| Patent application number | Description | Published |
|---|
| 20080298998 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC EQUIPMENTS - A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities,
| 12-04-2008 |
| 20100193092 | COPPER ALLOY FOR ELECTRICAL/ELECTRONIC DEVICE AND METHOD FOR PRODUCING THE SAME - A copper alloy for an electrical and electronic device in accordance with the present invention is characterized in that the copper alloy for an electrical and electronic device includes: nickel (Ni) between 1.5 mass % and 5.0 mass %; silicon (Si) between 0.4 mass % and 1.5 mass %; and a remaining portion formed of Cu and an unavoidable impurity, wherein a mass ratio between Nickel (Ni) and Silicon (Si) as Ni/Si is not smaller than two and not larger than seven, an average crystalline grain diameter is not smaller than 2 μm and not larger than 20 μm, and a standard deviation of the crystalline grain diameter is not larger than 10 μm. | 08-05-2010 |
| 20100269963 | COPPER ALLOY MATERIAL EXCELLENT IN STRENGTH, BENDING WORKABILITY AND STRESS RELAXATION RESISTANCE, AND METHOD FOR PRODUCING THE SAME - A copper alloy material according to the present invention is characterized in that the same comprises: Ni between 2.8 mass % and 5.0 mass %; Si between 0.4 mass % and 1.7 mass %; S of which content is limited to less than 0.005 mass %; and the balance of the copper alloy material is composed of copper and unavoidable impurity, wherein a proof stress is stronger than or equal to 800 MPa, and the same is superior in bending workability and in stress relaxation resistance. | 10-28-2010 |
| 20100310413 | COPPER ALLOY MATERIAL - A copper alloy material, containing Ni 1.8 to 5.0 mass % and Si 0.3 to 1.7 mass %, at a ratio of contents of Ni and Si, Ni/Si, of 3.0 to 6.0, and having a content of S of less than 0.005 mass %, with the balance of being Cu and inevitable impurities, wherein the copper alloy material satisfies formulae (1) to (4): | 12-09-2010 |
| 20100316879 | COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC COMPONENTS - A copper alloy material for electric/electronic components according to the present invention is characterized in that a average grain size of 1 to 50 μm that is designated by ((a+b)/2) in which a thickness of a grain is defined to be (a) and a width thereof is defined to be (b) which is on a cross section that is vertical to a rolling direction, an aspect ratio (a/b) thereof is between 0.5 and 1.0, an aspect ratio (a/b) of a grain before performing a bend working and an aspect ratio (a′/b′) of which a grain is effected by a tensile stress after performing a bend working of 90 degrees satisfy the following (Formula 1) of: | 12-16-2010 |
| 20110017357 | COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC EQUIPMENTS, AND ELECTRICAL/ELECTRONIC PART - A copper alloy material for an electrical/electronic equipment, containing Ni 3.3 to 5.0 mass %, having a content of Si within the range of 2.8 to 3.8 in terms of a mass ratio of Ni and Si (Ni/Si), and containing Mg 0.01 to 0.2 mass %, Sn 0.05 to 1.5 mass %, and Zn 0.2 to 1.5 mass %, with the balance of Cu and inevitable impurities, wherein when a test piece with thickness t of 0.20 mm and width w of 2.0 mm is subjected to 90° W-bending with bending radius R of 0.1 mm, no cracks occur on the test piece; and, an electrical/electronic part obtained by working the same. | 01-27-2011 |
| 20110017358 | COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC EQUIPMENTS, AND ELECTRICAL/ELECTRONIC PART - A copper alloy material for an electrical/electronic equipment, containing Ni not less than 2.0 mass % and less than 3.3 mass %, having a content of Si within the range of 2.8 to 3.8 in terms of a mass ratio of Ni and Si (Ni/Si), and containing Mg 0.01 to 0.2 mass %, Sn 0.05 to 1.5 mass %, and Zn 0.2 to 1.5 mass %, with the balance of Cu and inevitable impurities, wherein when a test piece with thickness t of 0.20 mm and width w of 2.0 mm is subjected to 180°-bending with bending radius R (mm), a value of the minimum bending radius R causing no cracks is 0 mm to 0.1 mm; and, an electrical/electronic part obtained by working the same. | 01-27-2011 |
| 20110038753 | COPPER ALLOY SHEET MATERIAL - A copper alloy sheet material which has a tensile strength of 730-820 MPa and contains at least nickel (Ni) and silicon (Si), with the remainder being copper (Cu) and inevitable impurities. When the sheet material has a shape capable of 180° tight bending and the width and thickness of this sheet material are expressed by W (unit: mm) and T (unit: mm) respectively, then the product of W and T is 0.16 or less. Preferably, the sheet material is constituted of an alloy containing nickel at 1.8-3.3 mass %, silicon at 0.4 mass %, and chromium (Cr) at 0.01-0.5 mass %, with the remainder being copper and inevitable impurities. The sheet material may further contain one or more of: at least one member selected among tin (Sn), magnesium (Mg), silver (Ag), manganese (Mn), titanium (Ti), iron (Fe), and phosphorus (P) in a total amount of 0.01-1 mass %; zinc (Zn) at 0.01-10 mass %, cobalt (Co) at and 0.01-1.5 mass %. | 02-17-2011 |
| 20110073221 | COPPER ALLOY SHEET MATERIAL AND METHOD OF PRODUCING THE SAME - A copper alloy sheet material, having a composition containing any one or both of Ni and Co in an amount of 0.5 to 5.0 mass % in total, and Si in an amount of 0.3 to 1.5 mass %, with the balance of copper and unavoidable impurities, wherein an area ratio of cube orientation {0 0 1} <1 0 0> is 5 to 50%, according to a crystal orientation analysis in EBSD measurement. | 03-31-2011 |
| 20110094635 | COPPER ALLOY - A method of producing a copper alloy containing a precipitate X composed of Ni and Si and a precipitate Y that comprises (a) Ni and 0% Si, (b) Si and 0% Ni, or (c) neither Ni nor Si, wherein the precipitate X has a grain size of 0.001 to 0.1 μm, and the precipitate Y has a grain size of 0.01 to 1 μm. | 04-28-2011 |
