Patent application number | Description | Published |
20090320270 | METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY - There are provided a method of assembling a carriage assembly that can uniformly crimp edge portions of spacer holes of spacer portions and keep the spacer portions flat, thereby maintaining the angles of suspensions with high accuracy, and an assembling apparatus that uses such method. | 12-31-2009 |
20100095515 | METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY - A method of assembling a carriage assembly that is operable, during a crimping step that passes a ball, which has a diameter that is equal to or larger than an inner diameter of spacer holes of suspensions, successively through the spacer holes using a bar-shaped pressing member that is subjected to ultrasonic vibration to thereby crimp spacer hole inner circumferential portions of the spacer portions and attach the suspensions to the front end portions of the carriage arms, to prevent the pressing member that presses the ball from colliding with an inner circumferential surface and the like of the spacer holes of the spacer portions and is therefore able to substantially eliminate tilting from the standard angle of the suspensions due to deformation of the spacer portions, and an assembling apparatus that uses such method are provided. | 04-22-2010 |
20100327043 | COMPRESSION-BONDING APPARATUS - A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage. | 12-30-2010 |
20100327435 | ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF - An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads. | 12-30-2010 |
20110079896 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD - A semiconductor device fabrication method, comprising the steps of: forming a solder portion on an electrode of a substrate on which a semiconductor chip is to be mounted; applying a resin layer onto the substrate to a thickness such that a top region of the solder portion is exposed; curing the resin layer; providing a thermosetting underfill material over a region where the semiconductor chip is to be mounted; placing an electrode of the semiconductor chip face down on the solder portion in such a manner that the electrode faces the solder portion; and heating the underfill material and the solder portion. | 04-07-2011 |
20120080220 | ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE - An electronic device includes a circuit board including a first electrode and a second electrode; and an electronic component including a first terminal and a second terminal, wherein the first electrode includes a first pad portion to which the first terminal is connected and a first protrusion portion disposed in a first direction in parallel with a straight line passing through the first electrode and the second electrode with respect to the first pad portion and being into contact with the first terminal, the second electrode includes a second pad portion to which the second terminal is connected and a second protrusion portion disposed in a second direction opposite to the first direction with respect to the second pad portion and being into contact with the second terminal. | 04-05-2012 |
20120230001 | ELECTRONIC DEVICE, PORTABLE ELECTRONIC TERMINAL, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device includes an interposer, a first chip being mounted on a first surface of the interposer, the first chip having a first surface facing the first surface of the interposer and a second surface opposite to the first surface of the first chip, a second chip being mounted on a second surface of the interposer opposite to the first surface of the interposer, the second chip having a first surface facing the second surface of the interposer and a second surface opposite to the first surface of the second chip, a first metal plate being connected to the second surface of the first chip, a second metal surface being provided over the second surface of the second chip, and a via penetrating through the interposer and connected to the first metal plate and the second metal plate. | 09-13-2012 |
20130249087 | ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF - An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads. | 09-26-2013 |