Kenshi Fukumitsu, Shizuoka JP
Kenshi Fukumitsu, Shizuoka JP
Patent application number | Description | Published |
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20080218735 | Laser Processing Method And Device - A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. | 09-11-2008 |
20090166808 | LASER PROCESSING METHOD AND SEMICONDUCTOR CHIP - A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision. | 07-02-2009 |
20090236324 | LASER PROCESSING METHOD AND LASER PROCESSING SYSTEM - An object to be processed | 09-24-2009 |
20100240159 | MANUFACTURING METHOD OF SEMICONDUCTOR LASER ELEMENT - Starting point regions for cutting | 09-23-2010 |
20110222289 | OPTICAL ELEMENT, LASER BEAM OSCILLATION DEVICE AND LASER BEAM AMPLIFYING DEVICE - An optical element | 09-15-2011 |
20110274128 | LASER BEAM WORKING MACHINE - A cylindrical lens ( | 11-10-2011 |
20120006797 | LASER BEAM WORKING MACHINE - A cylindrical lens ( | 01-12-2012 |
20120061356 | LASER MACHINING DEVICE AND LASER MACHINING METHOD - The controllability of modified spots is improved. A laser processing apparatus | 03-15-2012 |
20130252403 | METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE - Multiphoton absorption is generated, so as to form a part which is intended to be cut | 09-26-2013 |
20130344686 | METHOD OF CUTTING OBJECT TO BE PROCESSED - A method of cutting an object which can accurately cut the object is provided. An object to be processed | 12-26-2013 |