Patent application number | Description | Published |
20100289390 | REINFORCED DEVICE HOUSING - A housing for an electronic device or other object formed from a fiber-in-matrix material. A layered fiber-in-matrix type material, such as CFRP, may be used. A spine made from CFRP may support, and be attached to, a CFRP skin. The CFRP spine may be a unitary frame that imparts strength and rigidity to the overall housing and also form at least some of the corners of the frame. In some embodiments, the spine may be rectangular. The skin may be formed from multiple layers of CFRP type material stacked atop each other. Each layer may be cut at one or more corners to expose at least a portion of the layer beneath. The skin may thus have an overall cross shape, such that each arm of the cross may be wrapped around a different side of the aforementioned rectangular spine. | 11-18-2010 |
20110180557 | METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE ENCLOSURE - A method for manufacturing an enclosure for an electronic device including forming the enclosure, forming one or more locating cavities on a surface of the enclosure, attaching one or more blanks to the enclosure using the one or more locating cavities, and processing the one or more attached blanks to form a desired shape thereof. The enclosure may be formed from a fiber-in-matrix material. A layered fiber-in-matrix type material, such as CFRP, may be used. | 07-28-2011 |
20110183580 | APPARATUS AND METHOD FOR INTRICATE CUTS - Certain embodiments disclosed herein relate to apparatuses and methods for intricate cuts. In particular, in one embodiment, a cutting apparatus is provided. The cutting apparatus includes a base member and an elongate member extending from the base member. The elongate member includes a tapered region having an abrasive surface. The tapered region defines at least one vertex defining an angle of a desired cutout shape. Additionally, the tapered region is toothless. | 07-28-2011 |
20110290685 | ELECTRONIC DEVICE ENCLOSURE USING SANDWICH CONSTRUCTION - A housing for an electronic device or other object formed in a layered configuration. The layer or sandwich construction imparts strength and rigidity while decreasing the overall weight to the housing. The case/housing may have a first layer and a second layer formed from a first material. The case may also include a core formed from a second material. Where the first layer may be bonded to a top surface of the core and the second layer may be bonded to a bottom surface of the core. | 12-01-2011 |
20120021196 | SMOOTH COMPOSITE STRUCTURE - Certain embodiments disclosed herein relate to a smooth finish composite structure and methods for making the composite structure. In particular, in one embodiment, a method is provided that includes creating a first layer of a composite structure. The creation of the first layer includes positioning the first layer in a mold and curing the first layer. Additional layers of the composite structure are created and bonded to the first layer. | 01-26-2012 |
20120222985 | COMPOSITE ENCLOSURE - A composite enclosure for housing electronic devices, and methods related thereto, are provided. In particular, in some embodiments, a method of manufacturing a composite enclosure for housing electronic devices includes winding composite material about a mandrel and curing the composite material to create a composite hoop. A panel is formed in a separate process that includes stacking a plurality of composite layers in a mold and curing the composite layers to create a composite panel. The composite hoop and the composite panel are bonded together to form the composite enclosure. | 09-06-2012 |
20130126073 | INTERNAL MOLD RELEASE - A method of manufacturing a releasable composite prepreg for compression, sheet, or bulk molding. The method includes mixing together a resin and a curing agent, adding a release agent to the resin and curing agent creating a releasable epoxy, applying a backing to the releasable epoxy; and positioning a plurality of fibers within the releasable epoxy creating a releasable composite prepreg. The releasable composite prepreg created through the method can be molded to create components without requiring application of an external mold release agent. | 05-23-2013 |
20130148288 | ELECTRONIC DEVICE WITH AN INCREASED FLEXURAL RIGIDITY - An electronic device including at least one electronic component, such as a processor and a housing enclosing the at least one electronic component. The housing including a top skin forming an outer surface of the housing, a bottom skin forming an inner surface of the housing and facing the at least one electronic component, and a core sandwiched by the top skin and the bottom skin. The core is made from a first material having a first modulus of elasticity and the top skin and the bottom skin are made from a second material having a second modulus of elasticity, the second modulus greater than the first. The inner surface of the housing is positioned above the at least one electronic component such that a clearance level is defined between the inner surface of the housing and the at least one electronic component. | 06-13-2013 |
20130273295 | SURFACE FINISH FOR COMPOSITE STRUCTURE - A method is provided for fabricating a composite panel with a surface finish. The method includes securing a polymer film within a first portion of a mold and securing a composite panel within a second portion of the mold. The method also includes holding the first portion of the mold against the second portion of the mold to form a mold cavity between composite panel and the polymer film. The method further includes heating the mold to an elevated temperature, injecting a polymer resin into the mold cavity, and curing the polymer resin to form an integrated structure having a polymer resin layer between the composite panel and the polymer film. | 10-17-2013 |