Patent application number | Description | Published |
20080304026 | IMMERSION EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD - An immersion exposure apparatus includes a projection optical system, a first supply unit, and a second supply unit. The projection optical system projects exposure light from an original onto a substrate. The first supply unit forms a first liquid film in a space formed between the projection optical system and the substrate by supplying first liquid. The space includes a light path of the exposure light. The second supply unit forms a second liquid film around the first liquid film by supplying second liquid that is different from the first liquid. | 12-11-2008 |
20090237638 | EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD - An exposure apparatus for exposing a substrate through liquid includes a stage for holding and moving the substrate. The stage includes a holding section for holding the substrate and a supporting section disposed around the holding section. The supporting section includes a recovery port including a gap between the substrate held by the holding section and the supporting section, the recovery port for recovering the liquid, a space for storing the liquid recovered through the recovery port, a liquid recovery mechanism for draining the liquid that has collected in a lower part of the space, and a sloshing reduction member disposed in the space, the sloshing reduction member for reducing sloshing of the liquid. | 09-24-2009 |
20100141911 | EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD - An exposure apparatus, exposing a substrate via liquid so as to transfer a pattern of a mask onto the substrate, includes a stage configured to move while holding the substrate. The stage includes a substrate supporting portion on which the substrate is disposed, a supporting surface disposed outside the substrate supporting portion configured to support the liquid together with the substrate, and a frame portion formed so as to surround the supporting surface. The frame portion includes a depression and a member whose top surface is located in a plane including the supporting surface. | 06-10-2010 |
20120170010 | EXPOSURE APPARATUS AND METHOD OF MANUFACTURING DEVICE - An exposure apparatus which projects a pattern of an original onto a substrate via a liquid to expose the substrate, includes a substrate stage which holds the substrate and moves, the substrate stage including a peripheral member arranged to surround a region in which the substrate is arranged, the peripheral member having a holding surface which holds the liquid, wherein a trench which traps the liquid is formed in the peripheral member, and the trench is arranged to surround the region in which the substrate is arranged, and includes a bottom portion, an inner-side surface extending from the holding surface toward the bottom portion, and an outer-side surface, the inner-side surface having a slant which increases stepwise or continuously in a direction away from the holding surface, and the outer-side surface is provided with a spattering preventing portion which prevents spattering of the liquid trapped by the trench. | 07-05-2012 |
20140327183 | IMPRINT METHOD AND IMPRINT APPARATUS - An object is to provide an imprint method or an imprint apparatus that not only reduces the time for filling with resin or reduces pattern defects, but also reduces the surface roughness of resin. An imprint method brings a resin on a substrate and a mold having a pattern into contact with each other to transfer the pattern onto the substrate. The imprint method includes a step of bringing the resin on the substrate and the mold into contact with each other while a space between the substrate and the mold is filled with a predetermined gas, a step of curing the resin while the resin and the mold are in contact with each other, and a step of separating the resin and the mold. The predetermined gas contains a first gas having a solubility of 0.36 mol/liter or more in the resin and a second gas having a solubility of less than 0.36 mol/liter in the resin, at 20° C. and a pressure of 1 atmosphere. | 11-06-2014 |
20150014876 | IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD - Provided is an imprint apparatus that applies a resin to several locations on a substrate, brings the resin and a mold into contact, and transfers a contoured pattern formed in the mold to the resin, comprising: a controller that sets a principal axis direction according to the contoured pattern and determines the application positions of the resin based on the principal axis direction that has been set such that the distances between resin drops that have been applied so as to be separated in the principal axis direction is larger than the distances between resin drops that have been applied so as to be separated in a direction that is perpendicular to the principal axis direction; and a dispenser that applies the resin based on the application position that has been determined. | 01-15-2015 |
20150014877 | IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD - Provided is an imprint apparatus that applies a resin (drops) dispersed, at a plurality of locations on a substrate, brings the resin and a mold into contact, and transfers the contoured pattern that is formed in the mold to the resin comprising: a controller that sets a principal axis direction according to the contoured pattern and an array direction in which a plurality of resin drops are aligned, and determines application positions for the resin such that the array direction is angled with respect to the principal axis direction; and a dispenser that applies the resin based on the application positions that have been determined. | 01-15-2015 |
20150315322 | IMPRINTING METHOD AND CURABLE COMPOSITION FOR IMPRINTING - A curable composition for imprinting in a condensable gas atmosphere, wherein the maximum condensable gas solubility (gas/(curable composition+gas)) (g/g) is 0.1 or more and 0.4 or less, and the curable composition for imprinting has a viscosity of 40 cP or less at 23° C. The maximum condensable gas solubility is determined by charging a 9-ml brown bottle with 3 g of the curable composition, measuring the weight of the curable composition at 23° C. at 1 atm before and after bubbling of the condensable gas at a flow rate of 0.1 L/min for 15 minutes, and dividing the increased weight due to the bubbling by the total weight of the curable composition and the condensable gas. | 11-05-2015 |