10-16-2008 |
| 20100058873 | SENSOR ASSEMBLAGE AND METHOD FOR MANUFACTURING A SENSOR ASSEMBLAGE - A sensor assemblage, in particular a high-pressure sensor assemblage, includes a substrate element and a connector element, the substrate element comprising a sensor structure having a pressure-sensitive diaphragm and a cavity disposed in the region of the diaphragm, the substrate element being connected to the connector element in such a way that the cavity is connected to a hollow space of the connector element, the substrate element moreover including at least one further sensor structure having a pressure-sensitive further diaphragm and a further cavity disposed in the region of the further diaphragm, the further cavity being connected to a further hollow space of the at least one connector element or of a further connector element. | 03-11-2010 |
| 20100170806 | Method and device for electrochemical machining of substrates - A method and a device with the aid of which a substrate is electrochemically machined, material being removed from the surface of a conductive substrate with the aid of an also conductive tool. The removal takes place as a function of the surface structure which is incorporated into the tool. The core of the present invention is that the substrate and the tool are moved toward one another during the electrochemical etching process. However, it may alternatively also be provided that either the substrate or the tool is locally stationary, while only the counterpart is moved. In a particularly preferred embodiment of the present invention, only the tool is moved toward the substrate. | 07-08-2010 |
