Patent application number | Description | Published |
20080236879 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced. | 10-02-2008 |
20090250251 | Circuit Device and Method for Manufacturing the Circuit Device - In a circuit device where a wiring layer, an insulating resin and a circuit element are stacked together in such a manner as to embed a bump structure into the insulating resin, the connection reliability between the bump structure and the circuit element is enhanced. | 10-08-2009 |
20100264552 | CIRCUIT DEVICE, METHOD OF MANUFACTURING THE CIRCUIT DEVICE, DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE - A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved. | 10-21-2010 |
20110074025 | SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND MOBILE DEVICE - An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern. | 03-31-2011 |
20110174527 | ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A semiconductor device is of a PoP structure such that first electrode portions provided in a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. The first electrode has a first conductor having the same thickness as that of a wiring layer provided in an insulating layer, a second conductor formed on the first conductor, a gold plating layer provided on the second conductor. | 07-21-2011 |
Patent application number | Description | Published |
20100071865 | CASTING METHOD | 03-25-2010 |
20100297284 | CASTING MOLD DEVICE - A metal mold device for casting that is adapted to prevent a casting sleeve from falling and that keeps even spacing between an inner circumferential wall of the casting sleeve and an outer circumferential wall of a bore pin. Ball plungers are provided at regular intervals in a circumferential direction on an outer circumferential portion of the bore pin in the vicinity of a distal end of the bore pin and on an outer circumferential portion in the vicinity of a basal end thereof, respectively, with respect to the axial direction of the bore pin. Three distal ball plungers are provided on the outer circumferential portion in the vicinity of the distal end of the bore pin and three basal ball plungers are provided on the outer circumferential portion in the vicinity of the basal end thereof. The distal ball plungers are 60° out of phase with the basal ball plungers when viewed in the axial direction. Further, the distal ball plungers are provided in an area where a piston ring, in the vicinity of a top dead center position of a piston, is located. | 11-25-2010 |
20110011553 | MULTI-CAVITY MOLD - Four cavities are arranged on a concentric circle “C” with respect to the center “O” of a flow divider and a gate sleeve. Each of the cavities is connected to a sleeve stamp portion through each of four die side runners and each of four stamp side runners formed in a radial direction and separated from the neighboring runners. A semicircular arc-shaped reservoir is provided between the lower half side of the flow divider and the lower half side of the gate sleeve. This reservoir is connected to the sleeve stamp portion. A semi-solidified layer formed by pouring the molten metal into a sleeve is filled into the reservoir, so that the molten metal from which the semi-solidified layer is separated can be filled directly from each of the stamp side runners via the die side runners into each of the cavities evenly and simultaneously. | 01-20-2011 |
20110036529 | CASTING DIE DEVICE - A casting die assembly which does not produce any burrs includes a stationary die and a movable die that are clamped in a condition in which a slide core is caused to move toward a center of a movable die, and a back surface of a protrusion of the slide core contacts a stopper section provided on a frame section. The stopper section is subjected to the pressure applied to the slide core during a casting operation. Since the stopper section is provided on part of the frame section, which is integrally formed on the periphery of the stationary die, the stopper section is not caused to retreat or deform by the casting pressure and as a result, the slide core is not moved and burrs are not produced. | 02-17-2011 |
20140027085 | CAST PIN - Disclosed is a cast pin equipped with circular grooves which are provided at any location. The cast pin ( | 01-30-2014 |