Patent application number | Description | Published |
20110114376 | Printed-circuit board and manufacturing method thereof - A method for manufacturing a printed-circuit board including: a capacitive element forming step of embedding a capacitive element in a substrate resin layer inside a substrate that includes a plurality of wiring layers laminated with the substrate resin layer interposed in between, the capacitive element forming step including forming a lower electrode using a conductive layer on one of the plurality of wiring layers, or using one of the plurality of wiring layers; forming a crystalline metal oxide-containing capacitor dielectric film at a temperature at or below a heat-resistant temperature of the substrate resin layer, and at or above room temperature; and forming an upper electrode on an upper surface of the capacitor dielectric film on the side opposite to the lower electrode. | 05-19-2011 |
20120200797 | CAPACITOR, METHOD OF PRODUCING THE SAME, SEMICONDUCTOR DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE - A capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially stacked. The dielectric layer has a stacked layer structure including a predetermined number of hafnium oxide sublayers and predetermined number of tantalum oxide sublayers. The number, materials, and thicknesses of the sublayers are determined so that the thickness ratio has a range in which, in voltage-leakage current characteristics showing the relationship between the voltage between the first and second electrodes and the leakage current, a start voltage at which the slope of an increase in the current starts to discontinuously increase satisfies an electric field strength of 3 [MV/cm] or more when the ratio of the total thickness of the predetermined number of tantalum oxide sublayers to the total thickness of the dielectric layer is varied, and the thickness ratio is within the range such that the start voltage is within the range. | 08-09-2012 |
20120307469 | MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE - A multilayer wiring board includes: a functional area which includes a thin film capacitor having a dielectric layer between an upper electrode and a lower electrode; and a peripheral area other than the functional area, wherein a mooring portion in which the dielectric layer and a conductive layer are laminated is provided in at least a portion of the peripheral area, and a roughness of a surface of the conductive layer which contacts the dielectric layer is greater than a roughness of a surface of the upper electrode or the lower electrode which contacts the dielectric layer. | 12-06-2012 |
20130149464 | METHOD OF MANUFACTURING CIRCUIT BOARD - A method of manufacturing a circuit board, the method includes: forming a capacitive device and a short-circuit section with use of a capacitive device material including a dielectric film and a conductive film in this order on metallic foil, the capacitive device including a first electrode layer and a second electrode layer with the dielectric film interposed therebetween, and the short-circuit section short-circuiting the first electrode layer and the second electrode layer; forming an upper-layer wiring above the capacitive device and the short-circuit section; and removing or cutting the short-circuit section after the forming of the upper-layer wiring. | 06-13-2013 |
20130154146 | SINTERING MACHINE AND METHOD OF MANUFACTURING SINTERED BODY - A sintering machine includes: a die configured to accommodate a processing object, and having a hole that extends from an outer side surface of the die toward inside of the die; a pressurizing member configured to apply a pressure on the processing object in the die; and a heating section configured to heat the processing object in the die. | 06-20-2013 |
20140339289 | METHOD OF MANUFACTURING MOUNTING SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS - A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate. | 11-20-2014 |
20140367251 | SINTERING APPARATUS, METHOD OF MANUFACTURING SINTERED COMPACT, AND TARGET MATERIAL - A sintering apparatus includes: a non-transportable section mounted in the atmosphere; a transportable section that has a mold capable of accommodating a material to be processed and is loaded detachably with respect to the non-transportable section; and a covering member that envelops the transportable section loaded on the non-transportable section in an almost hermetically sealed state and allows the transportable section to be separated from the non-transportable section with the transportable section enveloped in the almost hermetically sealed state. | 12-18-2014 |
20150047971 | SPUTTERING TARGET, METHOD OF MANUFACTURING SPUTTERING TARGET, METHOD OF MANUFACTURING BARIUM TITANATE THIN FILM, AND METHOD OF MANUFACTURING THIN FILM CAPACITOR - A sputtering target includes a conductive barium titanate sintered material with generation density of crystal grain aggregate ( | 02-19-2015 |