Patent application number | Description | Published |
20100314984 | LIGHT EMITTING DIODE LAMP - A light emitting diode (LED) lamp including a connector, an LED module, an angle adjusting ring, an isolating ring, and a heat dissipating module is provided. The LED module is electrically connected to the connector and has at least one LED unit. The angle adjusting ring is disposed between the LED module and the connector for rotating the LED module, and includes at least one locking element for fixing the LED module on the connector. The isolating ring is disposed between the connector and the angle adjusting ring. The heat dissipating module is in contact with the LED module for preventing the LED module from overheating. The heat dissipating module includes at least one heat pipe and a plurality of fins connecting to the at least one heat pipe, where the at least one LED unit is disposed on the at least one heat pipe. | 12-16-2010 |
20100319882 | ULTRA-THIN HEAT PIPE AND MANUFACTURING METHOD THEREOF - An ultra-thin heat pipe and a manufacturing method thereof are provided. The ultra-thin heat pipe includes a flat pipe body and a powder-sintered portion. The flat pipe body has an internal wall, a first groove set and a second groove set, wherein the first groove set and the second groove set are disposed on the internal wall and spaced apart from each other, and each groove of the first groove set and the second groove set is extended along an extension direction of the flat pipe body. The powder-sintered portion is disposed within the flat pipe body and connects both the first groove set and the second groove set for forming at least one vapor channel with the internal wall. | 12-23-2010 |
20110024098 | SINTERED HEAT PIPE, MANUFACTURING METHOD THEREOF AND MANUFACTURING METHOD FOR GROOVE TUBE THEREOF - A sintered heat pipe, a manufacturing method thereof and a manufacturing method for a groove tube thereof are provided. The sintered heat pipe includes a groove tube, a sintered powder layer and a working fluid. The groove tube has a plurality of grooves and a first end and a second end opposite to the first end. Each groove extends along an axial direction of the groove tube. The first end and the second end are closed. The sintered powder layer is formed on an inside wall of the groove tube, and the groove tube is filled with the working fluid. The size of each powder in the sintered powder layer is greater than a width of each of the grooves. | 02-03-2011 |
Patent application number | Description | Published |
20100177521 | Led lamp - An LED lamp has a metal housing, a heat pipe and an LED. The metal housing has an outer surface, an inner surface, a bottom and an opening defined by an inner edge. The heat pipe engages the inner surface, the bottom and the inner edge of the metal housing. The LED is attached to the bottom portion of the heat pipe. The heat pipe rapidly transports heat generated by the LED to the metal housing which then transfers heat to the environment. The heat pipe makes effective heat transportation possible and allows the use of high-power LEDs or multiple LED's within one lamp. | 07-15-2010 |
20100177522 | LED LAMP - An LED lamp has a base, a tubular conductor, a bulb and at least one LED. The base is metallic and has an electrical connector. The tubular conductor is filled with a fluid and mounted on the base and has a distal end and a proximal end. The bulb is pellucid and connected to the base. The at least one LED is mounted on the distal end of the tubular conductor and electrically connected to the connector of the base. The fluid in the tubular conductor may vaporize close to operating temperatures of the LED so transports heat away from the LED quickly and efficiently so allowing high power or multiple LEDs to be implemented, so improving brightness of the LED lamp and commercial applications. | 07-15-2010 |
20100181593 | LED chip package - A LED chip package including a two-phase-flow heat transfer device, at least one LED chip, a metal lead frame and a package material. The two-phase-flow heat transfer device has at least one flat surface. The LED chip is directly or indirectly bonded or adhered to the flat surface of the two-phase-flow heat transfer device. Heat generated by the LED chip can be easily conducted away from the LED chip by the two-phase-flow heat transfer device such as a heat pipe, a vapor chamber and the like so as to prevent heat from accumulating in the LED chip thereby extending the service duration of the LED chip and to prevent the LED chip from deterioration of the light emitting performance caused by the accumulation of heat. | 07-22-2010 |
20100259942 | LED lamp - An LED lamp has a metal housing, a sintered heat pipe and an LED. The metal housing has an outer surface, an inner surface, a bottom and an opening defined by an inner edge. The sintered heat pipe engages the inner surface and the bottom and the inner edge of the metal housing. The LED is attached to a flattened area of the bottom portion of the sintered heat pipe. The sintered heat pipe rapidly transports heat generated by the LED to the metal housing which then transfers heat to the environment. The sintered heat pipe makes effective heat transportation possible and allows the use of high-power LEDs or multiple LED's within one lamp. | 10-14-2010 |
20100263833 | Sintered heat pipe - A sintered heat pipe comprises: a metal tube of which an inner wall is formed with a plurality of capillary grooves extending in a longitudinal direction; and a sintered powder layer partially covering the capillary grooves. With this structure, the liquid medium in the capillary grooves which moves toward a hot segment can be prevented from being blown by vapor moving toward the cold segment while the liquid medium condensed from the vapor at the cold segment can enter the capillary grooves without difficulty. | 10-21-2010 |
20100266864 | Ultra-thin heat pipe - An ultra-thin heat pipe comprises a flat metal tube and one or more sintered powder portions. The flat metal tube has an upper tube wall, a lower tube wall and two lateral walls connecting with the upper tube wall and the lower tube wall. The sintered powder portions extends axially and are formed on an inner face of at least one of the upper tube wall, the lower tube wall and the lateral walls such that vapor passage space is formed at one or more sides of the sintered powder portions. | 10-21-2010 |
20100279039 | Heat pipe and method for manufacturing the same - A heat pipe comprises a metal tube and a sintered powder layer formed on an inner wall face of the metal tube. The sintered powder layer has a plurality of fine passages extending axially. The sintered powder layer may cover the inner wall face of the metal tube entirely or partially. | 11-04-2010 |
20110221324 | LIGHT EMITTING DIODE (LED) LAMP - A light emitting diode (LED) lamp includes a standardized connector; an LED module; a heat dissipating module; an angle adjusting ring; and an isolating ring. The LED module is electrically connected to the standardized connector and includes a circuit board and at least one LED unit electrically connected to the circuit board. The heat dissipating module is for preventing the LED module from overheating and includes at least one heat pipe on which the LED unit is disposed, a rear heat dissipating shield, a piston module, a transmission module, a heat dissipating fan, and a convection fan. The angle adjusting ring is disposed between the LED module and the standardized connector for rotating the LED module so as to change a light emitting direction of the LED module. The isolating ring is used to avoid the electrical connection of the angle adjusting ring and the standardized connector. | 09-15-2011 |
20120043884 | LED LAMP TUBE - An LED lamp tube comprises a tube body, at least one circuit board inside the tube body, at lease one LED module on the circuit board, and electrical connectors at the ends of the tube, wherein the tube body is an integrally formed hollow tube, and has at least one group of supporting and positioning ribs on the inner wall thereof along the length direction; the circuit board is fixed by the supporting and positioning ribs; the LED lamp tube disclosed by the present invention has a firm assembly structure with less thermal deformation, and more particularly just like the conventional fluorescent tubes it has a wide light-emitting angle, thereby providing better illumination effects. | 02-23-2012 |
Patent application number | Description | Published |
20110277311 | VAPOR CHAMBER MANUFACTURING METHOD - A vapor chamber manufacturing method, comprises steps of material preparation, powder filling and sintering, pre-punching, supporting structure infilling, the first pressing, the first sealing, fluid injection, and vacuum processing; a sealing structure comprises a semi-finished vapor chamber with a vacuum cavity, a fluid injection port positioned on one side of the vapor chamber, and a supporting structure filled in the vacuum cavity and supporting the shape of the vapor chamber, wherein the fluid injection port is formed of one portion of one side of the vapor chamber by pressing and sealing, no fine metal pipe as fluid injection port is required herein; after the step of fluid injection, an integrated step of vacuum pumping, pressing and sealing is conducted within a vacuum chamber, to provide the product with higher performance and lower rejection rate. | 11-17-2011 |
20110277955 | VAPOR CHAMBER - A vapor chamber comprises a flat metal tube formed of a circular metal tube by pressing, a powder sintering portion disposed on the inner wall of the metal tube, a supporting structure disposed in and surrounded by the metal tube, a working fluid filled in the metal tube; wherein the top and bottom sides of the metal tube are flat, the two opposite sides connecting the top and bottom sides are seamlessly circular arc shaped, and the other two opposite sides are the sealed ends formed of the two open ends by pressing and sealing. The present invention provides a vapor chamber for CPU, GPU, LED solar cell or other high heat producing electronic products to solve the heat dissipation issues. | 11-17-2011 |
20120033425 | LED Street Lamp and a Street Lamp Fixing Device - The present invention discloses a street lamp fixing device, comprising a LED module, a heat dissipation device, a lamp holder, a metal plate and a connector, wherein the heat dissipation device has a lamp holder mounting recess cooperated with the metal plate for locking the lamp holder. Moreover, the present invention further discloses an LED street lamp with natural convection devices, which accelerate the airflow within the street lamp to a faster speed to enhance heat exchange, whereby the lifespan of the LED street lamp is extended and the weight and size of the street lamp are reduced. | 02-09-2012 |
20120235580 | Network controlled interior lighting system - A network controlled indoor lighting system is disclosed, which is constructed based on a device control unit with network connectivity, and a remote controller containing the software for users to control the interior lighting system. The system allows users to control a plurality of LED lamps in terms of brightness, color temperature, beam angle and illumination direction. The system has single/multi-point control, and online error diagnosis. | 09-20-2012 |
Patent application number | Description | Published |
20120080176 | HIGH-POWER FINNED HEAT DISSIPATION MODULE - A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more and are suitable for cooling high-power electronic components. | 04-05-2012 |
20120080177 | HIGH-POWER FINLESS HEAT DISSIPATION MODULE - A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more is suitable for cooling down high-power electronic components. | 04-05-2012 |
20120243256 | LED LIGHTING DEVICE WITH LIGHT GUIDE PLATE - A light guide plate includes a lateral side through which light enters and a front side through which light exits. A phosphor is coated on the lateral side. A light source includes a plurality of light emitting diodes (LEDs) having wavelengths of 230-520 nanometers (nm). The LEDs are mounted proximate to the lateral side and corresponding to, but separated from, the phosphor. A reflector includes a reflective surface and is mounted on a back side of the light guide plate with the reflective surface facing the light guide plate. A frame fixes the light guide plate, the light source, and the reflector. Colors of the phosphor and the light source are complementary. The phosphor absorbs light from the light source to transition into an excited state. The light guide plate outputs light from the light source and the phosphor through the front side. | 09-27-2012 |
Patent application number | Description | Published |
20130039057 | LED LIGHTING FIXTURE - The invention discloses an LED lighting fixture, which comprises a heat sink, a reflection cup, an LED module, a supporting member, a heat pipe and a vapor chamber, wherein the heat sink is provided with a center hole section and radiating sections; a concave opening is formed at the front end by the surrounding of the radiating section; the reflection cup is arranged at the concave opening; the outside of the reflection cup is surrounded by the heat pipe and makes contact with the radiating section; the LED module is arranged at the bottom of the reflection cup; the supporting member makes contact with the LED module and is arranged at the tail end of the heat pipe; and the vapor chamber is provided with a smoothing section for receiving the LED module and interposing sections for being interposed into the center hole section of the heat sink. | 02-14-2013 |
20130223063 | REPLACEABLE LED STREET LAMP MODULE - The invention discloses a replaceable LED street lamp module, including at least one module portion and a clamping sheet set. The module portion includes an LED module, a lens, an inner radiator, an outer radiator and a heat pipe set, the inner radiator and the outer radiator are sleeved with each other, the heat pipe set is bent and located between the inner radiator and the outer radiator and supports and fixes the LED module, the lens protects the LED module and allows light to be emitted from the LED module, notches are arranged on the outer circle of the outer radiator, and the clamping sheet set is clamped in the notch via two clamping sheets in order to clamp and fix the module portion, thereby being assembled on the opening of the street lamp housing. | 08-29-2013 |
20130223064 | LED PROJECTION LAMP - The invention discloses an LED projection lamp, which comprises a heat sink, a lamp cup, an LED module, a lens, a first heat conduction component, a fastening device and a second heat conduction component, wherein the heat sink is cylindrical and provided with a trumpet-shaped inner cavity on the front and a cylindrical inner cavity at the rear; the lamp cup is arranged inside the trumpet-shaped inner cavity; the LED module is disposed on a small opening portion of the lamp cup; the lens is used by the LED module for light transmission; the first heat conduction component comprises a first vapor chamber; the fastening device is sleeved at the rear end of the cylindrical inner cavity; the second heat conduction component comprises a second vapor chamber. | 08-29-2013 |
20130229799 | LED PROJECTION LAMP - The invention discloses an LED projection lamp, which comprises a heat sink, a lamp cup, an LED module, a lens, a first heat conduction component, a fastening device and a second heat conduction component, wherein the heat sink is cylindrical and provided with a trumpet-shaped inner cavity on the front and a cylindrical inner cavity at the rear; the lamp cup is arranged inside the trumpet-shaped inner cavity; the LED module is disposed on a small opening portion of the lamp cup; the lens is used by the LED module for light transmission; the first heat conduction component comprises a plurality of U-shaped first heat pipes; the fastening device is sleeved at the rear end of the cylindrical inner cavity; the second heat conduction component comprises a plurality of U-shaped second heat pipes. | 09-05-2013 |