Kimihito
Kimihito Kuwabara, Kyoto JP
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20090218671 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - In a semiconductor device of the present invention, semiconductor chips are stacked in multi-layers. Each of the semiconductor chip includes: through vias extending through a top main surface thereof to a bottom surface opposite to the top main surface; a circuit element surface formed on the top main surface; pads arranged on the circuit element surface; bumps formed on the pads; and via pads, formed on the bottom surface thereof, to which the bumps of its upper semiconductor chip are joined, and positions at which the bumps of each of the semiconductor chips are respectively arranged are different from those at which the bumps of its upper semiconductor chip are arranged. | 09-03-2009 |
20090267217 | Semiconductor device - A semiconductor device ( | 10-29-2009 |
20110079902 | SEMICONDUCTOR DEVICE - A semiconductor device has a wiring substrate provided with an external connecting terminal on a lower surface, a semiconductor chip mounted onto an upper surface of the wiring substrate, a cap-shaped heat dissipation member arranged on the upper surface of the wiring substrate so as to cover the semiconductor chip, a fixing pin for fixing the heat dissipation member onto the upper surface of the wiring substrate, and a heat transfer material sandwiched between a lower surface of the heat dissipation member just above the semiconductor chip and the upper surface of the semiconductor chip. | 04-07-2011 |
20110115085 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - In a semiconductor device of the present invention, semiconductor chips are stacked in multi-layers. Each of the semiconductor chip includes: through vias extending through a top main surface thereof to a bottom surface opposite to the top main surface; a circuit element surface formed on the top main surface; pads arranged on the circuit element surface; bumps formed on the pads; and via pads, formed on the bottom surface thereof, to which the bumps of its upper semiconductor chip are joined, and positions at which the bumps of each of the semiconductor chips are respectively arranged are different from those at which the bumps of its upper semiconductor chip are arranged. | 05-19-2011 |
20110254094 | Semiconductor device - A semiconductor device | 10-20-2011 |
Kimihito Mushikami, Chiyoda-Ku JP
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20150059511 | ROBOT JOINT STRUCTURE - A wrist includes a wrist housing including a wrist driving structural portion to which rotation is transmitted from a wrist driving pulley, a cylindrical portion arranged coaxially with a rotational axis of the wrist driving structural portion and penetrated by a first hand driving shaft to which rotation is transmitted from a hand driving pulley, a cable introducing portion forming an annular gap with the cylindrical portion, and a hand-driving-shaft penetrating portion penetrated by a second hand driving shaft rotating a hand interface by rotation of the first hand driving shaft being transmitted thereto, and a cable, which comes out of a second arm from a wrist supporting portion, is drawn into the wrist housing from the annular gap and is routed to a hand interface supporting portion in a slackened state. | 03-05-2015 |
Kimihito Nakamura, Toyota-Shi, Aichi-Ken JP
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20150333380 | TEMPERATURE REGULATION SYSTEM AND METHOD FOR ESTIMATING FOREIGN MATTER CLOGGING AMOUNT - A temperature regulation system includes: an electric storage device, installed in a vehicle and configured to perform charge and discharge; an intake duct that leads air of a vehicle interior to the electric storage device; a fan configured to cause the air to be taken into the intake duct; a filter that is provided inside the intake duct and that prevents passage of foreign matter; and a controller that estimates a clogging amount of the foreign matter on the filter. The controller is configured to increase the estimated clogging amount as there increases a total amount of the air that is supplied to the electric storage device accompanying driving of the fan, and the number of times that the vehicle is brought to a state in which air is allowed to flow into and flow out of the vehicle. | 11-19-2015 |
Kimihito Nishikawa, Kitamoto-Shi JP
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20160001388 | MANUFACTURING METHOD OF POWER-MODULE SUBSTRATE - A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded. | 01-07-2016 |
Kimihito Nishikawa, Gotenba-Shi JP
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20140318831 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, PASTE FOR FORMING FLUX COMPONENT INTRUSION-PREVENTING LAYER AND METHOD FOR BONDING BONDED BODY - In a power module substrate, a circuit layer is formed on one surface of an insulating layer, a metal layer is formed on the other surface of the insulating layer, and a body to be bonded can be bonded to the other surface of the metal layer using a flux. A flux component intrusion-preventing layer containing an oxide and a resin is formed at a circumferential edge section of a bonding interface between the insulating layer and the metal layer. | 10-30-2014 |
20150208496 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF MANUFACTURING POWER MODULE SUBSTRATE, AND COPPER MEMBER-BONDING PASTE - This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate | 07-23-2015 |
Kimihito Nishikawa, Gotemba-Shi JP
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20150035137 | SOLDER JOINT STRUCTURE, POWER MODULE, POWER MODULE SUBSTRATE WITH HEAT SINK AND METHOD OF MANUFACTURING THE SAME, AND PASTE FOR FORMING SOLDER BASE LAYER - There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member. | 02-05-2015 |
Kimihito Nishikawa, Sunto-Gun JP
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20150313011 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF PRODUCING POWER MODULE SUBSTRATE, PASTE FOR COPPER SHEET BONDING, AND METHOD OF PRODUCING BONDED BODY - A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate ( | 10-29-2015 |
Kimihito Sato, Kariya-Shi JP
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20090115161 | AUTOMATIC TOWING VEHICLE - An automatic towing vehicle includes a self-moving vehicle body for moving along a traveling path, an engaging member, a pressing member and an elevating device for moving up and down the pressing member relative to the vehicle body. The vehicle body is movable under a truck body of the truck. The engaging member is mounted on the vehicle body and engageable with the truck body. The pressing member is mounted on the vehicle body and movable up for pressing the truck body upward. When the pressing member is located under the truck body and moved up by the elevating device, the pressing member is brought to contact with the truck body to press upward. The truck is towed while the pressing member presses against the truck body. | 05-07-2009 |
Kimihito Sato, Yokosuka-Shi JP
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20140003049 | Luminaire | 01-02-2014 |
20150023015 | Attachment Plate and Cover Configuration for a Luminaire - A luminaire may include a luminaire main body, an attachment plate, a plurality of light-emitting modules, a plurality of lenses, and a lighting circuit. In some examples, the luminaire main body may include an opening in a lower surface. The attachment plate may have a flat plate shape and may be arranged in the luminaire main body, and a lower surface faces the opening. The plurality of light-emitting modules may include semiconductor light-emitting elements, and may be attached to the lower surface of the attachment plate. The plurality of lenses may be provided for the respective light-emitting modules, and control luminous intensity distribution of light from the light-emitting modules. The lighting circuit may be arranged above the attachment plate in the luminaire main body, and configured to light the light-emitting modules. | 01-22-2015 |
Kimihito Suzuki, Tokyo JP
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20100184876 | CATALYST FOR PRODUCING HYDROCARBON FROM SYNGAS AND PRODUCING METHOD OF CATALYST - An exemplary method for producing a catalyst is provided where the catalyst includes a catalyst support on which a metallic compound is loaded. An impurity content of the catalyst can be in a range of approximately 0.01 mass % to 0.15 mass %. In particular, the exemplary method can include pre-treating the catalyst support to lower an impurity concentration of the catalyst support, and loading the metallic compound on the catalyst support after the pretreatment procedure. | 07-22-2010 |
20110182792 | METHOD FOR PRODUCING CATALYST REFORMING TAR-CONTAINING GAS, METHOD FOR REFORMING TAR AND METHOD FOR REGENERATING CATALYST FOR REFORMING TAR-CONTAINING GAS - The present invention provides a method for producing a highly active catalyst for reforming tar-containing gas used to treat crude gas for chemical energy conversion consisting of converting to a fuel composition consisting mainly of methane, hydrogen and the like, by utilizing sensible heat possessed by crude gas generated during thermal decomposition of carbonaceous raw materials, and using the high chemical reaction activity of high-temperature tar contained in and incidental to the crude gas to convert the tar to light hydrocarbons in the presence of a catalyst; a tar reforming method; and, a method for regenerating a catalyst for reforming tar-containing gas. | 07-28-2011 |
20120058030 | CATALYST FOR REFORMING TAR-CONTAINING GAS, METHOD FOR PREPARING CATALYST FOR REFORMING TAR CONTAINING GAS, METHOD FOR REFORMING TAR-CONTAINING GAS USING CATALYST FOR REFORMING TAR-CONTAINING GAS, AND METHOD FOR REGENERATING CATALYST FOR REFORMING TAR-CONTAINING GAS - Disclosed is a catalyst for reforming a tar-containing gas, wherein the catalyst contains at least one composite oxide as oxide containing nickel, magnesium, cerium and aluminum and the content of alumina as a single compound is limited to 5% by mass or less. | 03-08-2012 |
20120289615 | CATALYST FOR PRODUCING HYDROCARBON FROM SYNGAS AND PRODUCING METHOD OF CATALYST - An exemplary method for producing a catalyst is provided where the catalyst includes a catalyst support on which a metallic compound is loaded. An impurity content of the catalyst can be in a range of approximately 0.01 mass % to 0.15 mass %. In particular, the exemplary method can include pre-treating the catalyst support to lower an impurity concentration of the catalyst support, and loading the metallic compound on the catalyst support after the pretreatment procedure. | 11-15-2012 |
Kimihito Wada, Itami-Shi JP
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20100239737 | DIETARY FIBER-CONTAINING COMPOSITION FOR BREAD-MAKING, BREAD AND METHOD OF PRODUCTION THEREOF - There is provided a water-soluble dietary fiber-containing composition for bread-making, comprising a homogeneous mixture of a water-soluble dietary fiber material, and an fats and oils, wherein the water-soluble dietary fiber material comprises not less than 85% by mass of a dietary fiber, wherein the water-soluble dietary fiber-containing composition for bread-making comprises 20 to 100 parts by mass of the fats and oils relative to 100 parts by mass of the water-soluble dietary fiber material is provided. Also, there is provided a bread fortified with a water-soluble dietary fiber, produced by using this composition; and a method for producing the bread fortified with a water-soluble dietary fiber comprising adding this composition in a kneading step in a bread-making process. | 09-23-2010 |