Kenro
Kenro Adachi, Kuwana-Shi JP
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20160123840 | MONITORING SYSTEM AND DIAGNOSTIC DEVICE AND MONITORING TERMINAL THEREOF - Provided is a monitoring system including a diagnostic device ( | 05-05-2016 |
Kenro Hirata, Itabashi-Ku JP
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20120243126 | SUSPENSION CIRCUIT BOARD, SUSPENSION FOR HARD DISK AND HARD DISK DRIVE - A suspension circuit board | 09-27-2012 |
20130271874 | SUSPENSION SUBSTRATE, SUSPENSION, HEAD SUSPENSION, HARD DISK DRIVE AND METHOD FOR MANUFACTURING SUSPENSION SUBSTRATE - A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part. | 10-17-2013 |
Kenro Hirata, Tokyo-To JP
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20100157482 | SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH HEAD AND HARD DISK DRIVE - A main object of the present invention is to provide a suspension substrate which can decrease the whole thickness thereof and limit the generation of warpage. To attain the object, the present invention provides a suspension substrate comprising: an insulation layer, a pair of wirings consisting of an upper wiring formed on one surface of the insulation layer and a lower wiring formed on the other surface of the insulation layer, and a metal substrate formed on the surface of the insulation layer on the lower wiring side. | 06-24-2010 |
20110279928 | SUSPENSION SUBSTRATE, SUSPENSION, HEAD SUSPENSION, HARD DISK DRIVE, AND METHOD FOR MANUFACTURING SUSPENSION SUBSTRATE - A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part. | 11-17-2011 |
Kenro Matsuo, Shiga JP
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20090266675 | STEP MECHANISM OF TRANSPORT DEVICE - A transport device includes a plurality of endlessly connected steps ( | 10-29-2009 |
Kenro Nakamura, Kamakura-Shi JP
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20110081832 | POLISHING DEVICE AND POLISHING METHOD - In one embodiment, a polishing device includes: a rotatable turntable, a holding unit, a separation wall, a slurry supply tube, and a cooling medium supply tube. On an upper surface of the rotatable turntable, a polishing pad is attached. The holding unit rotatably holds an object to be polished and disposes a polished surface of the object to be polished in a manner to face the polishing pad. The separation wall abuts on the upper surface of the polishing pad and sections the polishing pad into a polished region in which the holding unit is provided and an unpolished region in which the holding unit is not provided. The slurry supply tube supplies a slurry to the upper surface of the polishing pad in a polished region side. The cooling medium supply tube supplies a cooling medium to the upper surface of the polishing pad in the unpolished region. | 04-07-2011 |
Kenro Nakamura, Oita-Shi JP
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20140242779 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS - According to one embodiment, a semiconductor device manufacturing method includes: bonding a first wafer and a second wafer to each other, to form a stack; rubbing a film attached with a fill material in a thin-film shape into a gap located between a bevel of the first wafer and a bevel of the second wafer, to fill the gap with the fill material; and thinning the first wafer. | 08-28-2014 |
Kenro Nakamura, Oita JP
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20150028493 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor device includes forming an opening in a first substrate and filling the opening with a metal to form a first connection electrode. The first substrate is then polished by chemical mechanical polishing under conditions such that a polishing rate of the metal is less that of the region surrounding the metal. The chemical mechanical polishing thereby causes the first connection electrode to protrude from the surface of the first substrate. The first substrate is stacked with a second substrate having a second connection electrode. The first and second connection electrodes are bonded by applying pressure and heating to a temperature that is below the melting point of the metal of the first connection electrode. | 01-29-2015 |
Kenro Nakamura, Oita Oita JP
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20160064265 | TEMPORARILY BONDING SUPPORT SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - According to one embodiment, there is provided a temporarily bonding support substrate including an underlayer and a heat generable layer. A device substrate is to be temporarily bonded to the heat generable layer on an opposite side of the underlayer. | 03-03-2016 |
Kenro Noguchi, Ichihara-Shi JP
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20150013843 | HEAT TREATING OIL COMPOSITION - A heat-treatment oil composition contains (A) a first base oil with a kinematic viscosity at 40 degrees C. in a range of 5 mm | 01-15-2015 |
20150315512 | WATER-BASED COOLANT - A water-based coolant contains: at least one inorganic acid salt selected from among carbonate, hydrogen carbonate, sesquicarbonate, phosphate, borate, molybdate and tungstate; and a metal corrosion inhibitor. The water-based coolant is excellent in cooling performance and unlikely to cause corrosion of a metal material to be cooled. Therefore, the water-based coolant is suitably usable as a quenchant or a cutting oil. | 11-05-2015 |
20150361517 | HEAT TREATMENT OIL COMPOSITION - A heat-treatment oil composition contains (A) at least one of a hydroxy fused fatty acid having a polymerization degree of 2 or more and a derivative of the hydroxy fused fatty acid. The heat-treatment composition may also contain (B) at least one of a mineral oil and a synthetic oil. | 12-17-2015 |
Kenro Takahashi, Yokosuka JP
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20100186830 | Hydraulic Control Module - Disclosed is a hydraulic control module that can be downsized. The hydraulic control module includes an upper control valve, a lower control valve, and a wiring plate. The upper and lower control valves each include an oil path having a groove portion. A sandwich structure is employed so that the wiring plate is sandwiched between the upper and lower control valves. The wiring plate has a groove portion or a through-hole that is in communication with the at least one of the groove portion of the upper control valve and the groove portion of the lower control valve. | 07-29-2010 |
Kenro Yamaguchi, Noda-Shi JP
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20130016153 | INK REMAINING AMOUNT DETECTING DEVICE, METHOD FOR DETECTING INK REMAINING AMOUNT, AND INK JET PRINTING APPARATUSAANM YAMAGUCHI; KenroAACI Noda-shiAACO JPAAGP YAMAGUCHI; Kenro Noda-shi JPAANM SUGAI; TakashiAACI Noda-shiAACO JPAAGP SUGAI; Takashi Noda-shi JP - According to the present invention, in the case where the amount of ink remaining in an ink tank is detected using light from a light emitting unit, whether or not the amount of remaining ink is smaller than a predetermined value can be accurately determined with a decrease in the life of the light emitting unit suppressed. Thus, the present invention determines a difference between output signals each output by the light receiving unit according to a corresponding one of at least two of a plurality of levels of light emissions from the light emitting unit. Based on the difference, whether or not the amount of remaining ink is smaller than the predetermined value is determined. | 01-17-2013 |
20140285585 | LIQUID EJECTION HEAD AND LIQUID EJECTION APPARATUS - A liquid ejection head is capable of ejecting a liquid through an ejection port, the liquid being supplied from a liquid container with a negative pressure generating section. The liquid ejection head comprises a liquid chamber configured to contain the liquid, a liquid supply section configured to allow the liquid to be supplied from the liquid container to the liquid chamber, and an opening configured to communicate with the liquid chamber and to enable the liquid and/or a gas inside the liquid chamber to flow out through the opening. | 09-25-2014 |
20140285586 | LIQUID EJECTION HEAD AND LIQUID EJECTION APPARATUS - A liquid ejection head is capable of ejecting a liquid through an ejection port, the liquid being supplied from a liquid container with a negative pressure generating section. The liquid ejection head comprises a liquid chamber configured to contain the liquid, a liquid supply section configured to allow the liquid to be supplied from the liquid container to the liquid chamber, and an opening configured to communicate with the liquid chamber and to enable the liquid and/or a gas to flow into the liquid chamber through the opening. | 09-25-2014 |
20150085004 | INK JET PRINTING APPARATUS AND INK JET PRINTING METHOD - An ink jet printing apparatus includes a print head configured to be able to eject an ink fed from an ink tank that contains the ink in a closed space so as to apply a negative pressure to the ink, a communication path configured to allow a liquid chamber in the print head to communicate with an outside of the liquid chamber, an opening and closing unit configured to open and close the communication path, and a control unit configured to open the communication path in accordance with a pressure in the print head via the opening and closing unit, to bring the liquid chamber and the outside into communication with each other. | 03-26-2015 |
Kenro Yoshino, Nobeoka-Shi JP
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20080237509 | Piping Member - A piping device includes a body, a tube accommodated in the body and defining a flow passage, coupling members each having an insert portion, at one end thereof, to be inserted into the tube in a watertight state, a connecting portion at the other end thereof, and a flange portion at the central part thereof, and holding members each formed with a through hole at the central part thereof. The through hole of the holding member includes, at one end thereof, an expanded-diameter portion having a hole diameter larger than the remaining portion of the through hole. The insert portion of each of the coupling members is fitted into the expanded-diameter portion of the corresponding holding member with the tube passed through the through hole of the holding members and each of the insert portions of the coupling members inserted into each of the two ends of the tube, and the flange portion of each of the coupling members and the corresponding holding member pressed into contact with each other are fitted in a fitting groove formed on the body. | 10-02-2008 |
20110030815 | FLUID MIXING SYSTEM - An object of the present invention is to provide a fluid mixing system able to mix the fluids of different lines by any ratio and control the flow rates of even pulsating fluids, able to control the flow rate of even a pulsating fluid, compact in configuration and able to be installed in a narrow space, and enabling easy pipe laying and pipe connection at the time of installation. | 02-10-2011 |