| Patent application number | Description | Published |
|---|
| 20080230722 | INTEGRATED CIRCUIT AND METHOD INCLUDING A PATTERNING METHOD - A method of making an integrated circuit including a patterning method using chemically amplified photoresists and exposure apparatus is disclosed. One embodiment provides a photoresist layer exposed using a screened particle beam or a projection exposure with a projection wavelength of less than a limit wavelength below which secondary electrons are initiated by the exposure in the photoresist layer. The photoresist layer is irradiated, at least in a section subjected to the exposing, with UV light having a spectrum below a limit frequency corresponding to the limit wavelength. | 09-25-2008 |
| 20090104558 | Solution for a Treatment of a Resist, a Modified Resist, a Process for the Treatment of a Resist and an Intermediate Product - Solutions for the treatment of a resist used in the manufacturing of a semiconductor device or masks used in the manufacturing of semiconductor devices are described. Preferably, the solution includes a transition metal organic compound. Furthermore embodiments of modified resists, a process and an intermediate product are described. | 04-23-2009 |
| 20090174077 | Method for Structuring a Substrate - A method and intermediate product for structuring a substrate is disclosed. At least one seed layer including a first metal compound is positioned at least partially on the substrate. The seed layer is subjected to a solution comprising ions of a second metal compound. The ions are reduced in the solution by reduction means so that the second metal compound is deposited as mask layer on the seed layer. | 07-09-2009 |
| 20090256361 | ENERGY HARVESTER - An energy harvesting system and method includes a rotatable member with an electrically conductive coil mounted to the rotatable member and adapted to move with the rotatable member such that the movement of the coil through a magnetic field induces a voltage in the coil. An energy storage device is coupled to the coil. | 10-15-2009 |
| 20100043530 | SENSOR DEVICE - A sensor device. One embodiment provides a first sensor having a first sensor surface. The first sensor surface is exposed to allow sensing of a first variable. A second sensor has a second sensor surface. The second sensor surface is sealed to inhibit sensing of the first variable, and a mold material is embedded the first and second sensors. | 02-25-2010 |
| 20100065961 | Electronic Device and Method of Manufacturing Same - This application relates to a method of manufacturing a semiconductor device comprising: providing a metal carrier; placing the metal carrier into a mold for forming a molded structure holding the metal carrier; segmenting the metal carrier into at least two disconnected metal carrier segments; and attaching a semiconductor chip to the molded structure. | 03-18-2010 |
| 20100201356 | SENSOR - A sensor including a substrate and magnetic material. The substrate has a main major surface and includes at least two spaced apart ferromagnetic layers. The magnetic material encapsulates the substrate such that the magnetic material is adjacent the main major surface. | 08-12-2010 |
| 20100230766 | SENSOR DEVICE AND METHOD - A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element. | 09-16-2010 |
| 20100276769 | SEMICONDUCTOR DEVICE - A semiconductor device includes a magnetic sensor chip, an electrically conducting layer wafer-level patterned in contact with the magnetic sensor chip, encapsulation material disposed on the magnetic sensor chip, and an array of external contact elements electrically coupled with the magnetic sensor chip through the electrically conducting layer. | 11-04-2010 |
| 20100295140 | SEMICONDUCTOR DEVICE - A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic. | 11-25-2010 |
| 20110068779 | Bias field generation for a magneto sensor - Embodiments related to the generation of magnetic bias fields for a magneto sensor are described and depicted. | 03-24-2011 |
| 20110127998 | GMR SENSOR WITHIN MOLDED MAGNETIC MATERIAL EMPLOYING NON-MAGNETIC SPACER - An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die. | 06-02-2011 |
| 20110163395 | Pressure Sensor and Method - A method for providing a pressure sensor substrate comprises creating a first cavity that extends inside the substrate in a first direction perpendicular to a main surface of the substrate, and that extends inside the substrate, in a second direction perpendicular to the first direction, into a first venting area of the substrate; creating a second cavity that extends in the first direction inside the substrate, that extends in parallel to the first cavity in the second direction, and that does not extend into the first venting area; and opening the first cavity in the first venting area. | 07-07-2011 |
