Patent application number | Description | Published |
20080230722 | INTEGRATED CIRCUIT AND METHOD INCLUDING A PATTERNING METHOD - A method of making an integrated circuit including a patterning method using chemically amplified photoresists and exposure apparatus is disclosed. One embodiment provides a photoresist layer exposed using a screened particle beam or a projection exposure with a projection wavelength of less than a limit wavelength below which secondary electrons are initiated by the exposure in the photoresist layer. The photoresist layer is irradiated, at least in a section subjected to the exposing, with UV light having a spectrum below a limit frequency corresponding to the limit wavelength. | 09-25-2008 |
20090104558 | Solution for a Treatment of a Resist, a Modified Resist, a Process for the Treatment of a Resist and an Intermediate Product - Solutions for the treatment of a resist used in the manufacturing of a semiconductor device or masks used in the manufacturing of semiconductor devices are described. Preferably, the solution includes a transition metal organic compound. Furthermore embodiments of modified resists, a process and an intermediate product are described. | 04-23-2009 |
20090174077 | Method for Structuring a Substrate - A method and intermediate product for structuring a substrate is disclosed. At least one seed layer including a first metal compound is positioned at least partially on the substrate. The seed layer is subjected to a solution comprising ions of a second metal compound. The ions are reduced in the solution by reduction means so that the second metal compound is deposited as mask layer on the seed layer. | 07-09-2009 |
20090256361 | ENERGY HARVESTER - An energy harvesting system and method includes a rotatable member with an electrically conductive coil mounted to the rotatable member and adapted to move with the rotatable member such that the movement of the coil through a magnetic field induces a voltage in the coil. An energy storage device is coupled to the coil. | 10-15-2009 |
20100043530 | SENSOR DEVICE - A sensor device. One embodiment provides a first sensor having a first sensor surface. The first sensor surface is exposed to allow sensing of a first variable. A second sensor has a second sensor surface. The second sensor surface is sealed to inhibit sensing of the first variable, and a mold material is embedded the first and second sensors. | 02-25-2010 |
20100065961 | Electronic Device and Method of Manufacturing Same - This application relates to a method of manufacturing a semiconductor device comprising: providing a metal carrier; placing the metal carrier into a mold for forming a molded structure holding the metal carrier; segmenting the metal carrier into at least two disconnected metal carrier segments; and attaching a semiconductor chip to the molded structure. | 03-18-2010 |
20100201356 | SENSOR - A sensor including a substrate and magnetic material. The substrate has a main major surface and includes at least two spaced apart ferromagnetic layers. The magnetic material encapsulates the substrate such that the magnetic material is adjacent the main major surface. | 08-12-2010 |
20100230766 | SENSOR DEVICE AND METHOD - A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element. | 09-16-2010 |
20100276769 | SEMICONDUCTOR DEVICE - A semiconductor device includes a magnetic sensor chip, an electrically conducting layer wafer-level patterned in contact with the magnetic sensor chip, encapsulation material disposed on the magnetic sensor chip, and an array of external contact elements electrically coupled with the magnetic sensor chip through the electrically conducting layer. | 11-04-2010 |
20100295140 | SEMICONDUCTOR DEVICE - A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic. | 11-25-2010 |
20110068779 | Bias field generation for a magneto sensor - Embodiments related to the generation of magnetic bias fields for a magneto sensor are described and depicted. | 03-24-2011 |
20110127998 | GMR SENSOR WITHIN MOLDED MAGNETIC MATERIAL EMPLOYING NON-MAGNETIC SPACER - An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die. | 06-02-2011 |
20110163395 | Pressure Sensor and Method - A method for providing a pressure sensor substrate comprises creating a first cavity that extends inside the substrate in a first direction perpendicular to a main surface of the substrate, and that extends inside the substrate, in a second direction perpendicular to the first direction, into a first venting area of the substrate; creating a second cavity that extends in the first direction inside the substrate, that extends in parallel to the first cavity in the second direction, and that does not extend into the first venting area; and opening the first cavity in the first venting area. | 07-07-2011 |
20110187359 | Bias field generation for a magneto sensor - Embodiments related to the generation of magnetic bias fields for a magneto sensor are described and depicted. | 08-04-2011 |
20110241190 | Semiconductor Package - A method of manufacturing a semiconductor package includes providing a carrier and attaching at least one semiconductor piece to the carrier. An encapsulant is deposited onto the at least one semiconductor piece to form an encapsulated semiconductor arrangement. The encapsulated semiconductor arrangement is then singulated in at least two semiconductor packages, wherein each package includes a semiconductor die separated from the semiconductor piece during singulation. | 10-06-2011 |
20110298088 | Semiconductor Package with Integrated Inductor - A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core. | 12-08-2011 |
20120038352 | Sensor Package and Method of Manufacturing Thereof - A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment comprises a sensor and a conductive line, wherein the sensor is arranged proximate to the conductive line. The sensor and the conductive line are isolated and at least partially encapsulated. A soft magnet is arranged in, on and/or around the encapsulation, wherein the soft magnet comprises a composition of an insulating material and a material having soft magnetic properties. | 02-16-2012 |
20120126344 | SENSOR DEVICE AND METHOD - A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element. | 05-24-2012 |
20130056703 | Sensor Device and Method - A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces. | 03-07-2013 |
20130082340 | APPARATUS HAVING A BACK-BIAS MAGNET AND A SEMICONDUCTOR CHIP ELEMENT - An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element. | 04-04-2013 |
20130088941 | SONIC SENSORS AND PACKAGES - Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver. | 04-11-2013 |
20130113474 | Magnetic Sensor Device - A magnetic sensor device includes a magnet configured to generate a bias magnetic field. A plurality of electrical wires extend through the magnet. A magnetic sensor chip is attached to an end face of a first electrical wire of the plurality of electrical wires. | 05-09-2013 |
20130113475 | Magnetic Sensor Device and a Method for Fabricating the Same - A magnetic sensor device includes a plurality of electrical wires, a magnetic sensor chip, and a magnet. The magnet is formed from a material composition of a polymer and magnetic particles and attached to at least one of the electrical wires. | 05-09-2013 |
20130122660 | SENSOR DEVICE AND METHOD - A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element. | 05-16-2013 |
20130164566 | REACTION CHAMBER ARRANGEMENT AND A METHOD FOR FORMING A REACTION CHAMBER ARRANGEMENT - A reaction chamber arrangement is provided, the reaction chamber arrangement including a first chemical reaction chamber; a second chemical reaction chamber; an isolation member between the first chemical reaction chamber and the second chemical reaction chamber, wherein a first electrode is mounted on a first side of the isolation member, an exposed surface of the first electrode facing into the first chemical reaction chamber and wherein a second electrode is mounted on a second side of the isolation member, an exposed surface of the second electrode facing into the second chemical reaction chamber; and an electronic component configured to measure or control at least one of the first chemical reaction chamber and the second chemical reaction chamber, wherein the electronic component is arranged between and connected to the first electrode and the second electrode, and at least partially surrounded by an isolation material of the isolation member. | 06-27-2013 |
20130175527 | SENSOR ARRANGEMENT, A MEASUREMENT CIRCUIT, CHIP-PACKAGES AND A METHOD FOR FORMING A SENSOR ARRANGEMENT - A sensor arrangement is provided, the sensor arrangement including a chip including a sensor circuit configured to detect a bending of the chip; and a package structure configured to protect the chip; wherein the package structure includes a first region and a second region, and wherein the package structure is configured such that it is easier to be deformed in the first region than in the second region. | 07-11-2013 |
20130187201 | Sensor Device and Method - A sensor device includes a semiconductor chip. The semiconductor chip has a sensing region sensitive to mechanical loading. A pillar is mechanically coupled to the sensing region. | 07-25-2013 |
20130278246 | Bias Field Generator and Method - A bias field generator can provide a magnetic bias field for a magnetic sensor. The bias field generator includes a body with magnetic or magnetizable material. A recess is formed in the body. The recess is adapted to a package of the magnetic sensor. | 10-24-2013 |
20140097514 | Semiconductor Package and Method for Fabricating the Same - A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material. | 04-10-2014 |
20140170446 | Sensor Module and Battery Elements - A sensor module includes an enclosure adapted to hermetically seal an opening or a hole on the outer surface of a casing or packaging, a sensor element and a membrane. The membrane is arranged between the enclosure and the opening or hole of the casing or packaging. | 06-19-2014 |
20140218014 | BIAS FIELD GENERATION FOR A MAGNETO SENSOR - Embodiments related to the generation of magnetic bias fields for magnetic sensing are described and depicted. In one embodiment, a sensor includes at least one magnetosensitive element, and a magnetic body with an opening, the magnetic body comprising magnetic material, the magnetic body having inclined surface sections shaped by the opening, wherein the sensor is arranged within the opening such that the magneto-sensitive element is in lateral directions bounded by the inclined surface sections. | 08-07-2014 |
20140254850 | ACOUSTIC SENSOR PACKAGE - Representative implementations of devices and techniques provide an improved signal receive time to a sensor component. The sensor component is enclosed within a package arranged to allow the sensor to potentially receive a signal in less time. The package may have a cavity, and the cavity may be at least partly filled with an acoustical transducer. | 09-11-2014 |
20140264255 | Method for Making a Sensor Device Using a Graphene Layer - A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces. | 09-18-2014 |
20140342203 | APPARATUS FOR MEASURING A PRESSURE, A METHOD FOR MANUFACTURING AN APPARATUS FOR MEASURING A PRESSURE AND A BATTERY - An apparatus for measuring a pressure includes a semiconductor die and a circuit board. The semiconductor die includes a micro-mechanical element generating a measurement signal indicating information on an external pressure applied to the micro-mechanical element. The semiconductor die further includes an output interface providing the measurement signal. The circuit board includes at least one electrically-conductive line and an opening. The semiconductor die is attached to the circuit board, so that the micro-mechanical element faces the whole of the circuit board and the at least on electrically-conductive line is connected to the output interface. | 11-20-2014 |
20140346623 | Film-Covered Open-Cavity Sensor Package - Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are molded on a single batch leadframe or substrate, each open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said the walls having a bottom end adjoining said floor and having a top side opposite the bottom end. At least one semiconductor device is attached to the floor and within the cavity of each of the open-cavity packages, and a single flexible membrane is affixed to the top sides of the walls of the plurality of open-cavity packages, so as to substantially cover all of the cavities. The flexible membrane is then severed, between the packages. | 11-27-2014 |
20140377915 | Pre-mold for a magnet semiconductor assembly group and method of producing the same - A method of manufacturing pre-molds for a magnet semiconductor assembly group is provided, wherein the method comprises forming a plurality of permanent magnetizable elements on a carrier structure in a sensor-free area of the carrier structure by applying a permanent magnetizable molding material on the carrier structure. | 12-25-2014 |
20150023523 | Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals - A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package. | 01-22-2015 |
20150024807 | Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals - A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package. | 01-22-2015 |