Patent application number | Description | Published |
20080239291 | Inspection apparatus and inspection method - An elevating drive mechanism and an advancing drive mechanism are controlled, by means of control processing of the start of photomultiplier tube idling, such that the vertical irradiation position of a laser beam falls on a reflective plate and, during idling, laser beam is irradiated via reflective plate on photodetectors, which are photomultiplier tubes. When idling has come to an end and the inspection start of the following wafer occurs, a diagnosis of photomultiplier tubes is carried out. In case, as a result of the diagnosis, it is determined that photomultiplier tubes have degraded, an alarm is given that the photomultiplier tubes have degraded. | 10-02-2008 |
20080291437 | METHOD OF INSPECTING A SEMICONDUCTOR DEVICE AND AN APPARATUS THEREOF - A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined. | 11-27-2008 |
20100140474 | METHOD OF INSPECTING A SEMICONDUCTOR DEVICE AND AN APPARATUS THEREOF - A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined. | 06-10-2010 |
20110276299 | REFERENCE WAFER FOR CALIBRATION OF DARK-FIELD INSPECTION APPARATUS,METHOD OF MANUFACTURING REFERENCE WAFER FOR CALIBRATION OF DARK-FIELD INSPECTION APPARATUS, METHOD OF CALIBRATING DARK-FIELD INSPECTION APPARATUS, DARK-FIELD INSPECTION APPARATUS, AND A WAFER INSPECTION METHOD - A technology capable of ensuring measurement results of a dark-field inspection apparatus up to a microscopic area is provided. A dark-field inspection apparatus is calibrated using a bulk wafer as a reference wafer, the bulk wafer having microroughness of an irregular asperity pattern accurately formed on a surface, and the microroughness of the surface having an ensured microroughness degree. The microroughness can be more accurately formed by a chemical treatment with a chemical solution. This microroughness is measured by using an AFM, and an expected haze value is obtained based on the measured value. Then, haze of the surface of the reference wafer is measured by the dark-field inspection apparatus to be inspected to obtain an actually-measured haze value, and a difference between the expected haze value and the actually-measured haze value is obtained. Based on this difference, a haze measurement parameter of the dark-field inspection apparatus is adjusted so that the actually-measured haze value and the expected haze value match each other. | 11-10-2011 |
20120006131 | METHOD OF INSPECTING A SEMICONDUCTOR DEVICE AND AN APPARATUS THEREOF - A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined. | 01-12-2012 |
20120046884 | SURFACE INSPECTING APPARATUS AND METHOD FOR CALIBRATING SAME - While an illumination optical system | 02-23-2012 |
20120312104 | METHOD OF INSPECTING A SEMICONDUCTOR DEVICE AND AN APPARATUS THEREOF - A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined. | 12-13-2012 |
20130242293 | Appearance Inspection Apparatus - An appearance inspection apparatus analyzes a difference in detection characteristics of detection signals obtained by detectors to flexibly meet various inspection purposes without changing a circuit or software. The apparatus includes a signal synthesizing section that synthesizes detection signals from the detectors in accordance with a set condition. An input operating section sets a synthesizing condition of the detection signal by the signal synthesizing section, and an information display section displays a synthesizing map structured based on a synthesized signal which is synthesized by the signal synthesizing section in accordance with a condition set by the input operating section. | 09-19-2013 |
Patent application number | Description | Published |
20090141264 | Method and Apparatus for Observing and Inspecting Defects - A defect inspecting apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. Also included is a display for displaying the optical image detected by this lighting and detecting apparatus; an optical parameter setting device for setting and displaying optical parameters for the lighting and detecting apparatus on the display; and optical parameter adjusting apparatus for adjusting optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus; a storage device for storing comparative image data; and a defect detecting device for detecting defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage. | 06-04-2009 |
20090214102 | DEFECT INSPECTION METHOD AND APPARATUS - A method of inspecting patterns, including: adjusting a brightness of at least one of a first bright field image and a second bright field image detected from a specimen and directed to similar patterns on differing parts of the specimen, so as to more closely match a brightness; comparing the images which are adjusted in brightness to match with each other to detect dissimilarities indicative of a defect of the pattern, wherein in adjusting the brightness, the brightness between the first bright field image and the second bright field image is adjusted by performing a gradation conversion of at least one of the brightness between the first bright field image and the second bright field image; and wherein in the comparing, said defect of the pattern is detected by using information of a scattered diagram of brightness of the first bright field image and the second bright field image. | 08-27-2009 |
20110170765 | DEFECT INSPECTION METHOD AND APPARATUS - Arrangements for inspecting a specimen on which plural patterns are formed; capturing a first image of a first area; capturing a second image of a second area in which patterns which are essentially the same with the patterns formed in the first area; creating data relating to corresponding pixels of the first and second images, for each pixel; determining a threshold for each pixel for detecting defects directly in accordance with the first and second images; and detecting defects on the specimen by processing the first and second images by using the threshold for each pixel and information of a scattered diagram of brightness of the first and second images, wherein the threshold is determined by using information of brightness of a local region of at least one of the first and second images, with the local region including an aimed pixel and peripheral pixels of the aimed pixel. | 07-14-2011 |
20120128230 | DEFECT INSPECTION METHOD AND APPARATUS - An inspection method, including: illuminating a light on a wafer on which plural chips having identical patterns are formed; imaging corresponding areas of two chips formed on the wafer to obtain inspection images and reference images with an image sensor; and processing the obtained inspection image and the reference image to produce a difference image which indicates a difference between the inspection image and the reference image and detect a defect by comparing the difference image with a threshold, wherein a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging peripheral portion of the wafer is different from a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging central portion of the wafer. | 05-24-2012 |
20140317392 | OPERATING SYSTEM MANAGEMENT OF SECOND OPERATING SYSTEM - The present invention provides a method of easily managing two or more OSs. A host OS, a guest OS, and a virtualization module are loaded into a primary physical address area of a main memory. The guest OS is executed in a virtual environment in a primary physical address area. A memory image of the guest OS loaded in the primary physical address area is copied to a secondary physical address area. The right of access to a processor is transferred to the guest OS copied in the secondary physical address area to execute the guest OS in a physical environment. | 10-23-2014 |
20140337610 | ARRANGEMENT FOR SECURE INDEPENDENT OPERATING ENVIRONMENTS IN A COMPUTER - The present invention protects a memory image of an OS in a sleep state. A CPU executes a first OS or a second OS while switching there between. The first OS is loaded into a main memory, and the second OS is loaded into an auxiliary memory. The auxiliary memory may be connected to a chipset through a PCIe interface. The main memory and the auxiliary memory are configured such that, when one is in an active state where the right of access to the CPU is obtained, the other makes a transition to the sleep state where there is no right of access to the CPU while maintaining the memory image. In order to prevent one OS in the active state from accessing the main memory or the auxiliary memory in which the memory image of the other OS in the sleep state is stored, the BIOS may set a corresponding controller to disabled during a POST. | 11-13-2014 |
Patent application number | Description | Published |
20110304746 | IMAGE CAPTURING DEVICE, OPERATOR MONITORING DEVICE, METHOD FOR MEASURING DISTANCE TO FACE, AND PROGRAM - An imaging device ( | 12-15-2011 |
20120076438 | VISUAL LINE ESTIMATING APPARATUS - The visual line estimating apparatus | 03-29-2012 |
20120170027 | EXTERNAL LIGHT GLARE ASSESSMENT DEVICE, LINE OF SIGHT DETECTION DEVICE AND EXTERNAL LIGHT GLARE ASSESSMENT METHOD - Disclosed are an ambient light reflection determination apparatus and an ambient light reflection determination method enabling to determine reflection without using an edge and even in a case where luminance of a reflection generating part in eyeglasses is low. In a reflection determination apparatus ( | 07-05-2012 |
20120177266 | PUPIL DETECTION DEVICE AND PUPIL DETECTION METHOD - A pupil detection device and a pupil detection method, which are capable of stably detecting the pupil by actively using information of cornea-reflected image even when most of the pupil is hidden by the cornea-reflected image. In pupil detection device ( | 07-12-2012 |
20130170754 | PUPIL DETECTION DEVICE AND PUPIL DETECTION METHOD - Disclosed is a pupil detection device capable improving the pupil detection accuracy even if a detection target image is a low-resolution image. In a pupil detection device ( | 07-04-2013 |
20130200995 | APPARATUS FOR CONTROLLING VEHICLE OPENING/CLOSING ELEMENT - A system for controlling vehicle opening/closing element has a radiation block for irradiating near-infrared light to a peripheral region of an opening/closing element; a photographing block that photographs an image irradiated with the near-infrared light; a hand region extraction block that extracts a user's hand region from brightness of an image photographed by the photographing block; a motion detection block that detects motions of the user's hand from the extracted hand region; and a control block that determines whether or not the detected motions coincide with previously-set predetermined motions and that commands operation of the opening/closing element in accordance with the determined motions. | 08-08-2013 |