Patent application number | Description | Published |
20080307641 | Method of fabricating paste bump for printed circuit board - This invention relates to a method of fabricating a paste bump for a printed circuit board, which can decrease the number of printings to thus reduce the fabrication cost and process time in the formation of the paste bump on the printed circuit board. | 12-18-2008 |
20080308315 | Multilayer printed circuit board and method of fabricating the same - This invention relates to a multilayer printed circuit board and a method of fabricating the same, which can increase the reliability of the multilayer printed circuit board and can decrease the process time to thus improve productivity. | 12-18-2008 |
20100096171 | Printed circuit board having round solder bump and method of manufacturing the same - Disclosed herein is a printed circuit board having round solder bumps and a method of manufacturing the same. The solder bump is configured to have a round connecting surface in contact with a pad, and thus have an increased contact area with respect to the pad, thus improving connection reliability. The solder bumps have uniform heights. | 04-22-2010 |
20100139969 | Printed circuit board comprising metal bump and method of manufacturing the same - Disclosed herein is a printed circuit board, including: metal bumps having constant diameters and protruding over an insulation layer; a circuit layer formed beneath the insulation layer; and vias passing through the insulation layer to connect the metal bumps with the circuit layer. | 06-10-2010 |
20100147559 | Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier - The invention relates to a carrier used in the manufacture of a substrate and a method of manufacturing a substrate using the carrier, the method including (A) preparing a carrier comprising a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; (B) patterning the metal layers to form base circuit layers; (C) forming buildup layers on the base circuit layers; (D) executing a routing process to separate the insulating layers from the releasing layer; and (E) forming solder-resist layers on the buildup layers and forming openings in-the solder-resist layers and the insulating layers to expose pads. | 06-17-2010 |
20110048786 | PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board. | 03-03-2011 |
20110159282 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably. | 06-30-2011 |
20110163064 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided. | 07-07-2011 |
20110318480 | Method of manufacturing substrate using a carrier - A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads. | 12-29-2011 |
20120080401 | METHOD OF FABRICATING MULTILAYER PRINTED CIRCUIT BOARD - A method of fabricating a multilayer printed circuit board includes preparing a first substrate, and preparing a second substrate, in parallel to the formation of the first substrate, that is, at the same time of the formation of the first substrate, by forming a third inner circuit pattern on one surface of a third insulating layer and forming a window on the other surface of the third insulating layer. | 04-05-2012 |
20120211464 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING METAL BUMP - A method of manufacturing a printed circuit board, including: providing a metal layer; forming an insulation layer on the metal layer and then forming via holes for exposing the metal layer in the insulation layer; forming vias charged in the via holes and a circuit layer on the insulation layer; and forming metal bumps at ends of the vias. | 08-23-2012 |
20140014398 | CORELESS SUBTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a coreless substrate according to a preferred embodiment of the present invention, the coreless substrate including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a direction of one surface or both surfaces of the first insulating layer, including at least one circuit layer and at least one another pillar connected to the circuit layer; and a plurality of outermost circuit layers contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers. | 01-16-2014 |
20140027156 | MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a multilayer type coreless substrate, the method including: (A) preparing a carrier substrate including at least one copper foil formed on one surface or both surfaces of an insulating surface; (B) forming a coreless printed circuit precursor on one surface or both surfaces of the carrier substrate; (C) separating the carrier substrate; (D) performing a polishing cutting process on the coreless printed circuit precursor; and (E) laminating a plurality of other insulating layers on a flat outer surface of the coreless printed circuit precursor, the plurality of other insulating layers sequentially including other circuit layers and other pillars. | 01-30-2014 |
Patent application number | Description | Published |
20090070653 | METHOD OF TRANSMITTING DATA - A method of transmitting data in a wireless access system is disclosed. The method includes various processes of obtaining the number of code blocks in consideration of an error detection code which is to be attached to each code block, calculating the size of the code blocks, segmenting input data, and channel-coding the code blocks, thereby efficiently transmitting data. | 03-12-2009 |
20090285193 | METHOD FOR MULTIPLEXING DATA AND CONTROL INFORMATION - A method for multiplexing a data information stream, including a systematic symbol and a non-systematic symbol, and a control information stream of at least three types in a wireless mobile communication system is disclosed. The method includes mapping the data information stream to a resource area so that the systematic symbol is not mapped to a specific resource area to which the control information stream is mapped, and mapping the control information stream to the specific resource area. | 11-19-2009 |
20110122794 | METHOD OF REPORTING CHANNEL QUALITY INFORMATION IN A WIRELESS COMMUNICATION SYSTEM - A method for reporting channel quality information in a wireless communication system, and a method for assigning radio resources according to the channel quality information are disclosed. A method for reporting channel quality information by a user equipment (UE) of a wireless communication system measures channel quality information of a downlink multi-carrier including a plurality of downlink component carriers, and transmits the measured channel quality information to a base station. | 05-26-2011 |
20110128942 | METHOD FOR TRANSMITTING CONTROL INFORMATION ABOUT DOWNLINK MULTIPLE CARRIERS IN A WIRELESS COMMUNICATION SYSTEM - A method for transmitting uplink control information in a wireless communication system is disclosed. The method includes receiving one or more downlink component carriers among N downlink component carriers created by dividing a multi-carrier by an integer N, and transmitting control information about the received one or more downlink component carriers in one or more uplink component carriers among N uplink component carriers created by dividing a multi-carrier by the integer N, wherein the control information about the received one or more downlink component carriers is distributed equally or unequally to the one or more uplink component carriers and the control information includes at least one of a Channel Quality Information/Precoding Matrix Index (CQI/PMI), an ACKnowledgment/Negative ACKnowledgment (ACK/NACK), and a Rank Indication (RI). | 06-02-2011 |
20110188594 | METHOD AND APPARATUS FOR TRANSMITTING SIGNALS - Disclosed herein is a method for transmitting signals in a wireless communication system, including joint coding one or more signals, separating the joint coded signal by a number of a plurality of channel aggregation used for transmission, respectively allocating the separated signals to the plurality of the channel aggregation, and transmitting the signals, such that a receiver smoothly performs decoding. | 08-04-2011 |
20110205996 | METHOD OF HARQ ACKNOWLEDGEMENT TRANSMISSION AND TRANSPORT BLOCK RETRANSMISSION IN A WIRELESS COMMUNICATION SYSTEM - A method of transport block retransmission in a wireless communication system employing carrier aggregation is disclosed. A method of retransmitting transport blocks in a base station of a wireless communication system employing carrier aggregation comprises mapping each of a plurality of transport blocks to each of a plurality of component carriers using a first mapping pattern and transmitting the plurality of transport blocks to a mobile station; recognizing that the plurality of transport blocks are not transmitted successfully; and mapping each of the plurality of transport blocks to each of the plurality of component carriers using a second mapping pattern and retransmitting the plurality of transport blocks to the mobile station. | 08-25-2011 |
20110261775 | METHOD AND APPARATUS FOR TRANSMITTING SIGNALS SEGMENTATION - A method for transmitting a transport block includes segmenting the transport block into code blocks corresponding in number to a multiple of the number of layers to be used for the transmission of the transport block, attaching a Cyclic Redundancy Check (CRC) to the segmented code blocks, sequentially mapping the code blocks to which the CRC has been attached to at least one layer according to a predetermined mapping rule, and transmitting the code blocks. | 10-27-2011 |
20110299467 | METHOD OF TRANSMITTING CHANNEL QUALITY INFORMATION OF DOWNLINK MULTI CARRIERS IN A WIRELESS COMMUNICATION SYSTEM - A method of transmitting channel quality information in a wireless communication system is disclosed. The method of transmitting channel quality information from a mobile station in a wireless communication system includes generating channel quality information of a downlink multi carrier including N number of downlink component carriers; and transmitting the generated channel quality information to a base station through at least one of a physical uplink control channel (PUCCH) a physical uplink shared channel (PUSCH) on a single uplink component carrier. | 12-08-2011 |
20110317637 | METHOD FOR PROCESSING AND TRANSMITTING DATA PACKET - A method for processing and transmitting data packet is disclosed. The method includes receiving a data packet with a first Redundancy Version (RV) from a serving cell, receiving a data packet with a second RV different from the first RV from a collaborative cell, and combining and decoding the data packets received from the serving cell and the collaborative cell. | 12-29-2011 |
20120057551 | METHOD FOR MULTIPLEXING DATA AND CONTROL INFORMATION - A method for multiplexing a data information stream, including a systematic symbol and a non-systematic symbol, and a control information stream of at least three types in a wireless mobile communication system is disclosed. The method includes mapping the data information stream to a resource area so that the systematic symbol is not mapped to a specific resource area to which the control information stream is mapped, and mapping the control information stream to the specific resource area. | 03-08-2012 |
Patent application number | Description | Published |
20090141851 | NUCLEAR FUEL ROD FOR FAST REACTORS WITH OXIDE COATING LAYER ON INNER SURFACE OF CLADDING, AND MANUFACTURING METHOD THEREOF - Disclosed herein are a nuclear fuel rod for fast reactors, which includes an oxide coating layer formed on the inner surface of a cladding, and a manufacturing method thereof. The nuclear fuel rod for fast reactors, which includes the oxide coating layer formed on the inner surface of the cladding, can increase the maximum permissible burnup and maximum permissible temperature of the metallic fuel slug for fast reactors so as to prolong the its lifecycle in the fast reactors, thus increasing economic efficiency. Also, the fuel rod is manufactured in a simpler manner compared to the existing method, in which a metal liner is formed, and the disclosed method enables the cladding of the fuel rod to be manufactured in an easy and cost-effective way. | 06-04-2009 |
20090184305 | Resistive memory devices and methods of manufacturing the same - A resistive memory device includes a first electrode and a first insulation layer arranged on the first electrode. A portion of the first electrode is exposed through a first hole in the first insulation layer. A first variable resistance layer contacts the exposed portion of the first electrode and extends on the first insulation layer around the first hole. A first switching device electrically connects to the first resistive switching layer. | 07-23-2009 |
20090184396 | Resistive random access memories and methods of manufacturing the same - Provided are resistive random access memories (RRAMs) and methods of manufacturing the same. A RRAM includes a storage node including a variable resistance layer, a switching device connected to the storage node, and a protective layer covering an exposed part of the variable resistance layer. The protective layer includes at least one of aluminum oxide and titanium oxide. The variable resistance layer is a metal oxide layer. | 07-23-2009 |
20110233194 | PARTIAL HEAT-EMITTING BODY - The present invention provides a partial heat-emitting body including a transparent substrate and a conductive heating element provided within a distance of 20 cm or less from at least one edge portion among edge portions of at least one surface of the transparent substrate. | 09-29-2011 |
20120031746 | TOUCH SCREEN AND MANUFACTURING METHOD THEREOF - The present invention provides a method of manufacturing a touch screen, comprising the steps of: a) forming a conductive layer on a substrate; b) forming an etching resist pattern on the conductive layer; and c) forming a conductive pattern having a line width smaller than the line width of the etching resist pattern by over-etching the conductive layer by using the etching resist pattern and a touch screen manufactured by the method. According to the present invention, a touch screen comprising a conductive pattern having an ultrafine line width can be economically and efficiently provided. | 02-09-2012 |
20120261404 | HEATING ELEMENT AND MANUFACTURING METHOD THEREOF - The present invention provides a heating element, including a transparent substrate, an adhesive agent layer provided on at least one side of the transparent substrate, a conductive heat emitting line provided on the adhesive agent layer, a coating film capsulating the conductive heat emitting line and an upper side of the adhesive agent layer not covered by the heat emitting line, a bus bar electrically connected to the conductive heat emitting line, and a power part connected to the bus bar, and a manufacturing method thereof. | 10-18-2012 |
20120292307 | HEATING GLASS AND MANUFACTURING METHOD THEREOF - The present invention provides a heating glass including a glass; a transparent conductive oxide (TCO) layer formed on one surface of the glass; and a thermal conductive pattern formed on the transparent conductive oxide layer, and a method of manufacturing the same. | 11-22-2012 |
20130020303 | HEATING ELEMENT AND METHOD FOR MANUFACTURING SAME - The present invention relates to a heating element and to a method for manufacturing same, and more particularly, to a heating element and to a method for manufacturing same wherein the heating element comprises a) a transparent substrate, and b) a conductive heating pattern formed on at least one surface of the transparent substrate, wherein the average distance between lines in a vertical direction of the conductive heating pattern is wider than the average distance between lines in a horizontal direction thereof. The heating element according to the present invention not only minimizes the side effects due to diffraction and interference phenomena of light but also exhibits superior heating performance at a low voltage while being invisible. | 01-24-2013 |
20130095329 | FLUORINE-BASED POLYMER THIN FILM AND METHOD FOR PREPARING SAME - The present invention relates to a fluorine-based polymer thin film and a method of manufacturing the same, and the method of manufacturing a fluorine-based polymer thin film according to the present invention comprises the steps of: a) forming the fluorine-based polymer thin film on a first substrate; b) forming a thin layer comprising a first functional group on the fluorine-based polymer thin film; c) forming a thin layer comprising a second functional group on a second substrate; and d) chemically bonding the first functional group and the second functional group to each other. According to the present invention, a fluorine-based polymer thin film can be stably formed on a substrate, and it is possible to improve durability and maintain water repellency and contamination resistance properties over a long period of time. Further, a method of forming the fluorine-based polymer thin film on the substrate according to the present invention has excellent work processability and easiness in repairing when the substrate is broken. | 04-18-2013 |
20130153559 | HEATING ELEMENT AND A PRODUCTION METHOD THEREOF - The present invention relates to a heating element comprising: two or more heating units comprising two busbars and a conductive heating means electrically connected to the two busbars, in which the busbars of the heating units are connected with each other in series and power per unit area of each of the heating units in the heating element decreases as a length of the busbar increases, and a method of preparing the same. | 06-20-2013 |
20130175255 | HEATING ELEMENT AND A MANUFACTURING METHOD THEREOF - The present invention relates to a heating element including a transparent substrate, a bus bar, a power supply connected to the bus bar, a heat emitting pattern line provided on the transparent substrate and electrically connected to the bus bar, and a non-heat emitting pattern line provided on the transparent substrate and not electrically connected to the bus bar, and a method for manufacturing the same. | 07-11-2013 |
20130208198 | DISPLAY DEVICE INCLUDING A CONDUCTIVE PATTERN - The present invention provides a display device comprising a display panel and a conductive pattern, in which the conductive pattern comprises an irregular pattern. | 08-15-2013 |
20130248239 | ELECTRICAL CONDUCTOR AND A PRODUCTION METHOD THEREFOR - Provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electro-conductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that, for at least 30% of the entire surface area of the transparent substrate, when a straight line is drawn intersecting the electroconductive pattern, the ratio of the standard deviation to the mean value of the distances between adjacent points of intersection between the straight line and the electroconductive pattern (the distance distribution ratio) is at least 2%. Also, provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electroconductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that at least 30% of the entire surface area of the transparent substrate is accounted for by continuously distributed closed motifs, and the ratio of the standard deviation to the mean value of the surface areas of the closed motifs (the surface area distribution ratio) is at least 2%. | 09-26-2013 |
20130292373 | HEATING ELEMENT AND MANUFACTURING METHOD THEREOF - The present invention provides a heating element, including a transparent substrate, an adhesive agent layer provided on at least one side of the transparent substrate, a conductive heat emitting line provided on the adhesive agent layer, a coating film capsulating the conductive heat emitting line and an upper side of the adhesive agent layer not covered by the heat emitting line, a bus bar electrically connected to the conductive heat emitting line, and a power part connected to the bus bar, and a manufacturing method thereof. | 11-07-2013 |
20130327757 | HEATING ELEMENT AND METHOD FOR MANUFACTURING SAME - The present invention relates to a heating element in which distortion of a view due to local heating around a heating line does not occur even when a heating value is high, and a method for manufacturing the same. More specifically, the heating element according to the present invention comprises a transparent substrate and conductive heating lines provided on the transparent substrate, in which a line width of the conductive heating line is 10 μm or less and a distance between the conductive heating lines is 500 μm or less. | 12-12-2013 |
20130341079 | TRANSPARENT CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING SAME - The present invention provides a transparent conductive substrate comprising: a transparent substrate, and a conductive pattern provided on the transparent substrate, wherein the conductive pattern comprises line breakage portions performing electric breakage, and a pattern of a broken line formed when the line breakage portions are connected comprises an irregular pattern shape. The present invention can minimize a moiré phenomenon and a diffraction phenomenon by external light by performing line breakage of a regular or irregular conductive pattern by using the irregular pattern. | 12-26-2013 |
20140050980 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY COMPRISING THE SAME - Provided is a negative electrode active material comprising (a) a core including a carbon-based material, and (b) an organic polymer coating layer formed of a polymer compound having a content of a fluorine component of 50 wt % or more on a surface of the core. | 02-20-2014 |
20140050981 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY COMPRISING THE SAME - Provided is a negative electrode active material comprising (a) a core including one or more non-carbon-based materials selected from the group consisting of silicon, nickel, germanium, and titanium, and (b) an organic polymer coating layer formed of a polymer compound having a content of a fluorine component of 50 wt % or more on a surface of the core. | 02-20-2014 |
20140083991 | HEATING ELEMENT AND METHOD FOR MANUFACTURING SAME - The present specification relates to a heating element in which a heating value for each region is controlled or a heating element in which the heating value for each region is controlled and which is inconspicuous, and a method for manufacturing the same. | 03-27-2014 |
20140117003 | HEATING ELEMENT AND METHOD FOR MANUFACTURING SAME - The present specification relates to a heating element in which a heating value for each region is controlled or a heating element in which the heating value for each region is controlled and which is inconspicuous, and a method for manufacturing the same. | 05-01-2014 |
20140158677 | HEATING GLASS AND MANUFACTURING METHOD THEREOF - The present invention provides a heating glass including a glass; a transparent conductive oxide (TCO) layer formed on one surface of the glass; and a thermal conductive pattern formed on the transparent conductive oxide layer, and a method of manufacturing the same. | 06-12-2014 |
20140198269 | TRANSPARENT CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING SAME - The present invention provides a transparent conductive substrate comprising: a transparent substrate, and a conductive pattern provided on the transparent substrate, wherein the conductive pattern comprises line breakage portions performing electric breakage, and a pattern of a broken line formed when the line breakage portions are connected comprises an irregular pattern shape. The present invention can minimize a moiré phenomenon and a diffraction phenomenon by external light by performing line breakage of a regular or irregular conductive pattern by using the irregular pattern. | 07-17-2014 |
20140205054 | NUCLEAR FUEL ROD FOR FAST REACTORS INCLUDING METALLIC FUEL SLUG COATED WITH PROTECTIVE COATING LAYER AND FABRICATION METHOD THEREOF - Provided are a nuclear fuel rod for fast reactors that includes a metallic fuel slug coated with a protective coating layer and a fabrication method thereof. The nuclear fuel rod for fast reactors that includes a surface treated metallic fuel slug and a cladding tube according to the present invention has an excellent effect of stabilizing components of the metallic fuel slug and fission products or impurities, because the interdiffusion between the metallic fuel slug and the cladding tube does not occur. Also, since the uniform coating on the surface of the metallic fuel slug may be facilitated and fabrication costs may be significantly reduced in comparison to a typical technique of using a functional material for preventing the interdiffusion at an inner surface of the cladding tube, it may be suitable for fabricating the nuclear fuel rod for fast reactors. | 07-24-2014 |
20140251429 | CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING SAME - Provided is a conductive structure body comprising: a substrate; a conductive pattern; and a darkened pattern comprising CuOx (009-11-2014 | |
20150075596 | ELECTRICALLY-CONDUCTIVE STRUCTURE AND A PRODUCTION METHOD THEREFOR - An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. | 03-19-2015 |
20150108085 | TOUCH SCREEN AND MANUFACTURING METHOD THEREOF - The present invention provides a method of manufacturing a touch screen, comprising the steps of: a) forming a conductive layer on a substrate; b) forming an etching resist pattern on the conductive layer; and c) forming a conductive pattern having a line width smaller than the line width of the etching resist pattern by over-etching the conductive layer by using the etching resist pattern and a touch screen manufactured by the method. According to the present invention, a touch screen comprising a conductive pattern having an ultrafine line width can be economically and efficiently provided. | 04-23-2015 |
Patent application number | Description | Published |
20080263860 | Method for manufacturing printed circuit board having embedded component - A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board. | 10-30-2008 |
20080310132 | Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can include the operations of forming at least one dam on the surface of the board that surrounds a region corresponding to the bump, forming the bump by printing conductive paste onto the region corresponding to the bump, and stacking the insulation layer onto the surface of the board. This method can be utilized to improve productivity and resolve the problem of spreading. | 12-18-2008 |
20150061093 | INTERPOSER AND SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING INTERPOSER - Disclosed herein is an interposer, including: an interposer substrate configured by stacking an insulating layer of one layer or more and interlayer connected through a via; a cavity penetrating through a center of the interposer substrate in a thickness direction; and a connection electrode having a post part which is disposed on at least one of an upper surface and a lower surface of the interposer substrate, thereby increasing electrical characteristics and reducing manufacturing cost and time. | 03-05-2015 |
20150101857 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - There is provided a method for manufacturing a printed circuit board including: preparing a substrate having a conductive layer formed on at least a portion thereof; forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate; forming a plating seed layer on the insulating layer and the exposed conductive layer; forming an electroplating layer on the plating seed layer by overplating the plating seed layer; and etching the overplated portion in a lump to form a circuit layer in the opening. | 04-16-2015 |
20150129291 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board, including: a substrate; a seed layer formed on the substrate; and a circuit pattern formed on the seed layer and formed so that a diameter of an upper portion thereof and a width of a lower portion thereof are equal to each other or a diameter of the lower portion is larger than that of the upper portion. Therefore, the printed circuit board according to a preferred embodiment of the present invention forms the circuit pattern having the lower portion having the diameter larger than that of the upper portion, such that the electrical signal loss may be decreased and separation of the circuit pattern may be prevented, thereby improving whole reliability of the board. | 05-14-2015 |
Patent application number | Description | Published |
20090095985 | Multi-layer electrode, cross point memory array and method of manufacturing the same - Provided may be a multi-layer electrode, a cross point resistive memory array and method of manufacturing the same. The array may include a plurality of first electrode lines arranged parallel to each other; a plurality of second electrode lines crossing the first electrode lines and arranged parallel to each other; and a first memory resistor at intersections between the first electrode lines and the second electrode lines, wherein at least one of the first electrode lines and the second electrode lines have a multi-layer structure including a first conductive layer and a second conductive layer formed of a noble metal. | 04-16-2009 |
20090116272 | Non-volatile memory device including diode-storage node and cross-point memory array including the non-volatile memory device - Provided are a non-volatile memory device and a cross-point memory array including the same which have a diode characteristic enabling the non-volatile memory device and the cross-point memory array including the same to operate in a simple structure, without requiring a switching device separately formed so as to embody a high density non-volatile memory device. The non-volatile memory device includes a first electrode; a diode-storage node formed on the first electrode; and a second electrode formed on the diode-storage node. | 05-07-2009 |
20090243115 | Semiconductor device and method of manufacturing the same - Provided are a semiconductor device and a method of manufacturing the same. The semiconductor device includes: a memory array on a first substrate; and a peripheral circuit on a second substrate, wherein the first substrate and the second substrate may be attached to each other so that the memory array and the peripheral circuit are electrically connected to each other. | 10-01-2009 |
20100246604 | METHOD FOR MULTIPLEXING DATA INFORMATION AND CONTROL INFORMATION IN WIRELESS COMMUNICATION SYSTEM - A method for multiplexing a control information stream, and a data information stream comprised of systematic symbols and non-systematic symbols in a wireless mobile communication system is described. The multiplexing method includes mapping the data information stream to a resource area, so that the systematic bit symbols are not mapped to a specific resource area where the control information stream is to be mapped, and mapping the control information stream to the specific resource area. | 09-30-2010 |
20100254331 | METHOD FOR MULTIPLEXING DATA AND CONTROL INFORMATION - A method for multiplexing a data information stream and two types of control information streams in a wireless mobile communication system is described. The method includes mapping first control information in units of resource elements onto a matrix for generating input information mapped to a resource block, and mapping second control information onto the matrix so as to map the second control information to resource elements adjacent in a time axis to resource elements allocated for a reference signal in the resource block. The first control information is mapped downwards starting from the first row so as not to overwrite the resource element allocated for the reference signal. | 10-07-2010 |
20100308297 | Heterojunction diode, method of manufacturing the same, and electronic device including the heterojunction diode - Example embodiments relate to a heterojunction diode, a method of manufacturing the heterojunction diode, and an electronic device including the heterojunction diode. The heterojunction diode may include a first conductive type non-oxide layer and a second conductive type oxide layer bonded to the non-oxide layer. The non-oxide layer may be a Si layer. The Si layer may be a p++ Si layer or an n++ Si layer. A difference in work functions of the non-oxide layer and the oxide layer may be about 0.8-1.2 eV. Accordingly, when a forward voltage is applied to the heterojunction diode, rectification may occur. The heterojunction diode may be applied to an electronic device, e.g., a memory device. | 12-09-2010 |
20120240009 | METHOD AND APPARATUS FOR TRANSMITTING UPLINK DATA IN A WIRELESS ACCESS SYSTEM - A method of transmitting data in a wireless access system includes: calculating a number C of code blocks using a size B of an input bit sequence, a maximum size Z of the code blocks, and a size L of a cyclic redundancy check (CRC) which is to be attached to each of the code blocks; calculating a size B′ of a modified input bit sequence using the number C, the size L, and the size B; obtaining a size K of each of the code blocks using the size B′ and the number C; segmenting the input bit sequence to have the number C of the code blocks and the obtained size K of each of the code blocks; generating the code blocks by attaching the CRC to each of the segmented input bit sequences; and channel-coding the code blocks. | 09-20-2012 |
20130182670 | METHOD FOR MULTIPLEXING DATA AND CONTROL INFORMATION - A method for multiplexing a data information stream, including a systematic symbol and a non-systematic symbol, and a control information stream of at least three types in a wireless mobile communication system is disclosed. The method includes mapping the data information stream to a resource area so that the systematic symbol is not mapped to a specific resource area to which the control information stream is mapped, and mapping the control information stream to the specific resource area. | 07-18-2013 |
20130262963 | METHOD AND APPARATUS FOR TRANSMITTING UPLINK DATA IN A WIRELESS ACCESS SYSTEM - A method of channel coding for transmitting data in a wireless access system includes: calculating a number C of code blocks by an equation of C=┌B/(Z−L)┐, wherein B denotes a size of an input bit sequence, wherein Z denotes a maximum size of the code blocks, and wherein L denotes a size of a cyclic redundancy check (CRC) which is to be attached to each of the code blocks; calculating a size B′ of a modified input bit sequence by an equation of B′=B+C*L; generating the code blocks based on the number C of the code blocks and the size B′ of the modified input bit sequence; and channel-coding the code blocks. | 10-03-2013 |
20140341157 | METHOD OF REPORTING CHANNEL QUALITY INFORMATION IN A WIRELESS COMMUNICATION SYSTEM - A method for encoding control information by a user equipment (UE) in a wireless communication system, includes obtaining a plurality of Channel Quality Information (CQIs) for a plurality of downlink carriers, at least one RI (Rank Indicator) and at least one ACK/NACK (Acknowledgement/Negative-ACK); concatenating the plurality of CQIs; encoding the concatenated plurality of CQIs, the at least one RI and the at least one ACK/NACK, separately; and transmitting the encoded plurality of CQIs, the encoded at least one RI and the encoded at least one ACK/NACK on only one uplink carrier. | 11-20-2014 |
20140376498 | METHOD FOR MULTIPLEXING DATA AND CONTROL INFORMATION - A method for multiplexing a data information stream, including a systematic symbol and a non-systematic symbol, and a control information stream of at least three types in a wireless mobile communication system is disclosed. The method includes mapping the data information stream to a resource area so that the systematic symbol is not mapped to a specific resource area to which the control information stream is mapped, and mapping the control information stream to the specific resource area. | 12-25-2014 |
Patent application number | Description | Published |
20080314619 | Conductive paste, printed circuit board, and manufacturing method thereof - A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability. | 12-25-2008 |
20090229875 | Printed circuit board having fine pattern and manufacturing method thereof - A printed circuit board having a fine pattern and related manufacturing method that includes providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate. | 09-17-2009 |
20090236125 | Multi-layer board and manufacturing method thereof - A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times. | 09-24-2009 |
20100126765 | MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A method of manufacturing a multi-layer PCB having external contact pads formed on one side can include: forming an outermost insulation layer, in which openings are formed corresponding with the external contact pads; forming a mask, in which openings are formed corresponding with the external contact pad and with a circuit pattern, on the outermost insulation layer; forming the external contact pads and the circuit pattern in the openings of the outermost insulation layer and the openings of the mask; removing the mask; forming a build-up layer by stacking layers over the outermost insulation layer such that the external contact pads and the circuit pattern are covered; forming a first solder resist layer on the build-up layer; and forming a second solder resist layer on an opposite side of the outermost insulation layer; and forming openings in the second solder resist layer such that the external contact pads are exposed. | 05-27-2010 |
20100148348 | PACKAGE SUBSTRATE - A package substrate is disclosed. The package substrate as a printed circuit board, in which a semiconductor chip is mounted on one side thereof and the other side thereof is mounted on a main board, can include a substrate part, a first pad, which is formed on one side of the substrate part such that the first pad is electrically connected to the semiconductor chip, and a first solder resist layer, which is formed on one surface of the substrate part such that the first pad is exposed. Here, the first solder resist layer is divided into a pad portion and a dummy portion, the first pad is exposed in the pad portion, and the dummy portion is thinner than the pad portion. The package substrate can contribute to the formation of a structure in which thermal expansion coefficients are symmetrical between the top and bottom, thus preventing the warpage. | 06-17-2010 |