Patent application number | Description | Published |
20080198548 | Power Converter - A power converter of the present invention includes at least two power semiconductor modules having a plurality of switching devices, at least two cooling jackets having a coolant path for cooling the plurality of power semiconductor modules and equipped with the power semiconductor modules, a capacitor module interposed between the at least two cooling jackets, and a connector provided in the at least two cooling jackets for connecting the coolant path. | 08-21-2008 |
20090034306 | Power Module, Power Converter, and Electric Machine System for Mounting in Vehicle - The present invention provides a power module, power converter, and vehicular electric machine system capable of reducing inductance of a peripheral section of an output terminal in a power module, and additionally, reducing a surge voltage. | 02-05-2009 |
20090160048 | Semiconductor Unit, and Power Conversion System and On-Vehicle Electrical System Using the Same - A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base. | 06-25-2009 |
20100025126 | Power Conversion Apparatus and Electric Vehicle - The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area. | 02-04-2010 |
20100026090 | Power Conversion Apparatus and Electric Vehicle - A power conversion apparatus capable of improving the impedance characteristics between each of two power modules and each of a plurality of capacitor cells, the power conversion apparatus including: plural capacitor cells connected in parallel between a three-layer laminated wiring board consisting of a positive polarity conductor board and a negative polarity conductor board formed widely in the direction of the parallel disposition of the power modules and laminated with an insulation sheet therebetween; a three-layer laminated conductor board consisting of a positive polarity conductor board and a negative polarity conductor board formed widely in the direction of the parallel direction of the power modules and laminated with an insulation sheet therebetween and used to connect the positive and negative polarity sides of each of the two power modules to the laminated wiring board respectively. | 02-04-2010 |
20100157640 | Electric Power Converter - The present invention provides a highly reliable electric power converter reduced in parasitic inductance. | 06-24-2010 |
20100165577 | Electric Circuit Device, Electric Circuit Module, and Power Converter - The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. | 07-01-2010 |
20120008280 | Electric Circuit Device, Electric Circuit Module, and Power Converter - The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces. | 01-12-2012 |
20120033475 | POWER CONVERSION APPARATUS - Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module | 02-09-2012 |
20120200164 | Power Conversion Apparatus and Electric Vehicle - A power conversion apparatus capable of improving the impedance characteristics between each of two power modules and each of a plurality of capacitor cells, the power conversion apparatus including: plural capacitor cells connected in parallel between a three-layer laminated wiring board consisting of a positive polarity conductor board and a negative polarity conductor board formed widely in the direction of the parallel disposition of the power modules and laminated with an insulation sheet therebetween; a three-layer laminated conductor board consisting of a positive polarity conductor board and a negative polarity conductor board formed widely in the direction of the parallel direction of the power modules and laminated with an insulation sheet therebetween and used to connect the positive and negative polarity sides of each of the two power modules to the laminated wiring board respectively. | 08-09-2012 |
20120275205 | Power Conversion Apparatus and Electric Vehicle - The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area. | 11-01-2012 |
20130062724 | Power Module and Power Converter Containing Power Module - A power module includes a semiconductor chip, a first coupling conductor with one main surface coupled to one main surface of the semiconductor chip, a second coupling conductor with one main surface coupled to the other main surface of the semiconductor chip, a coupling terminal supplied with electrical power from the direct current power source, and resin material to seal the semiconductor chip, and in which the resin member has a protruding section that protrudes from the space where the first and second coupling conductors are formed opposite each other, and the coupling terminal is clamped on the protruding section, and at least one of the first or second coupling conductors is coupled to a coupling terminal by way of a metallic material that melts at a specified temperature. | 03-14-2013 |
20130062751 | Power Module and Power Module Manufacturing Method - A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section. | 03-14-2013 |
20130119525 | Power Semiconductor Unit, Power Module, Power Semiconductor Unit Manufacturing Method, and Power Module Manufacturing Method - Heat radiation surfaces | 05-16-2013 |
20130128645 | Power Conversion Apparatus and Electric Vehicle - The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area. | 05-23-2013 |
20130175678 | Power Semiconductor Module and Manufacturing Method Thereof - A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes. If there is an projection from a perpendicular direction by one of the main surfaces of the power semiconductor element, the second protrusion section is formed so that the projecting section on a specified side of the second protrusion surface overlaps the projecting section of the step section formed between the base section of the first conductor plate and the first protrusion section. The plural control electrodes on the power semiconductor element are formed along the specified side of the second protrusion surface. | 07-11-2013 |
20130176761 | Power Conversion Device - A power conversion device comprises a power semiconductor device, first and second conductor plates joined to the power semiconductor device, first and second insulating member, a case made of metal which stores the components, and a channel-forming structure made of metal. Part of the case is fixed to the metallic channel-forming structure via a third insulating member. Leakage current caused by the switching operation of the power semiconductor device is transmitted to the channel-forming structure via a series circuit including parasitic capacitance of the first insulating member and/or parasitic capacitance of the second insulating member and parasitic capacitance of the third insulating member. | 07-11-2013 |
20130314963 | POWER CONVERSION APPARATUS - Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module | 11-28-2013 |
20140160821 | POWER CONVERSION APPARATUS - Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module | 06-12-2014 |
20140197532 | Semiconductor Module and Method for Manufacturing Semiconductor Module - A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions. | 07-17-2014 |
20140233204 | Electric Circuit Device, Electric Circuit Module, and Power Converter - The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces. | 08-21-2014 |
20150022974 | Power Conversion Apparatus and Electric Vehicle - The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area. | 01-22-2015 |