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Keiji Okumura

Keiji Okumura, Kyoto-Fu JP

Patent application numberDescriptionPublished
20090086427SEMICONDUCTOR DEVICE - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.04-02-2009
20090095979Power Module - A power module includes a substrate having first and second main substrate surfaces; a semiconductor device disposed on the first main substrate surface, and having a first main surface on which a first main electrode is formed, and a second main surface on which a second main electrode in contact with the first main substrate surface is formed; a heat conduction portion disposed on the first main substrate surface in a residual region of a region on which the semiconductor device is disposed; and an upper cooling portion disposed on the heat conduction portion.04-16-2009
20090166893SEMICONDUCTOR DEVICE - A semiconductor device according to the present invention includes: an insulating substrate; a metal bonding member being disposed on the insulating substrate and having a porous region and a metal region, the porous region being provided with multiple pores therein and being adjacent to the metal region in a plane direction of the insulating substrate; a solder material impregnated into the pores; a semiconductor element disposed on the surface of the porous region in the metal bonding member; a bonding wire connected to the surface of the metal region in the metal bonding member. This makes it possible to provide a semiconductor device having improved electrical conductivity and thermal conductivity, and enabling the weight reduction.07-02-2009
20100265664Semiconductor Device - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.10-21-2010
20110069457Semiconductor Device - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.03-24-2011

Patent applications by Keiji Okumura, Kyoto-Fu JP

Keiji Okumura, Osaka-Shi JP

Patent application numberDescriptionPublished
20100001454SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING SHEET FEEDING DEVICE - A sheet feeding device for feeding a sheet-form recording medium includes: a sheet accommodating portion for accommodating a sheet stack constituted by a plurality of sheets of the sheet-form recording medium; and a first warm air unit having a first blowing port for blowing warm air toward an upper face of the sheet stack accommodated in the sheet accommodating portion. The sheet feeding device preferably further includes a second warm air unit having a second blowing port for blowing warm air onto a side face of the sheet stack that is parallel to a sheet feeding direction.01-07-2010
20100025919SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING SHEET FEEDING DEVICE - A sheet feeding device includes a sheet accommodating portion for accommodating a sheet stack. A sheet carrying plate carries the sheet stack and has an upstream end supported in the sheet accommodating portion for rotation. A pickup roller contacts an upper face of the sheet stack and dispatches an uppermost sheet. An elevator displaces the sheet carrying plate between a feeding position where the upper face of the sheet stack contacts the pickup roller and a separating position where the upper face of the sheet stack is separated from the pickup roller. A first warm air mechanism blows warm air toward a side of the sheet stack in the sheet accommodating portion, the side being parallel to the sheet feeding direction. A controller controls the elevator so that the sheet carrying plate is displaced between the feeding position and the separating position during a warm air blowing operation.02-04-2010
20100032890SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING SHEET FEEDING DEVICE - A sheet feeding device has a sheet accommodating portion for accommodating a sheet stack, a sheet carrying plate for carrying the sheet stack and a pickup roller that dispatches the uppermost sheet of the stack. An elevator displaces the sheet carrying plate between a sheet feeding position where an upper face of the sheet stack contacts the pickup roller and a separating position where the upper face of the sheet stack is separated from the pickup roller. A first warm air mechanism blows warm air toward a side face of the sheet stack. A controller causes the first warm air mechanism to blow warm air to the side face of the sheet stack and causes the elevator to displace the sheet carrying plate between the sheet feeding position and the separating position.02-11-2010
20100059929SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet feeding device has: a sheet accommodating portion that accommodates a sheet stack of a plurality of sheets; a sheet carrying plate that is provided within the sheet accommodating portion and stacks the sheet stack thereon; a pickup roller that contacts an upper face of the sheet stack and dispatches a sheet on an uppermost layer of the sheet stack, an elevator mechanism that displaces the sheet carrying plate between a sheet feeding position in which the upper face of the sheet stack contacts the pickup roller, and a separating position in which the upper face of the sheet stack separates from the pickup roller by a predetermined distance; and a controller that controls an operation of the elevator mechanism such that the sheet carrying plate is lowered to the separating position after a sheet feeding operation for feeding a sheet at the sheet feeding position is completed.03-11-2010

Keiji Okumura, Kyoto-Shi JP

Patent application numberDescriptionPublished
20090091892Semiconductor Device - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed on a plane intersecting with a plane having the first output unit disposed thereon; and a controller configured to control the output units.04-09-2009

Keiji Okumura, Osaka JP

Patent application numberDescriptionPublished
20110274517SHEET POST-PROCESSING APPARATUS - A sheet post-processing apparatus is provided that includes a first delivery path that guides a sheet to a first post-processing portion, a delivery holding path having a first holding path which branches off from a branch point of the first delivery path and a second holding path which is formed to be continuous with the first holding path and joins together with the first delivery path; a second delivery path that branches off from a branch point of the first holding path and guides the sheet to the second post-processing portion; a first path switching portion that is provided at the branch point of the first delivery path; and a second path switching portion that is provided at the branch point of the first holding path.11-10-2011

Keiji Okumura, Kyoto JP

Patent application numberDescriptionPublished
20120112201HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE SAME, AND SEMICONDUCTOR DEVICE - A high melting point soldering layer includes a low melting point metal layer, a first high melting point metal layer disposed on a surface of the low melting point metal layer, and a second high melting point metal layer disposed at a back side of the low melting point metal layer. The low melting point metal layer, the first high melting point metal layer, and the second high melting point metal layer are mutually alloyed by transient liquid phase bonding, by annealing not less than a melting temperature of the low melting point metal layer, diffusing the metal of the low melting point metal layer into an alloy of the first high melting point metal layer and the second high melting point metal layer. The high melting point soldering layer has a higher melting point temperature than that of the low melting point metal layer. It is provided a binary based high melting point soldering layer having TLP bonding of a high melting point according to a low temperature processing, a fabrication method for the high melting point soldering layer and a semiconductor device to which the high melting point soldering layer is applied.05-10-2012