Kim, Kyunggi-Do
Baedoo Kim, Kyunggi-Do KR
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20110259840 | SEMICONDUCTOR PACKAGE MAGAZINE - A magazine rack suitable for holding, carrying, shipping or storing the semiconductor packages is provided. The magazine rack is designed with tiered support bars, so as to help secure the inserted packages in position and provide separation buffer. | 10-27-2011 |
Byunsuk Kim, Kyunggi-Do KR
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20140098794 | DYNAMIC NETWORK SELECTION USING KERNELS - A method for determining whether to perform vertical handoff between multiple network. The method comprises obtaining a plurality of selection metrics for each network, calculating, for each of the other communication networks, a predicted utility value from at least the corresponding plurality of selection metrics using a variable kernel regression function, obtaining, for the current communication network, a second plurality of selection metrics; calculating a second predicted utility value for the current communication network from at least the corresponding second plurality of selection metrics using a second variable kernel regression function, comparing each of the predicted utility values for each of the plurality of other communication networks with the second predicted utility value and switching to one of the other communication networks having the highest predicted utility value, if the highest predicted utility value is greater than the second predicted utility value. | 04-10-2014 |
Chang-Tae Kim, Kyunggi-Do KR
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20080315240 | III-Nitride Semiconductor light Emitting Device - The present disclosure relates to an III-nitride semiconductor light emitting device, particularly, an electrode structure thereof. The III-nitride semiconductor light emitting device includes a substrate, a plurality of III-nitride semiconductor layers grown on the substrate, and composed of a first III-nitride semiconductor layer with first conductivity, a second III-nitride semiconductor layer with second conductivity different from the first conductivity, and an active layer positioned between the first III-nitride semiconductor layer and the second III-nitride semiconductor layer, for generating light by recombination of electrons and holes, and a hole passing through the substrate and the plurality of III-nitride semiconductor layers. | 12-25-2008 |
20090014751 | III-Nitride Semiconductor Light Emitting Device and Method for Manufacturing the Same - Disclosed herein is a IE-nitride semiconductor light emitting device comprising a plurality of nitride semiconductor layers including a substrate and an active layer deposited on the substrate, in which the substrate is provided with protrusions to let the lights generated in the active layer emit out of the light emitting device and each of the protrusions has a first scattering plane and a second scattering plane, which are not parallel to each other. | 01-15-2009 |
Dongwook Kim, Kyunggi-Do KR
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20080201297 | Method and System for Determining Relation Between Search Terms in the Internet Search System - A method of determining a relation between search queries, includes: maintaining a database comprising a search session and a record about a search query which is received from a user terminal during the search session; recording and maintaining click rate information for each of the search queries in a predetermined storage unit; generating total search session number information by counting a total number of search sessions which is set during the time interval generating first search session number information by counting a number of search sessions where a first search query is received during the time interval, and generating second search session number information by counting a number of search sessions where a second search query is received during the time interval, by referring to the database; generating third search session number information by counting a number of search sessions where the first search query and the second search query are received during the time interval, by referring to the database; generating conditional probability information by using the first search session number information and the third search session number information; generating correlation information by using the total search session number information, the first search session number information, the second search session number information, and the third search session number information; querying click rate information of the second search query by referring to the storage unit; and determining a relation between the first search query and the second search query, based on the conditional probability information, the correlation information, and the click rate information. | 08-21-2008 |
Dukman Kim, Kyunggi-Do KR
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20100207258 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package including at least a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer disposed over the top surface of the laminate substrate can protect the chip package from the underneath EMI radiation. The chip package may further include another shielding layer over the molding compound of the chip package. | 08-19-2010 |
Eun-Kyung Kim, Kyunggi-Do KR
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20110159239 | NON-WOVEN FABRIC FOR AUTOMOTIVE INTERIOR SKIN MATERIAL AND PREPARATION THEREOF - A method for manufacturing a non-woven fabric for automotive interior materials includes printing on at least one of a front surface and a back surface of the non-woven fabric. Alkaline etching is performed on the front surface of the non-woven fabric. | 06-30-2011 |
Eunseok Kim, Kyunggi-Do KR
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20150086456 | Mixed Metal 8-Ring Small Pore Molecular Sieve Catalyst Compositions, Catalytic Articles, Systems, and Methods - Described are compositions and catalytic articles comprising both a copper-promoted 8-ring small pore molecular sieve and an iron-promoted 8-ring small pore molecular sieve. The catalytic articles are useful in methods and systems to catalyze the reduction of nitrogen oxides in the presence of a reductant. | 03-26-2015 |
Gi Jeong Kim, Kyunggi-Do KR
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20120299172 | LEAD FRAME FOR SEMICONDUCTOR DEVICE - Provided is a lead frame for a semiconductor device, which includes a base layer made of copper, a strike plating layer or a self assembly monolayer (SAM), thereby preventing oxidation of a base layer while simplifying the manufacturing process, reducing the manufacturing costs and reducing a failure ratio. In one embodiment, in the lead frame for a semiconductor device including a die pad and a plurality of leads positioned adjacent to each other around the die pad, the lead frame includes a base layer made of copper; and a first strike plating layer formed on the one or more portions of the surface of the base layer. | 11-29-2012 |
Hong-Hyoun Kim, Kyunggi-Do KR
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20080224294 | MULTI-CHIP PACKAGE WITH A SINGLE DIE PAD - A multi-chip package with a single die pad is provided. The multi-chip package includes a leadframe having a die pad and a plurality of leads surrounding the die pad. Each of the leads includes an upper lead, a lower lead and an intermediate lead substantially perpendicularly connected to the upper and lower leads, wherein the upper and lower leads are substantially parallel to the die pad. The upper and lower surfaces of the die pad are attached with upper and lower chips respectively. The upper chip is electrically connected to the upper surface of one part of the upper leads by a plurality of first bonding wires and the lower chip is electrically connected to the lower surfaces of the other part of the upper leads by a plurality of second bonding wires. A sealant is used to encapsulate the chips and bonding wires to protect these elements from damage. | 09-18-2008 |
20090035895 | CHIP PACKAGE AND CHIP PACKAGING PROCESS THEREOF - A chip package comprises a substrate, a chip, a conductive layer and a molding compound. The substrate has a carrying surface and at least a ground pad disposed on the carrying surface. The chip has an active surface and a back surface opposite thereto. The chip is bonded to the substrate with the active surface facing towards the carrying surface of the substrate, wherein the ground pad is disposed outside of the chip. The conductive layer covers the chip and a portion of the carrying surface, and electrically connects to the ground pad. The molding compound is disposed on the carrying surface of the substrate and encapsulates the chip and the conductive layer. | 02-05-2009 |
20090045491 | SEMICONDUCTOR PACKAGE STRUCTURE AND LEADFRAME THEREOF - A semiconductor package structure including a chip and a leadframe unit is provided. The chip has an active surface and a plurality of recesses disposed thereon. The leadframe unit has at least one packaging area in which the chip is disposed. The packaging area has a plurality of leads on the peripheral portion thereof, wherein each of the leads has a first end fastened on the peripheral portion of the packaging area and a second end extending inward to the active surface of the chip. The leads have a plurality of protrusions, which are capable of being contained by the recesses, located on the second ends to electrically connect the chip and the leadframe unit. | 02-19-2009 |
Hyeongno Kim, Kyunggi-Do KR
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20080308912 | EMI SHIELDED SEMICONDUCTOR PACKAGE - An EMI shielded semiconductor package is provided. The package includes a substrate and a chip disposed on the substrate. The chip is electrically connected to the substrate by a plurality of bonding wires. At least one shielding conductive block is formed on the substrate and electrically connected to the ground trace of the substrate. A sealant is formed on the substrate and covers the chip, bonding wires and the shielding conductive block. The sealant has a side surface to expose a surface of the shielding conductive block. A layer of conductive film is formed on the outer surface of the sealant and covers the exposed surface of the shielding conductive block thereby shielding the chip from electromagnetic interference. | 12-18-2008 |
20090127682 | CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - A method of fabricating a chip package structure is provided. A metallic plate having a first surface, a second surface, and a first patterned metallic layer formed on the first surface thereof is provided. A half-etching process is performed to form first recesses on the first surface of the metallic plate, wherein leads are defined on the metallic plate by the first recesses. A first insulating material fills in each of the first recesses. A second patterned metallic layer is formed on the second surface of the metallic plate. A half-etching process is performed to form second recesses on the second surface of the metallic plate. The second recesses correspond to the first recesses, respectively, and expose the first insulating material inside the first recesses, such that the leads are electrically isolated from one another. A chip is placed on the metallic plate and electrically connected thereto. | 05-21-2009 |
20110259840 | SEMICONDUCTOR PACKAGE MAGAZINE - A magazine rack suitable for holding, carrying, shipping or storing the semiconductor packages is provided. The magazine rack is designed with tiered support bars, so as to help secure the inserted packages in position and provide separation buffer. | 10-27-2011 |
Hyeong-No Kim, Kyunggi-Do KR
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20090194858 | HYBRID CARRIER AND A METHOD FOR MAKING THE SAME - The present invention relates to a hybrid carrier and a method for making the same. The hybrid carrier has a plurality of interconnection leads, so that a wire bondable semiconductor device or a flip chip die apparatus can be placed on the hybrid carrier, and is electrically connected to die paddle and bond fingers. Also, it is easy to dispose a semiconductor device on the hybrid carrier and easy to electrically bond the hybrid carrier and the semiconductor device. Therefore, the hybrid carrier and the method for making the same can be applied to an area array metal CSP easily, and the method of the present invention is simple, so the production cost can be reduced. | 08-06-2009 |
20090261470 | CHIP PACKAGE - A chip package comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided. The carrier has a carrying surface and a back surface opposite to the carrying surface. Furthermore, the carrier has a plurality of common contacts in the periphery of the carrying surface. The chip is disposed on the carrying surface and electrically connected to the carrier. In addition, the first conductive elements are disposed on the common contacts respectively. The encapsulation is disposed on the carrying surface and encapsulating the chip. Moreover, the conductive film is disposed over the encapsulation and the first conductive elements, so as to electrically connect with the common contacts via the first conductive elements. A process for fabricating the chip package is further provided. The chip package is capable of preventing the EMI problem and thus provides superior electrical performance. | 10-22-2009 |
20100096740 | STACKED TYPE CHIP PACKAGE STRUCTURE - A stacked type chip package structure including a backplate, a circuit substrate, a first chip, a second chip, and a conductive film is provided. The backplate comprises a circuit layer. The circuit substrate is disposed on the backplate, and has an upper surface and an opposite lower surface. Besides, the circuit substrate has a receiving hole corresponding to the backplate. The first chip is disposed inside the receiving hole, and the first chip is electrically connected to the circuit substrate through the circuit layer of the backplate. The second chip is disposed above the first chip, and is electrically connected to the circuit substrate. The conductive film is disposed between the first chip and the second chip, wherein the conductive film is electrically connected to a ground of the circuit substrate. | 04-22-2010 |
20140346654 | CHIP PACKAGE - A chip package comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided. The carrier has a carrying surface and a back surface opposite to the carrying surface. Furthermore, the carrier has a plurality of common contacts in the periphery of the carrying surface. The chip is disposed on the carrying surface and electrically connected to the carrier. In addition, the first conductive elements are disposed on the common contacts respectively. The encapsulation is disposed on the carrying surface and encapsulating the chip. Moreover, the conductive film is disposed over the encapsulation and the first conductive elements, so as to electrically connect with the common contacts via the first conductive elements. A process for fabricating the chip package is further provided. The chip package is capable of preventing the EMI problem and thus provides superior electrical performance. | 11-27-2014 |
Hyo Kyeom Kim, Kyunggi-Do KR
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20130008741 | SOUND-INSULATING AND VIBRATION-ISOLATING RUBBER PAD AND METHOD FOR INSTALLING A SOUND-INSULATING AND VIBRATION-ISOLATING FLOOR USING SAME - The present invention relates to a sound-insulating and vibration-isolating rubber pad and a method for installing a sound-insulating and vibration-isolating floor using same in which lower pad protrusions can be inserted into a plurality of insertion holes formed in a lower water-proof plywood because the lower pad protrusions are formed in the center of an upper surface of a lower pad body of a sound-insulating and vibration-isolating rubber pad, so that the lower water-proof plywood and an upper pad are integrally connected above a lower pad, and a vibration-isolating function may be achieved in a stable manner because the lower pad, the lower water-proof plywood, and the upper pad are integrally connected, thereby providing a sound-insulating effect that can remarkably reduce inter-floor noise. | 01-10-2013 |
Hyun Gyu Kim, Kyunggi-Do KR
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20100064276 | JAVA BYTECODE TRANSLATING METHOD - Provided is a Java bytecode translating method which includes: a bytecode fetch step (S | 03-11-2010 |
Hyun Hee Kim, Kyunggi-Do KR
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20110279351 | Portable Multi-Display Device - A separable portable multi-display device is provided. A portable multi-display device includes a main body panel housing having a first display, a sub-panel housing having a second display, and a coupling device for coupling the main body panel housing to the sub-panel housing such that at least one sides of the first display and the second display can contact each other. The panel housings are separable from and connectable to each other, a range of a border between the displays when the panel housings are interconnected being minimized so that the displays can be shown as if it is driven as a single screen. | 11-17-2011 |
Jae Gon Kim, Kyunggi-Do KR
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20100043482 | AIR COOLING DEVICE OF INTEGRATED THERMO-HYGROSTAT - The present invention provides an air cooling device of an integrated thermo-hygrostat, which is advantageous over known integrated thermo-hygrostats in that it is possible to prevent indoor air from being mixed with cold outdoor air when cooling an indoor space using the cold outdoor air in winter by installing an indoor air control damper which can control the flow of the indoor air in front of an evaporator installed in an inner portion of a main body. The air cooling device can rapidly lower the temperature of the indoor space to the intended temperature, increase cooling efficiency, and prevent power from being unnecessarily consumed by being capable of suspending the cooling function thereof when cooling is performed using outdoor air having a temperature below a predetermined temperature. | 02-25-2010 |
Jang Ho Kim, Kyunggi-Do KR
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20110279351 | Portable Multi-Display Device - A separable portable multi-display device is provided. A portable multi-display device includes a main body panel housing having a first display, a sub-panel housing having a second display, and a coupling device for coupling the main body panel housing to the sub-panel housing such that at least one sides of the first display and the second display can contact each other. The panel housings are separable from and connectable to each other, a range of a border between the displays when the panel housings are interconnected being minimized so that the displays can be shown as if it is driven as a single screen. | 11-17-2011 |
Je-Woo Kim, Kyunggi-Do KR
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20080298694 | Method for Coding RGB Color Space Signal - A method for coding an RGB color space signal is disclosed. In accordance with the method, a base plane is encoded using an independent mode, and an enhanced plane is encoded by referring to the base plane without converting the RGB color space signal into YCbCr color space signal to reduce a redundancy between RGB planes and improve a compression ratio of an image. | 12-04-2008 |
Ji Mi Kim, Kyunggi-Do KR
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20110300102 | COMPOSITION FOR SKIN REGENERATION, CONTAINING A SECRETION IN THE CULTURE OF AN EMBRYONIC STEM CELL-DERIVED ENDOTHELIAL PROGENITOR CELL OR FRACTIONS THEREOF, AND USE THEREOF - The present invention relates to a composition for skin regeneration, using a culture medium or a secretion in the culture of an embryonic stem cell-derived endothelial progenitor cell, and to the use thereof. As the present invention uses the secretion in the culture as a medicine and not the embryonic stem cell-derived endothelial progenitor cell itself, the risk of teratoma formation is prevented, and angiogenic activity is promoted to achieve improved effectiveness in healing wounds and burn wounds. The composition of the present invention, when used as a material in cosmetics, increases collagen synthesis and thus prevents skin aging. Particularly, the composition of the present invention in which the secretion in the culture is concentrated into a high concentration provides superior wound-healing effects as compared to a conventional human growth hormone (hGH). | 12-08-2011 |
Joondong Kim, Kyunggi-Do KR
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20110260338 | Semiconductor Device and Method of Forming Adjacent Channel and DAM Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material - A semiconductor device has a flipchip or PoP semiconductor die mounted to a die attach area interior to a substrate. The substrate has a contact pad area around the die attach area and flow control area between the die attach area and contact pad area. A first channel is formed in a surface of the substrate within the flow control area. The first channel extends around a periphery of the die attach area. A first dam material is formed adjacent to the first channel within the flow control area. An underfill material is deposited between the die and substrate. The first channel and first dam material control outward flow of the underfill material to prevent excess underfill material from covering the contact pad area. A second channel can be formed adjacent to the first dam material. A second dam material can be formed adjacent to the first channel. | 10-27-2011 |
20130147065 | Semiconductor Device and Method of Forming Adjacent Channel and Dam Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material - A semiconductor device has a flipchip or PoP semiconductor die mounted to a die attach area interior to a substrate. The substrate has a contact pad area around the die attach area and flow control area between the die attach area and contact pad area. A first channel is formed in a surface of the substrate within the flow control area. The first channel extends around a periphery of the die attach area. A first dam material is formed adjacent to the first channel within the flow control area. An underfill material is deposited between the die and substrate. The first channel and first dam material control outward flow of the underfill material to prevent excess underfill material from covering the contact pad area. A second channel can be formed adjacent to the first dam material. A second dam material can be formed adjacent to the first channel. | 06-13-2013 |
Joon Su Kim, Kyunggi-Do KR
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20120299172 | LEAD FRAME FOR SEMICONDUCTOR DEVICE - Provided is a lead frame for a semiconductor device, which includes a base layer made of copper, a strike plating layer or a self assembly monolayer (SAM), thereby preventing oxidation of a base layer while simplifying the manufacturing process, reducing the manufacturing costs and reducing a failure ratio. In one embodiment, in the lead frame for a semiconductor device including a die pad and a plurality of leads positioned adjacent to each other around the die pad, the lead frame includes a base layer made of copper; and a first strike plating layer formed on the one or more portions of the surface of the base layer. | 11-29-2012 |
Keuk Kim, Kyunggi-Do KR
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20090014751 | III-Nitride Semiconductor Light Emitting Device and Method for Manufacturing the Same - Disclosed herein is a IE-nitride semiconductor light emitting device comprising a plurality of nitride semiconductor layers including a substrate and an active layer deposited on the substrate, in which the substrate is provided with protrusions to let the lights generated in the active layer emit out of the light emitting device and each of the protrusions has a first scattering plane and a second scattering plane, which are not parallel to each other. | 01-15-2009 |
Kwang Hyun Kim, Kyunggi-Do KR
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20090254550 | METHOD AND SYSTEM FOR OFFERING SEARCH RESULTS - A method of providing a search result and a system for executing the method are provided. A method of providing a search result includes: setting a grade of a category associated with a keyword based on click information; creating a category list to maintain the category list in association with the keyword, wherein the category list includes the category that is arranged according to the grade; and providing a search result for the keyword in an order of the category in the category list, wherein the click information includes information regarding whether the category is clicked on and a clicked order. | 10-08-2009 |
Kwan Young Kim, Kyunggi-Do KR
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20100064276 | JAVA BYTECODE TRANSLATING METHOD - Provided is a Java bytecode translating method which includes: a bytecode fetch step (S | 03-11-2010 |
Kyong-Soon Kim, Kyunggi-Do KR
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20100266157 | METHOD FOR EMBEDDING WATERMARK INTO AN IMAGE AND DIGITAL VIDEO RECORDER USING SAID METHOD - The present invention relates to a method for embedding and detecting watermark wherein forgery/alternation of image can be identified and the location of forgery/alternation can be verified by embedding and detecting watermark into a digital image which is shot in real time. Watermark is generated by using a quantized coefficient after frequency transform used in the compression process. By embedding this into an image, image can be compressed simultaneously with embedding watermark. The present invention discloses a method for embedding robust watermark which embeds a random sequence circular shifted from an original pseudo random sequence by the distance d as watermark into an image. The present invention discloses a technology for generating and embedding watermark by using a DCT coefficient quantized during the process for MPEG compressing the image, wherein said watermark can be generated and embedded in a unit of macro blocks or slices. The present invention discloses a technology for generating and embedding watermark by using a wavelet coefficient quantized during the process for wavelet compressing the image. Further, the present invention discloses a digital video recorder recording the image which is shot in real time embedded with watermark in accordance with the above method for embedding watermark. | 10-21-2010 |
Minho Kim, Kyunggi-Do KR
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20080242176 | Fabric with improved heat resistance and methods of making same - Fabric impregnated with polysiloxane. The fabric may be leather, synthetic leather or suede. Alternatively the fabric may be made from aramid or oxidized polyacrylic/nitride fibers. One method of making this fabric is to mix liquid silicone rubber; impregnate the fabric with the liquid chemical; and heat the fabric at 120-200° C. for 10-150 seconds. Another method of making the fabric is to mix liquid silicone rubber or a mixture of liquid silicone rubber and catalyzed polyurethane with fibers and heat the mixture at 120-200° C. for 10-150 seconds. Fibers may be polyester microfibers, nylon microfibers, suede, aramid, oxidized polyacrylic/nitride, and mixtures of these fibers. | 10-02-2008 |
Minjung Kim, Kyunggi-Do KR
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20120056334 | Semiconductor Device and Method of Forming Pre-Molded Substrate to Reduce Warpage During Die Mounting - A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate and conductive layer formed over the substrate. A first encapsulant is deposited over the substrate outside a die attach area of the substrate. The first encapsulant surrounds each die attach area over the substrate and the die attach area is devoid of the first encapsulant. A channel connecting adjacent die attach areas is also devoid of the first encapsulant. A first semiconductor die is mounted over the substrate within the die attach area after forming the first encapsulant. A second semiconductor die is mounted over the first die within the die attach area. An underfill material can be deposited under the first and second die. A second encapsulant is deposited over the first and second die and first encapsulant. The first encapsulant reduces warpage of the substrate during die mounting. | 03-08-2012 |
20130200527 | Semiconductor Device and Method of Forming Pre-Molded Substrate to Reduce Warpage During Die Molding - A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate and conductive layer formed over the substrate. A first encapsulant is deposited over the substrate outside a die attach area of the substrate. The first encapsulant surrounds each die attach area over the substrate and the die attach area is devoid of the first encapsulant. A channel connecting adjacent die attach areas is also devoid of the first encapsulant. A first semiconductor die is mounted over the substrate within the die attach area after forming the first encapsulant. A second semiconductor die is mounted over the first die within the die attach area. An underfill material can be deposited under the first and second die. A second encapsulant is deposited over the first and second die and first encapsulant. The first encapsulant reduces warpage of the substrate during die mounting. | 08-08-2013 |
Ohhan Kim, Kyunggi-Do KR
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20090294928 | Semiconductor Device and Method of Forming Holes In Substrate to Interconnect Top Shield and Ground Shield - A shielded semiconductor device is made by embedding a ground shield between layers of a substrate. Semiconductor die are mounted to the substrate over the ground shields. An encapsulant is formed over the semiconductor die and substrate. The encapsulant is diced to form dicing channels between the semiconductor die. A plurality of openings is drilled into the substrate along the dicing channels down through the ground shield on each side of the semiconductor die. A top shield is formed over the semiconductor die. The openings in the substrate are filled with a shielding material to electrically and mechanically connect the top shield to the ground shield. The substrate is singulated to separate the semiconductor die with top shield and ground shield into individual semiconductor devices. IPDs in the semiconductor die generate electromagnetic interference which is blocked by the respective top shield and ground shield. | 12-03-2009 |
20090302436 | Semiconductor Device and Method of Forming Shielding Layer Grounded Through Metal Pillars Formed in Peripheral Region of the Semiconductor - A shielded semiconductor device is made by mounting semiconductor die to a first substrate. An encapsulant is formed over the semiconductor die and first substrate. A dicing channel is formed through the encapsulant between the semiconductor die. A hole is drilled in the first substrate along the dicing channel on each side of the semiconductor die. A shielding layer is formed over the encapsulant and semiconductor die. The hole is lined with the shielding layer. The first substrate is singulated to separate the semiconductor die. The first substrate is mounted to a second substrate. A metal pillar is formed in the opening to electrically connect the shielding layer to a ground plane in the second substrate. The metal pillar includes a hook for a mechanically secure connection to the shielding layer. An interconnect structure is formed on the first substrate to electrically connect the semiconductor die to the second substrate. | 12-10-2009 |
20100148316 | Semiconductor Device and Method of Forming Topside and Bottom-side Interconnect Structures Around Core Die with TSV - A semiconductor device has a core semiconductor device with a through silicon via (TSV). The core semiconductor device includes a plurality of stacked semiconductor die and semiconductor component. An insulating layer is formed around the core semiconductor device. A conductive via is formed through the insulating layer. A first interconnect structure is formed over a first side of the core semiconductor device. The first interconnect structure is electrically connected to the TSV. A second interconnect structure is formed over a second side of the core semiconductor device. The second interconnect structure is electrically connected to the TSV. The first and second interconnect structures include a plurality of conductive layers separated by insulating layers. A semiconductor die is mounted to the first interconnect structure. The semiconductor die is electrically connected to the core semiconductor device through the first and second interconnect structures and TSV. | 06-17-2010 |
20100148353 | Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures - A semiconductor device is made by forming a first active device on a first side of a semiconductor wafer. A first insulating layer is formed over the first side of the wafer. A first conductive layer is formed over the first insulating layer. A first interconnect structure is formed over the first insulating layer and first conductive layer. A temporary carrier is mounted to the first interconnect structure. A second active device is formed on a second side of the semiconductor wafer. A second insulating layer is formed over the second side of the wafer. A second conductive layer is formed over the second insulating layer. A second interconnect structure is formed over the second insulating layer and second conductive layer. The temporary carrier is removed, leaving a double-sided semiconductor device. The double-sided semiconductor device is enclosed in a package with the first and second interconnect structures electrically connected. | 06-17-2010 |
20120153452 | Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures - A semiconductor device is made by forming a first active device on a first side of a semiconductor wafer. A first insulating layer is formed over the first side of the wafer. A first conductive layer is formed over the first insulating layer. A first interconnect structure is formed over the first insulating layer and first conductive layer. A temporary carrier is mounted to the first interconnect structure. A second active device is formed on a second side of the semiconductor wafer. A second insulating layer is formed over the second side of the wafer. A second conductive layer is formed over the second insulating layer. A second interconnect structure is formed over the second insulating layer and second conductive layer. The temporary carrier is removed, leaving a double-sided semiconductor device. The double-sided semiconductor device is enclosed in a package with the first and second interconnect structures electrically connected. | 06-21-2012 |
20120241941 | Semiconductor Device and Method of Forming a Thermally Reinforced Semiconductor Die - A semiconductor device includes a substrate with conductive traces. A semiconductor die is mounted with an active surface oriented toward the substrate. An underfill material is deposited between the semiconductor die and substrate. A recess is formed in an interior portion of the semiconductor die that extends from a back surface of the semiconductor die opposite the active surface partially through the semiconductor die such that a peripheral portion of the back surface of the semiconductor die is offset with respect to a depth of the recess. A thermal interface material (TIM) is deposited over the semiconductor die and into the recess such that the TIM in the recess is laterally supported by the peripheral portion of the semiconductor die to reduce flow of the TIM away from the semiconductor die. A heat spreader including protrusions is mounted over the semiconductor die and contacts the TIM. | 09-27-2012 |
20140239509 | Semiconductor Device and Method of Forming Topside and Bottom-side Interconnect Structures Around Core Die with TSV - A semiconductor device has a core semiconductor device with a through silicon via (TSV). The core semiconductor device includes a plurality of stacked semiconductor die and semiconductor component. An insulating layer is formed around the core semiconductor device. A conductive via is formed through the insulating layer. A first interconnect structure is formed over a first side of the core semiconductor device. The first interconnect structure is electrically connected to the TSV. A second interconnect structure is formed over a second side of the core semiconductor device. The second interconnect structure is electrically connected to the TSV. The first and second interconnect structures include a plurality of conductive layers separated by insulating layers. A semiconductor die is mounted to the first interconnect structure. The semiconductor die is electrically connected to the core semiconductor device through the first and second interconnect structures and TSV. | 08-28-2014 |
Oh Yoen Kim, Kyunggi-Do KR
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20090317838 | DETECTION OF BACTERIAL PEPTIDOGLYCAN-LIKE COMPOUNDS - Innate immunity to bacterial pathogens relies on the detection of bacterial peptidoglycans. Intracellular NOD2 proteins sense peptidoglycans and respond by activating transcription factors. An in vitro assay utilizing a reporter gene under the control of a promoter that contains transcription recognition sequences for the binding of a transcription factor that is activated by NOD2 in cells transfected to express NOD2 or NOD2 and TLR2 can identify bacterial infection or sepsis by detecting bacterial peptidoglycans. | 12-24-2009 |
Seokbong Kim, Kyunggi-Do KR
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20110260266 | SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGE PROCESS - A semiconductor package structure and a package process are provided, wherein a lower surface of a die pad of a leadframe is exposed by an encapsulant so as to improve the heat dissipation efficiency of the semiconductor package structure. In addition, two chips are disposed at the same sides of the leadframe and the end portion of each of leads bonding to the upper chip is encapsulated by the encapsulant such that the scratch on the lead tips in wire bonding and die attach steps can be prevented and thus the wire bondability can be enhanced. | 10-27-2011 |
Seungwon Kim, Kyunggi-Do KR
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20090302436 | Semiconductor Device and Method of Forming Shielding Layer Grounded Through Metal Pillars Formed in Peripheral Region of the Semiconductor - A shielded semiconductor device is made by mounting semiconductor die to a first substrate. An encapsulant is formed over the semiconductor die and first substrate. A dicing channel is formed through the encapsulant between the semiconductor die. A hole is drilled in the first substrate along the dicing channel on each side of the semiconductor die. A shielding layer is formed over the encapsulant and semiconductor die. The hole is lined with the shielding layer. The first substrate is singulated to separate the semiconductor die. The first substrate is mounted to a second substrate. A metal pillar is formed in the opening to electrically connect the shielding layer to a ground plane in the second substrate. The metal pillar includes a hook for a mechanically secure connection to the shielding layer. An interconnect structure is formed on the first substrate to electrically connect the semiconductor die to the second substrate. | 12-10-2009 |
20120056334 | Semiconductor Device and Method of Forming Pre-Molded Substrate to Reduce Warpage During Die Mounting - A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate and conductive layer formed over the substrate. A first encapsulant is deposited over the substrate outside a die attach area of the substrate. The first encapsulant surrounds each die attach area over the substrate and the die attach area is devoid of the first encapsulant. A channel connecting adjacent die attach areas is also devoid of the first encapsulant. A first semiconductor die is mounted over the substrate within the die attach area after forming the first encapsulant. A second semiconductor die is mounted over the first die within the die attach area. An underfill material can be deposited under the first and second die. A second encapsulant is deposited over the first and second die and first encapsulant. The first encapsulant reduces warpage of the substrate during die mounting. | 03-08-2012 |
20120126395 | Semiconductor Device and Method of Forming Uniform Height Insulating Layer Over Interposer Frame as Standoff for Semiconductor Die - A semiconductor device has an interposer frame having a die attach area. A uniform height insulating layer is formed over the interposer frame at corners of the die attach area. The insulating layer can be formed as rectangular or circular pillars at the corners of the die attach area. The insulating layer can also be formed in a central region of the die attach area. A semiconductor die has a plurality of bumps formed over an active surface of the semiconductor die. The bumps can have a non-fusible portion and fusible portion. The semiconductor die is mounted over the insulating layer which provides a uniform standoff distance between the semiconductor die and interposer frame. The bumps of the semiconductor die are bonded to the interposer frame. An encapsulant is deposited over the semiconductor die and interposer frame and between the semiconductor die and interposer frame. | 05-24-2012 |
20130200527 | Semiconductor Device and Method of Forming Pre-Molded Substrate to Reduce Warpage During Die Molding - A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate and conductive layer formed over the substrate. A first encapsulant is deposited over the substrate outside a die attach area of the substrate. The first encapsulant surrounds each die attach area over the substrate and the die attach area is devoid of the first encapsulant. A channel connecting adjacent die attach areas is also devoid of the first encapsulant. A first semiconductor die is mounted over the substrate within the die attach area after forming the first encapsulant. A second semiconductor die is mounted over the first die within the die attach area. An underfill material can be deposited under the first and second die. A second encapsulant is deposited over the first and second die and first encapsulant. The first encapsulant reduces warpage of the substrate during die mounting. | 08-08-2013 |
Si-Han Kim, Kyunggi-Do KR
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20100053858 | PORTABLE DISPLAY DEVICE - The present invention is directed to a portable display device having at lease two display elements, at least two foldable panel housings for receiving and supporting the display elements circuit boards and other parts, respectively, and optical elements provided on the top surface of the one of the sidewalls of the panel housings and mounted in a joint portion of the display elements, wherein one of the sidewalls of the panel housings are cut to form openings or a connecting joint portion, and the sidewalls of the optical elements is adjacently disposed each other when the panel housings are unfolded. The portable display device allows a single large sized screen, and whereby a joint portion between the two display panels as non-display area may be minimized. | 03-04-2010 |
20110026212 | PORTABLE DISPLAY DEVICE - The present invention is directed to a portable display device. The display device comprises at least two panel housings for receiving display elements, respectively, means for foldable connecting the panel housings, a connection cable for connecting the circuits of the display elements provided at the panel housings and a cover for covering the connection cable not to be exposed. Accordingly, the flexible and weak connection cable may be protected. | 02-03-2011 |
20110279351 | Portable Multi-Display Device - A separable portable multi-display device is provided. A portable multi-display device includes a main body panel housing having a first display, a sub-panel housing having a second display, and a coupling device for coupling the main body panel housing to the sub-panel housing such that at least one sides of the first display and the second display can contact each other. The panel housings are separable from and connectable to each other, a range of a border between the displays when the panel housings are interconnected being minimized so that the displays can be shown as if it is driven as a single screen. | 11-17-2011 |
20120133592 | MULTIDISPLAY DEVICE WITH PANEL HOUSINGS - A multi display device includes panel housings having displays. The panel housings are foldable on each other and the displays are disposed adjacent to each other when the panel housings are unfolded. A key input part is further provided to be foldable on the panel housings. Accordingly, the multi display device is easy to grasp for the user while providing the folding/folding convenience. | 05-31-2012 |
20120147542 | PORTABLE DISPLAY DEVICE - The present invention is directed to a portable display device. The display device comprises at least two panel housings for receiving display elements, respectively, means for foldable connecting the panel housings, a connection cable for connecting the circuits of the display elements provided at the panel housings and a cover for covering the connection cable not to be exposed. Accordingly, the flexible and weak connection cable may be protected. | 06-14-2012 |
Si-Hwan Kim, Kyunggi-Do KR
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20140125553 | MULTI DISPLAY DEVICE WITH PANEL HOUSINGS - A multi display device includes panel housings having displays. The panel housings are foldable on each other and the displays are disposed adjacent to each other when the panel housings are unfolded. A key input part is further provided to be foldable on the panel housings. Accordingly, the multi display device is easy to grasp for the user while providing the folding/folding convenience. | 05-08-2014 |
Si-Hyung Kim, Kyunggi-Do KR
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20110017601 | Method for Recovery of Residual Actinide Elements from Chloride Molten Salt - A method for recovery of residual actinide element from chloride molten salts that are formed after electro-refining and/or electro-winning of a spent nuclear fuel and include actinide elements and rare-earth elements is provided. The method comprises conducting electrolysis using a liquid cadmium cathode (LCC) in the chloride molten salt that is formed after electro-refining and/or electro-winning of a spent nuclear fuel and contains rare-earth elements and actinide elements; electro-depositing the actinide elements contained in the chloride molten salt on the LCC in order to reduce a concentration of the actinide elements; and adding a CdCl | 01-27-2011 |
Soo Won Kim, Kyunggi-Do KR
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20090090101 | Exhaust Gas-Discharging Device of Vehicle - An exhaust gas discharge device for vehicles is disclosed. The exhaust gas discharge device of the present invention includes an extension pipe ( | 04-09-2009 |
Sung Eon Kim, Kyunggi-Do KR
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20120036640 | METHOD OF MANUFACTRING THE STUFFING OF PILLOW USING SEEDS OF DRUPES AND PILLOW FILLED WITH THE STUFFING MANUFACTURED THEREBY - A method of manufacturing the stuffing of a pillow, includes washing seeds of collected drupes to remove alien materials from the seeds, crushing the seeds removed of the alien materials into a predetermined size, polishing surfaces of the products of the seeds crushed into a predetermined size to be smooth and round and drying the resultant crushed products. | 02-16-2012 |
Sun Wook Kim, Kyunggi-Do KR
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20150026306 | METHOD AND APPARATUS FOR PROVIDING VIRTUAL DESKTOP SERVICE - A method and an apparatus for providing a virtual desktop service to provide an optimal virtual desktop service in accordance with distances between virtualization servers and a user are provided. A virtual desktop service suitable for a request of the user is provided to the user so that loads of servers may be dispersed and power usage of the servers may be minimized. That is, in an environment where the virtualization servers that provide the virtual desktop service are locally dispersed, the virtual machines may be allocated to a virtualization server with a shortest network delay based on network distances from the virtualization servers to the user. In addition, after a server power usage amount is predicted in accordance with a virtual machine usage type of the user, a virtualization server may be selected in accordance with the prediction result. | 01-22-2015 |
Sun Young Kim, Kyunggi-Do KR
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20080231121 | Automatically Standby Power Cut-Off Plug Socket - An electric socket is provided. The socket includes a power saving circuit determining operation status of an electronic apparatus or plural electronic apparatus connected to another electric socket according to a load signal to control to supply or automatically interrupt power. It is possible to control power according to operating status of the connected electronic apparatus and to control power supplied to the electronic apparatus connected to a home network. After time has elapsed when the electronic apparatus is not used, power is automatically interrupted so that undesired power consumption due to standby power can be prevented and costs thereof are significantly saved. The electronic apparatus is prevented from accident load inputted from the exterior so that the lifespan of the electronic apparatus can be elongated and user convenience is remarkably improved. | 09-25-2008 |
20110006615 | PLUG SOCKET - Provided is a plug socket which determines operation states of a plurality of electrical devices connected to the plug socket to supply or cut off electric power to the electrical devices and selects a method for supplying or cutting off electric power to the electrical devices by setting a desired mode. Thus, it is possible to prevent the waste of energy and electrical accidents by cutting off the electric power when the electrical devices connected to the plug socket are not used. Especially, since the electric power is supplied only when the electrical devices are used in a home network system, it is possible to efficiently use electricity, significantly reduce unnecessary power consumption, and thus the cost is reduced. Moreover, in the case of a built-in plug socket, it is possible to change the time or method for cutting off electric power by setting a desired mode according to the kind of the electrical device, and thus user convenience is significantly improved. | 01-13-2011 |
Walter Kim, Kyunggi-Do KR
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20150365041 | MOTOR CONTROL SYSTEM AND INTERFACE - A motor control system is presented. The motor control system includes a motor controller and a motor driver. The motor controller and motor driver are coupled by an interface which includes a conductor configured to carry both a motor speed control signal from the motor controller to the motor driver and a motor feedback signal from the motor driver to the motor controller. The motor controller provides a motor speed control signal to the motor driver and the motor driver provides a motor feedback signal to the motor controller. | 12-17-2015 |
Woon Soo Kim, Kyunggi-Do KR
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20100038239 | DEVICE FOR FABRICATING FLEXIBLE FILM - A device for fabricating a flexible film is provided. The device includes a serving unit providing an insulation film; a main processing unit including at least one of a dust removing unit, an etching unit, a neutralizing unit, a coupling unit, a catalyst bonding unit, a plating unit, and a drying unit; an assistant power unit controlling a tension of the insulation film; a top transporter disposed at an upper part of the main processing unit; and a bottom transporter disposed at a lower part of the main processing unit, wherein the top transporter includes a squeezing unit pressing a material on the insulation film. The device can improve the quality of a flexible film by pressing the flexible film using the squeezing unit. | 02-18-2010 |
20100072246 | DEVICE FOR TRANSFERRING FILM - A device for transferring a film is provided. The device includes a roller transferring a film; a balancing unit connected to the roller by fixed supporters, the fixed supporters being disposed on both sides of the roller; and springs disposed on both sides of the balancing unit, wherein, if the film is out of balance, the balancing unit restores balance to the film by vibrating the both sides of the balancing unit. That is, if a film becomes out of balance during the transfer of the film, the device may restore balance to the film with the aid of the balancing unit which can vibrate on both sides of the balancing unit due to the springs. | 03-25-2010 |
Yong-Hwan Kim, Kyunggi-Do KR
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20080298694 | Method for Coding RGB Color Space Signal - A method for coding an RGB color space signal is disclosed. In accordance with the method, a base plane is encoded using an independent mode, and an enhanced plane is encoded by referring to the base plane without converting the RGB color space signal into YCbCr color space signal to reduce a redundancy between RGB planes and improve a compression ratio of an image. | 12-04-2008 |
Young Kuk Kim, Kyunggi-Do KR
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20100333144 | APPARATUS AND METHOD FOR PROVIDING AND OBTAINING PRODUCT INFORMATION THROUGH A BROADCAST SIGNAL - The present invention relates to an apparatus and method for providing and obtaining product information through a broadcast signal. In this present invention, information identifying a product item, which is in a scene to be presented from a broadcast signal, is provided together with a broadcast signal, then a signal receiving terminal stores the product information for a new product item and displays the stored information to a viewer to select one product item while or after watching an interesting broadcast program, and transmits data identifying a selected product item to a predetermined web site and receives web site address for the selected item from that site. As a result, detailed information for the selected item is acquired from a server addressed by the received web site address. | 12-30-2010 |
20150237405 | METHOD AND VIDEO DEVICE FOR ACCESSING INFORMATION - A method and video device are disclosed for accessing information. In an embodiment of the present invention, part of data included in a title, being played, read from a storage medium or extracted from a broadcast signal is extracted and sent to a server over a network, and information corresponding to the part of the data (i.e., information related to the data and complete data of the data) is received from the server and played. Rather than the part of the data, information related to a position of the data, (e.g. a time point at which the playing of the data starts within the title or a radial position or a physical address at which the data is located in the storage medium) may be sent. The data may be data that forms audio, a frame-shaped video clip or a frame-shaped picture included in the title. | 08-20-2015 |
Young Kwan Kim, Kyunggi-Do KR
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20080208858 | METHOD OF MANAGING WEBSITES REGISTERED IN SEARCH ENGINE AND A SYSTEM THEREOF - The present invention relates to a search engine that provides information on a predetermined website on the Internet. According to a preferred embodiment of the present invention, there is provided a method of managing websites registered in a search engine in a search engine administration system, comprising the steps of allowing a predetermined interface module to receive information on a website and allowing a website registration module to sort the received website information by the predetermined field and then to record the sorted information in a database means; extracting a HTML file constituting web pages of the website; detecting a predetermined function that generates a pop-up window by analyzing the extracted HTML file; increasing a predetermined counter value as much as a given value depending on the number of pop-up windows generated due to the detected function; determining whether the counter value exceeds a predetermined value; and if it is determined that the counter value exceeds the predetermined value, controlling a predetermined process to be performed for the registered website | 08-28-2008 |