| Patent application number | Description | Published |
|---|
| 20080245549 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - In a method of manufacturing a wiring board, the method includes: (i) forming a plurality of conductive patterns to come into contact with a support plate; (ii) forming a resin layer to cover the plurality of conductive patterns and to come into contact with the support plate; (iii) forming another conductive pattern connected to at least one of the plurality of conductive patterns; and (iv) removing the support plate. A first area of the support plate coming into contact with at least one of the plurality of conductive patterns in step (i) is different in surface roughness from a second area of the support plate coming into contact with the resin layer in step (ii). | 10-09-2008 |
| 20080246146 | WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD - A method of manufacturing a wiring substrate comprises: a first step of forming, on a support plate, an electrode pad made of metal; a second step of etching the support plate in such a manner that the support plate has a shape which includes a projection portion to be contacted with the electrode pad; a third step of forming, on the surface of the support plate, an insulating layer for covering the electrode pad; a fourth step of forming, on the surface of the insulating layer, a conductive pattern to be connected to the electrode pad; and, a fifth step of removing the support plate. | 10-09-2008 |
| 20080257596 | WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD - A semiconductor device | 10-23-2008 |
| 20080258300 | WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD - A semiconductor device | 10-23-2008 |
| 20080298038 | WIRING BOARD AND ITS FABRICATING METHOD - A wiring board has predetermined numbers of wiring layers and insulating layers among the respective wiring layers. The wiring board has an external connecting pad and a surface plating layer for connecting to an external circuit is arranged on the external connecting pad. An area of an external connecting pad is smaller than an area of a surface plating layer thereof. | 12-04-2008 |
| 20090095514 | WIRING BOARD, SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THEM - There are provided steps of providing a dielectric layer and a wiring layer on a surface of a support to form an intermediate body, removing the support from the intermediate body to obtain a wiring board, and carrying out a roughening treatment over a surface of the support before the intermediate body forming step. | 04-16-2009 |
| 20100032196 | MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a multilayer wiring board having a wiring layer, a pad, an insulating layer provided between the wiring layer and the pad, and a plurality of connecting vias provided on the insulating layer and connecting the wiring layer to the pad, the connecting vias are provided on a peripheral edge of the pad. | 02-11-2010 |
| 20100084163 | WIRING BOARD AND METHOD OF FABRICATING THE SAME - A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad. | 04-08-2010 |
| 20100132995 | WIRING BOARD AND METHOD OF PRODUCING THE SAME - A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the wiring board, an outer peripheral edge of the external connection pad is retracted from an outer peripheral edge of the surface plated layer toward a center of the external connection pad. | 06-03-2010 |
| 20110139502 | WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD - A semiconductor device | 06-16-2011 |
