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Kenro

Kenro Hirata, Tokyo-To JP

Patent application numberDescriptionPublished
20100157482SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH HEAD AND HARD DISK DRIVE - A main object of the present invention is to provide a suspension substrate which can decrease the whole thickness thereof and limit the generation of warpage. To attain the object, the present invention provides a suspension substrate comprising: an insulation layer, a pair of wirings consisting of an upper wiring formed on one surface of the insulation layer and a lower wiring formed on the other surface of the insulation layer, and a metal substrate formed on the surface of the insulation layer on the lower wiring side.06-24-2010

Kenro Matsuo, Shiga JP

Patent application numberDescriptionPublished
20090266675STEP MECHANISM OF TRANSPORT DEVICE - A transport device includes a plurality of endlessly connected steps (10-29-2009

Kenro Nakamura, Kamakura-Shi JP

Patent application numberDescriptionPublished
20110081832POLISHING DEVICE AND POLISHING METHOD - In one embodiment, a polishing device includes: a rotatable turntable, a holding unit, a separation wall, a slurry supply tube, and a cooling medium supply tube. On an upper surface of the rotatable turntable, a polishing pad is attached. The holding unit rotatably holds an object to be polished and disposes a polished surface of the object to be polished in a manner to face the polishing pad. The separation wall abuts on the upper surface of the polishing pad and sections the polishing pad into a polished region in which the holding unit is provided and an unpolished region in which the holding unit is not provided. The slurry supply tube supplies a slurry to the upper surface of the polishing pad in a polished region side. The cooling medium supply tube supplies a cooling medium to the upper surface of the polishing pad in the unpolished region.04-07-2011

Patent applications by Kenro Nakamura, Kamakura-Shi JP

Kenro Takahashi, Yokosuka JP

Patent application numberDescriptionPublished
20100186830Hydraulic Control Module - Disclosed is a hydraulic control module that can be downsized. The hydraulic control module includes an upper control valve, a lower control valve, and a wiring plate. The upper and lower control valves each include an oil path having a groove portion. A sandwich structure is employed so that the wiring plate is sandwiched between the upper and lower control valves. The wiring plate has a groove portion or a through-hole that is in communication with the at least one of the groove portion of the upper control valve and the groove portion of the lower control valve.07-29-2010

Kenro Yoshino, Nobeoka-Shi JP

Patent application numberDescriptionPublished
20080237509Piping Member - A piping device includes a body, a tube accommodated in the body and defining a flow passage, coupling members each having an insert portion, at one end thereof, to be inserted into the tube in a watertight state, a connecting portion at the other end thereof, and a flange portion at the central part thereof, and holding members each formed with a through hole at the central part thereof. The through hole of the holding member includes, at one end thereof, an expanded-diameter portion having a hole diameter larger than the remaining portion of the through hole. The insert portion of each of the coupling members is fitted into the expanded-diameter portion of the corresponding holding member with the tube passed through the through hole of the holding members and each of the insert portions of the coupling members inserted into each of the two ends of the tube, and the flange portion of each of the coupling members and the corresponding holding member pressed into contact with each other are fitted in a fitting groove formed on the body.10-02-2008
20110030815FLUID MIXING SYSTEM - An object of the present invention is to provide a fluid mixing system able to mix the fluids of different lines by any ratio and control the flow rates of even pulsating fluids, able to control the flow rate of even a pulsating fluid, compact in configuration and able to be installed in a narrow space, and enabling easy pipe laying and pipe connection at the time of installation.02-10-2011

Patent applications by Kenro Yoshino, Nobeoka-Shi JP