Patent application number | Description | Published |
20080284092 | SHEET FOLDING APPARATUS, SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - A sheet processing apparatus for an image forming apparatus is configured so as to be capable of preventing the misalignment of the end edge of sheets to be scooped and transported from an intermediate tray, and reliably preventing the so-called displacement of end edges in the post-processing steps of sheets as a recording medium with an image formed thereon, and thereby preventing the inferior appearance during binding. A sheet folding apparatus enables a user to easily adjust the misalignment of the fold line of sheets that occurs during actual use, in the middle folding processing steps of sheets as a recording medium with an image formed thereon. | 11-20-2008 |
20090221143 | METHOD OF CLEANING AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - A method of cleaning for removing metal compounds attached to a surface of a substrate, wherein the cleaning is conducted by supplying a supercritical fluid of carbon dioxide comprising at least one of triallylamine and tris(3-aminopropyl)amine to the surface of the substrate and a process for producing a semiconductor device using the method of cleaning are provided. In accordance with the method of cleaning and the method for producing a semiconductor device using the method, etching residues or polishing residues containing metal compounds are efficiently removed selectively from the electroconductive material forming the electroconductive layer. When the electroconductive layer is a wiring, an increase in resistance due to residual metal compounds can be suppressed, and an increase in the leak current due to diffusion of the metal from the metal compounds to the insulating film can be prevented. Therefore, reliability on the wiring is improved, and the yield of the semiconductor device can be increased. | 09-03-2009 |
20100197136 | COMPOSITION FOR CLEANING AND RUST PREVENTION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT OR DISPLAY ELEMENT - A composition for cleaning and corrosion inhibition which is used in a step of manufacturing a semiconductor device or a display device having a copper-containing metallic wiring is provided, wherein the corrosion inhibitor component is any one of pyrazole, a pyrazole derivative such as 3,5-dimethylpyrazole, a triazole derivative such as 1,2,4-triazole, an aminocarboxylic acid such as iminodiacetic acid or ethylenediaminedipropionic acid hydrochloride, or a disulfide compound such as diisopropyl disulfide or diethyl disulfide; and the cleaning agent component is any one of ammonium fluoride, tetramethylammonium fluoride, ammonium acetate, acetic acid, glyoxylic acid, oxalic acid, ascorbic acid, 1,2-diaminopropane or dimethylacetamide. Also, a method for manufacturing a semiconductor device or the like using the composition for cleaning and corrosion inhibition is provided. | 08-05-2010 |
20110212617 | LIQUID FOR PROTECTING COPPER WIRING SURFACE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CIRCUIT ELEMENT - A copper wiring material surface protective liquid is provided that is used in production of a semiconductor circuit device containing copper wiring, and consists of an aqueous solvent and an acetylene alcohol compound containing at least 3-phenyl-2-propyn-1-ol. A method for producing a semiconductor circuit device is provided that contains: forming an insulating film and/or a diffusion preventing film on a silicon substrate; then forming a copper film by a sputtering; then forming a copper film or a copper alloy film containing 80% by mass or more of copper thereon by a plating method; and flattening the film by a chemical mechanical polishing (CMP) method, thereby providing a semiconductor substrate containing a flattened copper wiring, in which the semiconductor substrate having an exposed surface of a copper wiring material is treated by making in contact with the copper wiring material surface protective liquid. | 09-01-2011 |
20110237071 | COPPER WIRING SURFACE PROTECTIVE LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR CIRCUIT - A copper wiring material surface protective liquid for production of a semiconductor device is provided, containing an oxyalkylene adduct of an acetylenediol containing an acetylenediol having an oxyalkylene having 2 or 3 carbon atoms added thereto. A method for producing a semiconductor circuit device is provided, containing: forming an insulating film and/or a diffusion preventing film on a silicon substrate; then forming a copper film by a sputtering method; then forming a copper wiring containing 80% by mass or more of copper thereon by a plating method; and flattening the wiring by a chemical mechanical polishing (CMP) method, thereby providing a semiconductor substrate containing a copper wiring, the semiconductor substrate having an exposed surface of a copper wiring material being treated by making in contact with the copper wiring material surface protective liquid. | 09-29-2011 |
20110278635 | Method for producing electronic device substrate, method for manufacturing electronic device, electronic device substrate, and electronic device - A method for producing a substrate for an electronic device, that can improve light extraction efficiency, can easily produces and has high liability is provided. The method includes: a step of heat-melting a glass raw material or a glass to produce a molten glass; a forming step of continuously feeding the molten glass to a bath surface of a molten metal bathtub accommodating a molten metal to form a continuous glass ribbon | 11-17-2011 |
20120135604 | PROCESSING LIQUID FOR SUPPRESSING PATTERN COLLAPSE OF FINE METAL STRUCTURE, AND METHOD FOR PRODUCING FINE METAL STRUCTURE USING SAME - There are provided a processing liquid that is capable of suppressing pattern collapse of a fine metal structure, such as a semiconductor device and a micromachine, and a method for producing a fine metal structure using the same. The processing liquid for suppressing pattern collapse of a fine metal structure, contains a phosphate ester and/or a polyoxyalkylene ether phosphate ester, and the method for producing a fine metal structure, uses the same. | 05-31-2012 |
20120181249 | PROCESSING LIQUID FOR SUPPRESSING PATTERN COLLAPSE OF FINE METAL STRUCTURE AND METHOD FOR PRODUCING FINE METAL STRUCTURE USING SAME - There are provided a processing liquid for suppressing pattern collapse of a fine metal structure, containing at least one member selected from an imidazolium halide having an alkyl group containing 12, 14 or 16 carbon atoms, a pyridinium halide having an alkyl group containing 14 or 16 carbon atoms, an ammonium halide having an alkyl group containing 14, 16 or 18 carbon atoms, a betaine compound having an alkyl group containing 12, 14 or 16 carbon atoms, and an amine oxide compound having an alkyl group containing 14, 16 or 18 carbon atoms, and a method for producing a fine metal structure using the same. | 07-19-2012 |
20120205345 | TREATMENT SOLUTION FOR PREVENTING PATTERN COLLAPSE IN METAL FINE STRUCTURE BODY, AND PROCESS FOR PRODUCTION OF METAL FINE STRUCTURE BODY USING SAME - There are provided a processing liquid for suppressing pattern collapse of a fine metal structure, containing a pattern collapse suppressing agent that has a hydrocarbyl group containing any one of an alkyl group and an alkenyl group, both of which may be substituted partly or entirely by a fluorine atom, and contains an oxyethylene structure, and a method for producing a fine metal structure using the same. | 08-16-2012 |
20120214722 | TREATMENT SOLUTION FOR PREVENTING PATTERN COLLAPSE IN METAL FINE STRUCTURE BODY, AND PROCESS FOR PRODUCTION OF METAL FINE STRUCTURE BODY USING SAME - There are provided a processing liquid for suppressing pattern collapse of a fine metal structure, containing at least one member selected from the group consisting of an ammonium halide having a fluoroalkyl group, a betaine compound having a fluoroalkyl group, and an amine oxide compound having a fluoroalkyl group, and a method for producing a fine metal structure using the same. | 08-23-2012 |
20120223054 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus includes a first processing chamber and a second processing chamber, a first substrate holding unit that holds a substrate in the first processing chamber, a chemical solution supply unit that supplies a chemical solution containing an etching component and a thickening agent to the substrate held by the first substrate holding unit, a substrate transfer unit that transfers the substrate from the first processing chamber to the second processing chamber in a state in which the chemical solution is held on the substrate, and a second substrate holding unit that holds a plurality of substrates on each of which the chemical solution is held in the second processing chamber. | 09-06-2012 |
20130045597 | LIQUID COMPOSITION FOR CLEANING SEMICONDUCTOR SUBSTRATE AND METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE USING THE SAME - [Problems] An object of the present invention is to provide a cleaning liquid composition which removes residual liquid and contaminants after chemical-mechanical polishing (CMP) of the surface of a semiconductor substrate in the production process of a semiconductor circuit device; and a cleaning method using the cleaning liquid composition. | 02-21-2013 |
20130196497 | METHOD FOR PRODUCING TRANSISTOR - According to the present invention, there is provided a process for producing a transistor having a high precision and a high quality with a high yield by selectively etching a natural silicon oxide film, and further by selectively etching a dummy gate made of silicon. The present invention relates to a process for producing a transistor using a structural body which includes a substrate, and a dummy gate laminate formed by laminating at least a high dielectric material film and a dummy gate made of silicon having a natural silicon oxide film on a surface thereof, a side wall disposed to cover a side surface of the laminate and an interlayer insulating film disposed to cover the side wall which are provided on the substrate, said process including an etching step using a specific etching solution and thereby replacing the dummy gate with an aluminum metal gate. | 08-01-2013 |
20140198342 | INFORMATION APPARATUS AND INFORMATION PROCESSING SYSTEM - An information apparatus includes an apparatus information obtaining unit that obtains apparatus information from a plurality of apparatuses connected via a network to the information apparatus, an apparatus selection unit that selects a target apparatus from the plurality of apparatuses based on the obtained apparatus information, and a process result obtaining unit that sends a request to the target apparatus to request the target apparatus to perform a process corresponding to the request, and obtains a result of the performed process from the target apparatus. | 07-17-2014 |
20140204780 | WIRELESS DEVICE, ROUTER, WIRELESS SYSTEM, AND METHOD FOR HIGH-SPEED OPTIMIZATION OF WIRELESS TRANSMISSION - A wireless transmission path monitoring unit of a wireless device monitors the state of a wireless transmission path, transmits a PAUSE command stipulated in a MAC control protocol to a router, and performs a band limitation for the router regardless of a margin of a buffer when the state of the wireless transmission path has changed. In this way, it is possible to shorten the processing time until the band limitation is applied to the router after the state of the wireless transmission path changes, and to suppress transmission delay due to retransmission of transmission data. | 07-24-2014 |
20140283992 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a first processing chamber and a second processing chamber, a first substrate holding unit that holds a substrate in the first processing chamber, a chemical solution supply unit that supplies a chemical solution containing an etching component and a thickening agent to the substrate held by the first substrate holding unit, a substrate transfer unit that transfers the substrate from the first processing chamber to the second processing chamber in a state in which the chemical solution is held on the substrate, and a second substrate holding unit that holds a plurality of substrates on each of which the chemical solution is held in the second processing chamber. | 09-25-2014 |
20150089518 | INFORMATION PROVIDING APPARATUS, INFORMATION PROVIDING METHOD AND NON-TRANSITORY COMPUTER READABLE RECORDING MEDIUM FOR RECORDING AN INFORMATION PROVIDING PROGRAM - According to one embodiment, an information providing apparatus has a receiver, an input and a processor. The receiver is configured to receive area information, program information and subtitle information, the area information regarding a broadcast area of programs and corresponding to an area designated by a user, the program information regarding the programs, the subtitle information regarding subtitles included in the programs. The input is configured to input a first keyword. The processor is configured to search the first keyword from the subtitle information, and to generate attention information regarding at least one of an attention program by using a search result of the first keyword from the subtitle information, the programs broadcast in the designated area. | 03-26-2015 |