Inventors list

Assignees list

Classification tree browser

Top 100 Inventors

Top 100 Assignees


Kenichi Muramatsu

Kenichi Muramatsu, Sagamihara-Shi JP

Patent application numberDescriptionPublished
20080239274Illumination optical system, exposure apparatus, and exposure method - An illumination optical system for, when installed in an exposure system, realizing a suitable illumination condition by varying the polarized state of the illumination light according to the pattern characteristics of the mask while suppressing the loss of the intensity of the light. The illumination optical system has a light source unit for supplying a linearly polarized light for illuminating surfaces to be illuminated therewith, and a polarized state changing device for changing the polarized state of the illuminating light from a predetermined polarized state to a nonpolarized state and vice versa. The polarized state changing device is arranged in the optical path between the light source unit and the surfaces to be illuminated. The polarized state changing device can be removed from the illumination optical path and has a depolarizer for selectively depolarizing the incident linearly polarized light.10-02-2008
20100110534Wavelength conversion element, wavelength conversion method, phase matching method, and light source device - A wavelength conversion element is provided as one including a monocrystalline nonlinear optical crystal. The nonlinear optical crystal has: a plurality of first regions having a polarity direction along a predetermined direction; a plurality of second regions having a polarity direction opposite to the predetermined direction; an entrance face into which a fundamental incident wave having a wavelength λ and a frequency ω is incident in a direction substantially perpendicular to the predetermined direction; and an exit face from which a second harmonic with a frequency 2ω generated in the crystal emerges. The plurality of first and second regions are formed as alternately arranged in a period substantially equal to d expressed by a predetermined expression, between the entrance face and the exit face.05-06-2010
20100149511Illumination optical system, exposure apparatus, and exposure method - An illumination optical system illuminates an irradiated surface with light supplied from a light source. The illumination optical system includes a diffractive optical element disposed in an optical path of linearly polarized light supplied from the light source. The diffractive optical element forms a multipole illumination field including a plurality of illumination fields. The illumination optical system also includes an optical integrator that forms a multipole light source including a plurality of planar light sources with light that has passed through the multipole illumination field. The illumination optical system also includes a polarization optical member disposed in an illumination optical path and that sets a polarization direction of light that has passed through the multipole light source to a predetermined polarization direction.06-17-2010
20100225895Illumination optical system, exposure apparatus, and exposure method - An illumination optical system and method illuminates an irradiated surface based on linearly polarized light supplied from a light source. The illumination optical system includes a depolarizer which is selectively positioned between a first position in an optical path of the illumination optical system and a second position outside of the optical path, and has a crystal member whose thickness in a direction along an optical axis of the illumination optical system varies in a direction crossing the optical axis.09-09-2010

Kenichi Muramatsu, Hamamatsu-Shi JP

Patent application numberDescriptionPublished
20100055876Laser processing method and laser processing apparatus - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.03-04-2010
20100176100LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.07-15-2010

Patent applications by Kenichi Muramatsu, Hamamatsu-Shi JP

Kenichi Muramatsu, Shizuoka JP

Patent application numberDescriptionPublished
20090008373Laser Processing Method - A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 01-08-2009
20090107967METHOD FOR CUTTING WORKPIECE - A method of cutting an object to be processed is provided, which can accurately cut an object to be processed comprising a substrate and a multilayer part provided on the front face of the substrate while having a plurality of functional devices into the functional devices along a line to cut in a short time even when the substrate is thick. A substrate 04-30-2009
20090117712LASER PROCESSING METHOD - A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions 05-07-2009
20090166342Laser Material Processing System - A laser processing apparatus comprises a converging lens 07-02-2009
20090302428LASER BEAM MACHINING METHOD AND SEMICONDUCTOR CHIP - An object to be processed 12-10-2009

Patent applications by Kenichi Muramatsu, Shizuoka JP