| Patent application number | Description | Published |
|---|
| 20080290498 | Semiconductor Device - A semiconductor device is disclosed that includes a circuit board, a semiconductor element, a heat sink, and a stress relaxation member. The circuit board includes an insulated substrate, a metal circuit joined to one side of the insulated substrate, and a metal plate joined to the other side of the insulated substrate. The semiconductor element is joined to the metal circuit. The heat sink radiates heat generated in the semiconductor element. The stress relaxation member thermally joins the heat sink to the metal plate. The stress relaxation member is formed of a material having a high thermal conductivity. The stress relaxation member includes recesses, which curve inward from the peripheral portion of the stress relaxation member, to form stress relaxation spaces at the peripheral portion of the stress relaxation member. | 11-27-2008 |
| 20080290500 | Semiconductor device - A semiconductor device has a ceramic substrate having a first surface and a second surface, a metal layer that is coupled to the second surface, a heat sink that is coupled to the metal layer and a stress relaxation member. The stress relaxation member is arranged between the metal layer and the heat sink and has a first surface that is coupled to the metal layer and a second surface that is coupled to the heat sink. A plurality of stress relaxation spaces are provided over the entire surface of at least one of the first and second surfaces of the stress relaxation member. The stress relaxation spaces that are arranged at the outermost portions of the stress relaxation member are deeper than the other stress relaxation spaces. | 11-27-2008 |
| 20090000963 | HYDROGEN STORAGE TANK AND ITS MANUFACTURING METHOD - A manufacturing method of a hydrogen storage tank stored with a hydrogen gas by including built-in hydrogen-occlusion alloys, has a stacking step of stacking plate members building up heat transfer fins, an arranging step of disposing the hydrogen-occlusion alloys between the neighboring plate members so as to form an area in which to dispose the hydrogen-occlusion alloys and an area in which to dispose none of the hydrogen-occlusion alloys, and a pressurizing step of forming air spaces sectioned by the plate members building up the heat transfer fins and containing the previously built-in hydrogen-occlusion alloys in a way that gets a part of the plate members deformed by pressurizing the plate members in a stacking direction thereof so as to restrict migrations of the hydrogen-occlusion alloys disposed in the arranging step. | 01-01-2009 |
| 20090174063 | Semiconductor Module - A semiconductor module | 07-09-2009 |
| 20090200065 | HEAT DISSIPATION DEVICE AND POWER MODULE - A heat radiator | 08-13-2009 |
| 20090218386 | Soldering Method, Soldering Apparatus and Method for Manufacturing Semiconductor Device - An object-to-be-soldered ( | 09-03-2009 |
| 20090302458 | Heat Sink For Power Module - A heat sink ( | 12-10-2009 |
| 20100236767 | HYDROGEN GAS STORING DEVICE - A plurality of MH tank modules ( | 09-23-2010 |
