| Patent application number | Description | Published |
|---|
| 20080226905 | Method for Producing Low Anisotropy Pressure-Sensitive Adhesives - The invention relates to a method for producing pressure-sensitive adhesives that have low or no anisotropy, the process elements including an adhesive supply system, an application unit and a placement element. A melt strip of the pressure-sensitive adhesive is produced between the outlet of the application unit and the point of placement on the placement element and is stretched. The invention is characterized by controlling the stretching of the pressure-sensitive adhesive in the free melt strip by adjusting an effective ration G which is defined as the ratio of the effective time Δt of the stretching to the stretching rate R, and which is adjust to a value of not more that 0.008 s | 09-18-2008 |
| 20080271845 | Process for Temporary Fixing of a Polymeric Layer Material on Rough Surfaces - Process for temporary fixing of a polymeric layer material on rough surfaces, wherein the polymer layer material encompasses at least one viscoelastic layer, wherein the process involves laying the layer material on the rough surface, introducing energy in order to lower the viscosity of the at least one viscoelastic layer, in such a way that flow onto the rough surface takes place, and the layer is crosslinked in such a way as to produce a layer which has at least some elastomeric character and which at least to some extent wets the rough surface. | 11-06-2008 |
| 20100021683 | FLEXIBLE HEATED PLANAR ELEMENT - A double-sidedly self-adhesive planar element which is intrinsically heatable in a self-regulating way and at the same time has a particularly high flexibility. The planar element has a layer sequence of a posistor heating layer, a contacting layer and an adhesive layer, the contacting layer being a two-dimensional perforate contacting element which within the planar element is therefore present as a contacting element which has not been applied to a backing. Also disclosed is an adhesively bonded assembly of a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and a method of using a planar element of the aforesaid kind for heating an adhesively bonded assembly. | 01-28-2010 |
| 20100059494 | HEATING ELEMENT, AND HEATABLE PANE COMPRISING A HEATING ELEMENT - A heating element including a current conductor through which electric power is conducted and electricity converted into heat by a voltage drop across an ohmic resistor. The heating element is a planar or a strip-shaped structure and is provided with at least one support layer and an adhesive layer, while the current conductor is designed as an additional, current-conducting layer which is arranged between the support layer and the adhesive layer. The support layer, the current-conducting layer, and the adhesive layer are transparent. | 03-11-2010 |
| 20100068514 | METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT - The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated. | 03-18-2010 |
| 20100081208 | Multirange indicator - A multirange indicator is proposed which permits quantitative dose determination of high-energy actinic radiation, where the dose for different wavelength ranges can be respectively determined in parallel. To this end, the multirange indicator has two indicator systems designed with mutually corresponding properties, thus eliminating any mutual distortion of the results of the dose measurements. The first indicator system is based on a photolatent Lewis acid or photolatent Lewis base, and the second indicator system is based on a polysubstituted triphenylmethane dye. Both the multirange indicator and its use for the production of various dose-measurement devices are described. Finally, the following are proposed for the measurement of UV radiation and/or electron-beam radiation: as dose-measurement device, a dose-measurement coating material and a flat dose-measurement element, these being based on the above multirange indicator, and also the measurement method that can be implemented with the said dose-measurement devices. | 04-01-2010 |
| 20100148127 | Method For Encapsulating An Electronic Arrangement - A method for encapsulating an electronic, optionally optoelectronic, arrangement against permeants, in which a pressure-sensitive adhesive composition based on a partly crystalline polyolefin is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated, wherein the polyolefin has a density between 0.86 and 0.89 g/cm and a crystallite melting point of at least 90° C. | 06-17-2010 |
| 20100170889 | Heated planar element and method for its attachment - A double-sidedly bondable planar element which has an electrical contacting layer via which it is self-regulatingly intrinsically heatable and at the same time has a high flexibility. The particular features of this planar element are that the planar element in the storage condition is adhesive on one side only, and is therefore particularly easy to handle, and that, on bonding, the adhesive passes through cutouts in the contacting layer, and the planar element thus becomes double-sidedly bondable. The invention further provides a method for the bonding of this planar element, including as a key step the passage of the adhesive through the cutouts in the contacting layer, thus turning a single-sidedly adhesive planar element into a double-sidedly adhesive planar element. | 07-08-2010 |
| 20100221532 | Method for Producing High Anisotropy Pressure-Sensitive Adhesives - The invention relates to a method for producing pressure-sensitive adhesives that have low or no anisotropy, the process elements including an adhesive supply system, an application unit and a placement element. A melt strip of the pressure-sensitive adhesive is produced between the outlet of the application unit and the point of placement on the placement element and is stretched. The invention is characterized by controlling the stretching of the pressure-sensitive adhesive in the free melt strip by adjusting an effective ratio G which is defined as the ratio of the effective time Δt of the stretching to the stretching rate R, and which is adjusted to a value of at least 0.006 s | 09-02-2010 |
| 20100279107 | METHOD FOR THE PRODUCTION OF A LAYERED OR STACKED INORGANIC/ORGANIC COMPOSITE MATERIAL - The invention relates to a method for the production of a layered or stacked inorganic/organic composite material, a predominantly inorganic material being provided and a polymer material being provided, characterized in that the predominantly inorganic material has a glass transition temperature or melting temperature lower than 500° C., that the predominantly inorganic material and the polymer material are each molten, and that the predominantly inorganic material and the polymer material are coextruded from the melt and thus form the composite material. | 11-04-2010 |
| 20110036623 | METHOD OF ENCAPSULATING AN ELECTRONIC ARRANGEMENT - The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated. | 02-17-2011 |
