Keshishian
Craig Keshishian, Newport Beach, CA US
Patent application number | Description | Published |
---|---|---|
20150265191 | ELECTROCHEMICAL DETERMINATION OF INFECTION - Provided herein are devices including a wrapping, such as a bandage or a food wrapper, that can detect incipient infection at wounds or incipient contamination in food by voltage, resistance, and/or current. Methods for detecting incipient microbial infections and incipient microbial contaminations are also included herein. | 09-24-2015 |
Craig Keshishian, San Clemente, CA US
Patent application number | Description | Published |
---|---|---|
20150265191 | ELECTROCHEMICAL DETERMINATION OF INFECTION - Provided herein are devices including a wrapping, such as a bandage or a food wrapper, that can detect incipient infection at wounds or incipient contamination in food by voltage, resistance, and/or current. Methods for detecting incipient microbial infections and incipient microbial contaminations are also included herein. | 09-24-2015 |
Gregory A. Keshishian, Austin, TX US
Patent application number | Description | Published |
---|---|---|
20150191129 | Bicycle Support Apparatus and Method - According to one embodiment, a bicycle support apparatus and method is provided. The bicycle support apparatus can support a bicycle in a horizontal or vertical direction. The bicycle support apparatus can also be secured to any horizontal, vertical, or any angular face. Still further, the bicycle support apparatus can be mounted onto a moveable object, such as an automobile. Slideably secured to an elongated member of the support apparatus is a bicycle fork securement member and a bicycle bottom bracket pad. The securement member secures the fork of the bicycle, and the bicycle bottom bracket rests on the pad. Such securement can be vertically, horizontally, stationary, or moveable configurations. | 07-09-2015 |
Richard P. Keshishian, Chandler, AZ US
Patent application number | Description | Published |
---|---|---|
20120194272 | RF POWER AMPLIFIER INCLUDING BROADBAND INPUT MATCHING NETWORK - An RF power amplifier is disclosed that has improved input matching or reduced return losses over a wider frequency range. The amplifier includes an input impedance matching network, a resistive element, a transistor, and an output impedance matching network. The resistive element is coupled between the input impedance matching network and the input of the transistor. The resistive element is configured to lower the quality factor (Q) of the input impedance matching network. This has the effect of reducing the input impedance variation over a given frequency range. As a result, the overall impedance matching over the given frequency range is improved, thereby reducing the input return losses. This allows the RF power amplifier to be used in wider bandwidth applications. | 08-02-2012 |
Salpi Keshishian, Reseda, CA US
Patent application number | Description | Published |
---|---|---|
20160106063 | Pet bowl liner - A disposable pet bowl liner provides an elastic or adhesive edge such that it may be secured to the rim of the bowl. The liner is waterproof, is provided in several sizes and shapes corresponding to all commercially manufactured pet bowls, and is contoured to closely fit the interior surface of the bowl. When the liner becomes soiled, it is removed and discarded. | 04-21-2016 |
Sarkis Minas Keshishian, Balmain AU
Patent application number | Description | Published |
---|---|---|
20090231384 | PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT FILM HAVING DIFFERENTIATED ADHESIVE LAYERS - A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer. | 09-17-2009 |
20090231400 | PRINTHEAD ASSEMBLY WITH MINIMAL LEAKAGE - A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric web; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric web is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer. | 09-17-2009 |
20100224319 | METHOD OF ASSEMBLING PAGEWIDTH PRINTHEAD - A method of assembling a pagewidth printhead. The method includes: aligning a multilayered adhesive film an said ink supply manifold such that ink supply holes in the film are aligned with respective ink outlets in the ink supply manifold; bonding a first adhesive layer of the film to a manifold bonding surface; heating a printhead integrated circuit and positioning the heated printhead integrated circuit on an opposite side of the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of the printhead integrated circuit; and repeatedly bonding printhead integrated circuits to the film to provide the pagewidth printhead. | 09-09-2010 |
20110085010 | PRINTHEAD ASSEMBLY WITH MINIMAL LEAKAGE - A printhead assembly includes an ink manifold having a plurality of ink outlets defined in a manifold bonding surface; one or more printhead integrated circuits, each printhead integrated circuit having a plurality of ink inlets defined in a printhead bonding surface; and an adhesive film sandwiched between said manifold bonding surface and said one or more printhead bonding surfaces, said film having a plurality of ink supply holes defined therein, each ink supply hole being aligned with an ink outlet and an ink inlet. The adhesive film is a laminated film comprising a central polymeric film sandwiched between a first adhesive layer and a second adhesive layer, the first adhesive layer has a melt temperature lower than that of the second adhesive layer. | 04-14-2011 |