| Patent application number | Description | Published |
|---|
| 20080206090 | IRIDIUM-BASED ALLOY WITH HIGH HEAT RESISTANCE AND HIGH STRENGTH AND PROCESS FOR PRODUCING THE SAME - An iridium-based alloy which has Ll | 08-28-2008 |
| 20080289730 | MATERIAL HAVING A HIGH ELASTIC DEFORMATION AND PROCESS FOR PRODUCING THE SAME - A Co based alloy including at least one member selected from among 0.01 to 10% Fe, 0.01 to 30% Ni and 0.01 to 25% Mn, which Co based alloy has a metal structure wherein ε-phase of h.c.p. structure having been generated by heat-induced or stress-induced transformation is formed in a ratio of 10 vol. % or more. According to necessity, there may be added at least one member selected from among 0.01 to 10% Al, 0.01 to 35% Cr, to 20% V, 0.01 to 15% Ti, 0.01 to 30% Mo, 0.01 to 10% Nb, to 3% Zr, 001 to 30% W, 0.01 to 10% Ta, 0.01 to 5% Hf, 0.01 to 8% Si, 0.001 to 3% C, 0.001 to 3% B, 0.001 to 3% P and 0.001 to 3% misch metal. The Co based alloy exhibits high elastic deformation capability and is good in ductility and workability. The Co based alloy is used as a functional material of, for example, sensor or actuator capable of displacement control by magnetic field application. | 11-27-2008 |
| 20090178739 | IRON-BASED ALLOY AND PROCESS FOR PRODUCING THE SAME - It is an object of the present invention to provide a ferromagnetic Fe-based alloy having a large reversible strain obtained by application and removal of a magnetic field gradient. | 07-16-2009 |
| 20100156579 | FERROMAGNETIC SHAPE MEMORY ALLOY AND ITS USE - A ferromagnetic shape memory alloy comprising 25-50 atomic % of Mn, 5-18 atomic % in total of at least one metal selected from the group consisting of In, Sn and Sb, and 0.1-15 atomic % of Co and/or Fe, the balance being Ni and inevitable impurities, which has excellent shape memory characteristics in a practical temperature range, thereby recovering its shape by a magnetic change caused by a magnetic-field-induced reverse transformation in a practical temperature range. | 06-24-2010 |
| 20100193801 | SOLDER MATERIAL, METHOD FOR MANUFACTURING THE SAME, JOINED BODY, METHOD FOR MANUFACTURING THE SAME, POWER SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING THE SAME - A zinc based solder material | 08-05-2010 |
| 20110041966 | FUNCTIONAL MEMBER FROM Co-BASED ALLOY AND PROCESS FOR PRODUCING THE SAME - A Co-based alloy having a fundamental composition of Co—Al binary system containing 3-15% Al and having lamellar structure wherein f.c.c. structure α-phase and β(B2)-phase are superimposed on each other in layers, which Co-based alloy is modified so as to have a porous surface layer region effective for chemical retaining capability, sustained release, biocompatibility, etc. through selective removal of either the α-phase or the β-phase from the surface layer. As a third component, at least one member selected from among Ni, Fe, Mn, Ga, Cr, V, Ti, Mo, Nb, Zr, W, Ta, Hf, Si, Rh, Pd, Ir, Pt, Au, B, C and P may be contained in a total amount of 0.001 to 60%. | 02-24-2011 |
| Patent application number | Description | Published |
|---|
| 20080281396 | GUIDE WIRE AND STENT - A guide wire includes a distal core member made of a ferrous alloy which has shape memory properties and superelasticity. The ferrous alloy preferably includes substantially two phases, and has a difference of 100° C or less between an Af point and an Ms point in a thermal hysteresis of martensitic transformation and reverse transformation. The guide wire may include a proximal core member made of an iron-containing alloy and having a higher modulus of elasticity than the distal core member. The two core members may be joined together by welding to form a core of the guide wire. | 11-13-2008 |
| 20090015969 | Magnetic thin film, magnetoresistance effect device and magnetic device using the same - Magnetic thin film having high spin polarizability and a magnetoresistance effect device and a magnetic device using the same, provided with a substrate ( | 01-15-2009 |
| 20100109016 | POWER SEMICONDUCTOR MODULE - Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body. | 05-06-2010 |
| 20100228173 | Corrective Device for Deformed Nails - An elastic metal strip | 09-09-2010 |
