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Kleemeier
Malte Kleemeier, Bremen DE
| Patent application number | Description | Published |
|---|---|---|
| 20100044624 | ETCHANT WHICH CAN BE REMOVED WITHOUT RESIDUE - The invention relates to etchants for etching surfaces, in particular metal surfaces. The etchants are characterised in that they can be removed without residue from the respective etched surface. | 02-25-2010 |
Robert Kleemeier, Eau Claire, WI US
| Patent application number | Description | Published |
|---|---|---|
| 20090243862 | Handheld RFID reader - A data collection device (i.e. reader or reader/writer) for the animal husbandry industry that links to a database to accept instruction protocols for listed animals. An operator scans animals and reads data for each listed and/or located animal per pre-determined sets of instructions unique to each RFID. Read operations are confirmed with auditory, tactile and/or visual feedback. The acquired data and/or operator entries and comments are uploadable to the database. The data can also be collected and transferred over a real-time communication link. | 10-01-2009 |
Walter Kleemeier, Hopewell Junction, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20100167629 | METHOD OF DETERMINING PRESSURE TO APPLY TO WAFERS DURING A CMP - A method for uniformly planarizing a wafer that includes determining a first wafer warped value at a first zone on the wafer, determining a second wafer warped value at a second zone on the wafer, and calculating a pressure difference based on the first and second wafer warped values at the first and second zones is provided. The method also includes performing a chemical mechanical polishing of the wafer, applying a first pressure based on the first wafer warped value to the wafer at the first zone during the chemical mechanical polishing, and applying a second pressure based on the second wafer warped value to the wafer at the second zone during the chemical mechanical polishing, a difference between the first pressure and the second pressure based on the pressure difference. | 07-01-2010 |
| 20110156284 | DEVICE AND METHOD FOR ALIGNMENT OF VERTICALLY STACKED WAFERS AND DIE - A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively. | 06-30-2011 |
William Kleemeier, New Hope, PA US
| Patent application number | Description | Published |
|---|---|---|
| 20090289397 | Forming Station of Apparatus for Making Packaging - An apparatus and method are provided for forming a sheet of thermoformable stock material into a desired shape on a relatively-small and relatively-inexpensive “table top” version of a thermoforming and/or vacuum forming machine. Unlike conventional machines that utilize external electric or gas powered air compressors and/or separate electric vacuum pumps, the apparatus integrates a compressed fluid/suction generating device within the machine itself so that the need to connect the machine to an external source of compressed fluid or vacuum is eliminated. | 11-26-2009 |