| Patent application number | Description | Published |
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| 20100216264 | METHOD OF MANUFACTURING A SUBSTRATE FOR A LIQUID DISCHARGE HEAD - A method of manufacturing a substrate for a liquid discharge head, the substrate being a silicon substrate having a first surface opposed to a second surface, the method comprising the steps of providing a layer on the second surface of the silicon substrate, wherein the layer has a lower etch rate than silicon when exposed to an etchant of silicon, partially removing the layer so as to expose part of the second surface of the silicon substrate, wherein the exposed part surrounds at least one part of the layer; and wet etching the layer and the exposed part of the second surface of the silicon substrate, using the etchant of silicon, to form a liquid supply port extending from the second surface to the first surface of the silicon substrate. | 08-26-2010 |
| 20110151598 | METHOD FOR MANUFACTURING A SUBSTRATE FOR LIQUID-EJECTING HEADS AND A LIQUID-EJECTING HEAD - A method for manufacturing a substrate for liquid-ejecting heads includes etching a surface of a silicon substrate using a first etchant, with a silicon oxide layer as a mask, to form a depression as a part of a liquid supply port, and subsequently etching at least the silicon oxide layer and the thickness sandwiched between the depression and the etched surface of the silicon substrate with a second etchant to form the liquid supply port. | 06-23-2011 |
| 20120055022 | METHOD OF PRODUCING LIQUID EJECTION HEAD - The present invention provides a method of producing a liquid ejection head, the method including the steps of preparing a substrate having a flow-path-wall member; bonding the flow-path-wall member to a resin layer that is composed of a photo-curing resin and serves as an ejection port member such that spaces serving as the flow paths are provided inside; providing through-holes in the resin layer such that the spaces communicate with the outside air; exposing part of the resin layer; heating the exposed portion of the resin layer; and removing the unexposed portion from the heated resin layer to form the ejection ports, thereby forming the ejection port member in the resin layer. | 03-08-2012 |
| 20120097637 | METHOD OF MANUFACTURING SUBSTRATE FOR LIQUID DISCHARGE HEAD - Provided is a method of manufacturing a substrate for a liquid discharge head including a first face, energy generating elements which generate the energy to be used to discharge a liquid to a second face opposite to the first face, and liquid supply ports for supplying the liquid to the energy generating elements. The method includes preparing a silicon substrate having, at the first face, an etching mask layer having an opening corresponding to a portion where the liquid supply ports are to be formed, and having first recesses provided within the opening, and second recesses provided in the region of the second face where the liquid supply ports are to be formed, the first recesses and the second recesses being separated from each other by a portion of the substrate; and etching the silicon substrate by crystal anisotropic etching from the opening of the first face to form the liquid supply ports. | 04-26-2012 |
| Patent application number | Description | Published |
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| 20080261353 | Underfill film having thermally conductive sheet - An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board. | 10-23-2008 |
| 20090300141 | Self-Distribution Methods, Coded Self-Distribution Methods, and Systems for Distributing Information - A self-distribution method for distributing information content among network connected devices of a communications network includes receiving a query having a code against a database from a wireless communications device, the code uniquely representing one of an advertising campaign, a product, or a service. The method also includes generating a result set by querying the database with the code, forwarding a link associated with the result set to a user-preferred remote location, the link being sent in an electronic message, wherein activation of the link directs a user to a first version of information content of the result set. A plurality of options to purchase user-preferred items from the first version of information content, the options including at least “purchase now” and “purchase later” features. A reminder message is forwarded to the wireless communications device if a user at the remote location selects the “purchase later” feature. The user is enabled to conduct a purchase transaction from at least the remote location or the wireless communications device. Systems for self-distributing information are also provided. | 12-03-2009 |
| 20090313344 | Self-Distribution Methods, Coded Self-Distribution Methods, and Systems for Distributing Information - A self-distribution method for distributing information content among network connected devices of a communications network includes receiving a query having a code against a database from a wireless communications device, the code uniquely representing one of an advertising campaign, a product, or a service. The method also includes generating a result set by querying the database with the code, forwarding a link associated with the result set to a user-preferred remote location, the link being sent in an electronic message, wherein activation of the link directs a user to a first version of information content of the result set. A plurality of options to purchase user-preferred items from the first version of information content, the options including at least “purchase now” and “purchase later” features. A reminder message is forwarded to the wireless communications device if a user at the remote location selects the “purchase later” feature. The user is enabled to conduct a purchase transaction from at least the remote location or the wireless communications device. Systems for self-distributing information are also provided. | 12-17-2009 |
| 20110155425 | Underfill film having thermally conductive sheet - An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board. | 06-30-2011 |
