Patent application number | Description | Published |
20090166398 | SOLDERING APPARATUS AND SOLDERING METHOD - A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered. | 07-02-2009 |
20090242249 | BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECTRONIC DEVICE - A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and to 0.2 wt % Ge. | 10-01-2009 |
20100032190 | MOUNTING STRUCTURE AND ELECTRONIC EQUIPMENT - A mounting structure formed by bonding the electrodes of a substantially planar electronic component to the electrodes provided on the mounting surface of a circuit board includes a sealing body 5 formed between one main surface of the electronic component and the circuit board and/or on the other main surface of the electronic component. The sealing body 5 is composed of a plurality of layers having different adhesive strengths and thermal conductivities, wherein a layer having a relatively high adhesion strength is arranged in a region being in contact with either one of the electronic component and the circuit board, and a layer having a relatively high thermal conductivity is arranged in a region being in contact with none of the electronic component and the circuit board. | 02-11-2010 |
20110031297 | FLOW SOLDERING APPARATUS AND FLOW SOLDERING METHOD - The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples. | 02-10-2011 |
20130205462 | CLOTHING HAVING COOLING FUNCTION OR WARMING FUNCTION - The clothing having a frontal land and a rear land includes: a thermal storage unit provided on at least one portion of the frontal land of the clothing; and a planar thermoconductive sheet located in a planar between the frontal land and the rear land, the planar thermoconductive sheet having a thermal conduction path to the thermal storage unit, and the planar thermoconductive sheet being higher in thermoconductivity than the frontal land and the rear land. The planar thermoconductive sheet includes a resin component and graphite particles. Basal plane of each graphite particle is parallel to the direction of the plane of the planar thermoconductive sheet. | 08-15-2013 |
20130209732 | GRAPHITE STRUCTURE, AND ELECTRONIC DEVICE USING THE SAME - A graphite structure includes a graphite plate ( | 08-15-2013 |
20140374648 | ANISOTROPIC HEAT CONDUCTIVE COMPOSITION - An object of the present invention is to provide an anisotropic heat conductive composition comprising: resin; and graphite fillers dispersed into the resin, wherein the graphite fillers each have a maximum diameter A in parallel with a basal plane of each of the graphite fillers and a maximum length C perpendicular to the basal plane, an average of the maximum diameters A ranges from 1 μm to 300 μm, an average ratio of the maximum diameter A to the maximum length C represented by A/C is at least 30, a content of the graphite fillers is 20 mass % to 40 mass %, and an average of a smaller angle made by the basal plane and a sheet surface of the sheet anisotropic heat conductive composition is less than 15°. | 12-25-2014 |
20150030835 | ANISOTROPIC HEAT CONDUCTIVE COMPOSITION AND MOLDED PRODUCT THEREOF - The present invention relates to an anisotropic heat conductive composition including flake graphite particles and a resin composition for the particles to be dispersed therein. When the particles have a basal plane, a maximum diameter a in a direction of the basal plane, and a thickness c perpendicular to the basal plane, a/c is 30 or more on average, and a content of the particles is more than 40 mass % and 90 mass % or less. Since the composition includes the particles having a particular shape, when it is formed into a sheet, an anisotropic heat conductive path can be efficiently created therein. Thus, the present invention can provide a molded product in sheet form, suited to have therein a heat conductive path capable of dispersing heat from a high temperature region to a low temperature region. | 01-29-2015 |