Patent application number | Description | Published |
20100127937 | Antenna Integrated in a Semiconductor Chip - An antenna structure is integrated in a semiconductor chip. The antenna structure is formed by at least one of: a) one or more through-silicon vias (TSVs), and b) one or more crack stop structures. In certain embodiments, the antenna structure includes an antenna element formed by the TSVs. The antenna structure may further include a directional element formed by the crack stop structure. In certain other embodiments, the antenna structure includes an antenna element formed by the crack stop structure, and the antenna structure may further include a directional element formed by the TSVs. | 05-27-2010 |
20100148371 | Via First Plus Via Last Technique for IC Interconnects - A multi-tiered IC device contains a first die including a substrate with a first and second set of vias. The first set of vias extends from one side of the substrate, and the second set of vias extend from an opposite side of the substrate. Both sets of vias are coupled together. The first set of vias are physically smaller than the second set of vias. The first set of vias are produced prior to circuitry on the die, and the second set of vias are produced after circuitry on the die. A second die having a set of interconnects is stacked relative to the first die in which the interconnects couple to the first set of vias. | 06-17-2010 |
20100155931 | Embedded Through Silicon Stack 3-D Die In A Package Substrate - An integrated circuit package has a die or die stack with through silicon vias embedded in a package substrate. A method of producing an integrated circuit package embeds at least one die with a through silicon via in a package substrate. The package substrate provides a protective cover for the die or die stack. | 06-24-2010 |
20100174661 | Wireless Branding - A device wirelessly broadcasts branding information associated with a consumer product attached to the device. The branding information is sent to a receiver located remotely from the product. | 07-08-2010 |
20100261310 | Via First Plus Via Last Technique for IC Interconnect - A multi-tiered IC device contains a first die including a substrate with a first and second set of vias. The first set of vias extends from one side of the substrate, and the second set of vias extend from an opposite side of the substrate. Both sets of vias are coupled together. The first set of vias are physically smaller than the second set of vias. The first set of vias are produced prior to circuitry on the die, and the second set of vias are produced after circuitry on the die. A second die having a set of interconnects is stacked relative to the first die in which the interconnects couple to the first set of vias. | 10-14-2010 |
20110042829 | IC Interconnect - A multi-tiered IC device contains a first die including a substrate with a first and second set of vias. The first set of vias extends from one side of the substrate, and the second set of vias extend from an opposite side of the substrate. Both sets of vias are coupled together. The first set of vias are physically smaller than the second set of vias. A second die having a set of interconnects is stacked relative to the first die in which the interconnects couple to the first set of vias. | 02-24-2011 |
20140044307 | SENSOR INPUT RECORDING AND TRANSLATION INTO HUMAN LINGUISTIC FORM - Systems, methods, and devices use a mobile device's sensor inputs to automatically draft natural language messages, such as text messages or email messages. In the various embodiments, sensor inputs may be obtained and analyzed to identify subject matter which a processor of the mobile device may reflect in words included in a communication generated for the user. In an embodiment, subject matter associated with a sensor data stream may be associated with a word, and the word may be used to assemble a natural language narrative communication for the user, such as a written message. | 02-13-2014 |
20140329192 | Electronically Enabled Removable Dental Device - A dental device is provided in which the dental device comprises electronic components for ornamental functionality as well as orthodontic functionality. The dental device comprises components for light, sound, and video display for patients with braces, or for recreational users. | 11-06-2014 |