| Patent application number | Description | Published |
|---|
| 20090075428 | ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE - Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure. | 03-19-2009 |
| 20090237135 | SCHMITT TRIGGER HAVING VARIABLE HYSTERESIS AND METHOD THEREFOR - A Schmitt trigger has a first inverter, a second inverter, a bias means, and a transistor. The inverter has an input and an output. The second inverter has an input coupled to the output of the first inverter and has an output. The bias means provides a first bias voltage on a first output terminal. A magnitude of the bias voltage is selectable by a first input signal. The transistor has a first current electrode coupled to a first power supply terminal, a control electrode coupled to the output of the second inverter, a second current electrode coupled to the output of the first inverter, and a body coupled to the first output terminal. Selectability of the magnitude of the bias voltage provides selectability of the hysteresis of the Schmitt trigger. | 09-24-2009 |
| 20090286390 | METHOD OF PACKAGING A SEMICONDUCTOR DEVICE AND A PREFABRICATED CONNECTOR - A method of packaging a first device having a first major surface and a second major surface includes forming a first layer over a second major surface of the first device and around sides of the first device and leaving the first major surface of the first device exposed, wherein the first layer is selected from the group consisting of an encapsulant and a polymer; forming a first dielectric layer over the first major surface of the first device, forming a via in the first dielectric layer, forming a seed layer within the via and over a portion of the first dielectric layer, physically coupling a connector to the seed layer, and plating a conductive material over the seed layer to form a first interconnect in the first via and over a portion of the first dielectric layer. | 11-19-2009 |
| 20090322364 | TEST INTERPOSER HAVING ACTIVE CIRCUIT COMPONENT AND METHOD THEREFOR - A device under test (DUT) is tested via a test interposer. The test interposer includes a first set of contacts at a first surface to interface with the contacts of a load board or other interface of an automated test equipment (ATE) and a second set of contacts at an opposing second surface to interface with the contacts of the DUT. The second set of contacts can have a smaller contact pitch than the contact pitch of the first set of contacts to facilitate connection to the smaller pitch of the contacts of the DUT. The test interposer further includes one or more active circuit components or passive circuit components to facilitate testing of the DUT. The test interposer can be implemented as an integrated circuit (IC) package that encapsulates the circuit components. | 12-31-2009 |
| 20100050275 | DEVICE THAT CAN BE RENDERED USELESS AND METHOD THEREOF - In one form a device having an integrated circuit is rendered useless by providing a piezo element coupled to a voltage terminal of the integrated circuit of the device. A render useless signal is generated by any of several ways. The piezo element, in response to the render useless signal, renders in any one of several ways the device to be rendered useless. The piezo element, when disturbed, generates a voltage which is provided to the voltage terminal of the integrated circuit, the voltage being sufficiently high to render useless at least a portion of the integrated circuit. In other forms the render useless signal renders MRAM circuitry within the device useless by moving a magnetic field across the MRAM circuitry to vary resistance of memory reference cells. In one form the magnetic field is moved by spring-loading or pivoting a magnet that is released by the piezo element. | 02-25-2010 |
| 20100078808 | PACKAGING HAVING TWO DEVICES AND METHOD OF FORMING THEREOF - A method of forming a semiconductor package includes providing a carrier, attaching a first surface of a first device on the carrier, wherein the first surface comprises a first active surface of the first device, and attaching a second surface of a second device on the carrier. In one embodiment, the second surface is opposite a third surface of the second semiconductor die and the third surface comprises a second active surface. A first insulating material can be formed between the first device and the second device. | 04-01-2010 |
| 20100207687 | CIRCUIT FOR A LOW POWER MODE - A circuit has a first transistor having a first current electrode coupled to a first supply voltage terminal and a second current electrode coupled to a virtual supply voltage node. A second transistor has a first current electrode coupled to the first supply voltage terminal and a control electrode coupled to the virtual supply voltage node. A first load has an input and has an output coupled to a second current electrode of the second transistor. A third transistor has a control electrode coupled to the output of the first load. A second load has an input coupled to the first supply voltage terminal, and has an output that is coupled to both a control electrode of the first transistor and a first current electrode of the third transistor. The virtual supply voltage node provides an operating voltage to a circuit module that alternates between normal and drowsy operating modes. | 08-19-2010 |
| 20110003435 | ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE - Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure. | 01-06-2011 |
