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Keiji Maeda
Keiji Maeda, Kyoto-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100012816 | METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND MOLD FOR MOLDING RESIN - A mold surface ( | 01-21-2010 |
| 20110042857 | METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND MOLD FOR MOLDING RESIN - A mold surface ( | 02-24-2011 |
Keiji Maeda, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090116492 | DATA TRANSFER SYSTEM AND METHOD - A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards. | 05-07-2009 |
| 20100238947 | DATA TRANSFER SYSTEM AND METHOD - A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards. | 09-23-2010 |
Keiji Maeda, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20100153625 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor device including a plurality of flash memories, a connector for establishing connection with a host apparatus, a cache memory for data transmission between the flash memories and the host apparatus, a drive control circuit that controls the data transmission between the flash memories and the host apparatus, and a power supply circuit that converts an external power supply voltage into an internal power supply voltage, all mounted on a substrate. A fuse that protects at least the flash memories from an overcurrent is also provided on the substrate. | 06-17-2010 |
Keiji Maeda, Kyoto JP
| Patent application number | Description | Published |
|---|---|---|
| 20080254286 | Method of Evaluating Adhesion Property, Low-Adhesion Material, and Mold for Molding Resin - A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained. | 10-16-2008 |
| 20080296532 | Low Adhesion Material, Resin Molding Die, and Soil Resistant Material - A resin molding die has a molding surface formed of a low adhesion material formed of a solid solution of La—Y | 12-04-2008 |
| 20090107361 | Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material - An upper die ( | 04-30-2009 |