Patent application number | Description | Published |
20090288763 | Thermally strippable double faced adhesive sheet and method of working work piece - A thermally strippable double faced adhesive sheet comprising a substrate, a thermally strippable pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a pressure-sensitive adhesive layer (B) arranged on the other side of the substrate, in which the substrate comprises a porous substrate. The porous substrate preferably has a density of 0.9 g/cm | 11-26-2009 |
20100028588 | Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend - To provide a heat-peelable pressure-sensitive adhesive sheet which, even when applied to a flexible adherend or extremely small adherend, enables the adherend to be efficiently peeled and recovered therefrom without breakage. | 02-04-2010 |
20100252185 | REMOVABLE PRESSURE SENSITIVE ADHESIVE SHEET AND METHOD FOR PROCESSING ADHEREND USING THE SAME - The present invention provides a removable pressure sensitive adhesive sheet, which includes: a self-rolling pressure sensitive adhesive sheet which is capable of spontaneously rolling up by a thermal stimulation, the self-rolling pressure sensitive adhesive sheet including a first pressure sensitive adhesive layer, a first rigid film layer, an elastic layer and a heat contractible film layer laminated in this order; and a second pressure sensitive adhesive layer and a second rigid film layer laminated in this order on the heat contractible film layer side of the self-rolling pressure sensitive adhesive sheet, in which the second pressure sensitive adhesive layer is removable from the heat contractible film layer or the second rigid film layer is removable from the second pressure sensitive adhesive layer. | 10-07-2010 |
20100279491 | DIE ATTACH FILM-PROVIDED DICING TAPE AND PRODUCTION PROCESS OF SEMICONDUCTOR DEVICE - The present invention provides a die attach film-provided dicing tape, which includes a dicing tape, a supporting tape and a die attach film laminated in this order, wherein the supporting tape is a tape having a self-rolling peelability, and a process for producing a semiconductor device by using the die attach film-provided dicing tape. | 11-04-2010 |
20110048641 | METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE FROM OBJECT TO BE CUT - The present invention is intended to provide a method for protecting a surface of an object to be cut from contamination due to the adhesion of dust and the like, including cutting scraps, by bonding a surface protection tape to the surface of the object to be cut, and cutting the surface protection tape together with the object to be cut in a dicing process and, after the dicing process, easily separating and removing the protection tape from individual chips. To this end, there is provided a method in which a dicing surface protection tape is bonded to a surface of an object to be cut, the tape is cut together with the object to be cut, and then the dicing surface protection tape is removed with the object to be cut inclined. | 03-03-2011 |
20110067808 | PRESSURE-SENSITIVE ADHESIVE SHEET, METHOD OF PROCESSING ADHEREND WITH THE PRESSURE-SENSITIVE ADHESIVE SHEET, AND APPARATUS FOR STRIPPING PRESSURE-SENSITIVE ADHESIVE SHEET - To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend. | 03-24-2011 |
20110117706 | PROTECTIVE TAPE JOINING METHOD AND PROTECTIVE TAPE JOINING APPARATUS - A cooling plate having a cooling pipe mounted therein in a serpentine shape is placed in a stack manner on a rear face of a chuck table for suction-holding a rear face of the semiconductor wafer. A coolant is circulated through the cooling pipe, thereby cooling the chuck table. The semiconductor wafer is suction-held while the chuck table is cooled. In addition, the protective tape is joined to the semiconductor wafer while the chuck table is cooled. That is, the protective tape is joined to the surface of the semiconductor wafer while being cooled indirectly via the semiconductor wafer cooled in advance through direct contact to the chuck table during joining of the protective tape. | 05-19-2011 |
20110143552 | HEAT-RESISTANT ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE FABRICATION, ADHESIVE USED FOR THE SHEET, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SHEET - The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %. | 06-16-2011 |
20110151625 | HEAT-RESISTANT ADHESIVE SHEET FOR SUBSTRATELESS SEMICONDUCTOR PACKAGE FABRICATION AND METHOD FOR FABRICATING SUBSTRATELESS SEMICONDUCTOR PACKAGE USING THE ADHESIVE SHEET - The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength. | 06-23-2011 |
20110195248 | PRESSURE-SENSITIVE ADHESIVE SHEET WITH SPONTANEOUSLY ROLLING PROPERTY - The pressure-sensitive adhesive sheet with spontaneously rolling property of the invention is a pressure-sensitive adhesive sheet comprising a contractible film layer, an elastic layer, a rigid film layer, an intermediate layer, and a pressure-sensitive adhesive layer satisfying the following requirements and laminated in this order, which is capable of undergoing spontaneous rolling from one end part in one direction or from opposing two end parts toward a center to form one or two cylindrical rolls when a stimulus causing a contraction is applied:
| 08-11-2011 |
20110200744 | ADHESIVE SHEET, PROCESS FOR PRODUCING THE SAME, AND METHOD OF CUTTING MULTILAYERED CERAMIC SHEET - The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 μm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 μm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity. | 08-18-2011 |
20110220268 | SURFACE PROTECTION TAPE FOR DICING AND METHOD FOR PEELING AND REMOVING SURFACE PROTECTION TAPE FOR DICING - The present invention aims to provide a surface protection tape for use in a dicing step, which protects a surface of a material to be cut from staining owing to attachment of dust and the like such as shavings by sticking the surface protection tape on the surface of the material to be cut in the dicing step and cutting the tape together with the material to be cut, and which is easily peeled and removed from individual chips after the dicing step. There is provided a surface protection tape for dicing to be stuck on a surface of a material to be cut and to be cut together with the material to be cut, which includes a contractible film layer that contracts in at least one axis direction by a stimulus and laminated thereon a restriction layer that restricts the contraction of the contractible film layer, and which is peeled off with undergoing spontaneous rolling from one end part in one direction or from opposing two end parts toward a center to form one or two cylindrical rolls when the stimulus that causes the contraction is applied. | 09-15-2011 |
20110237050 | METHOD FOR PROCESSING WAFER - The present invention provides a method which includes sticking a surface protection sheet for dicing onto a surface of a wafer and cutting the sheet together with the wafer to protect the surface of the wafer from being contaminated by deposition of a dust such as swarf and the like, and picking up a chip without causing cracking or chipping in the chip after a dicing step, in the steps of dicing the wafer and then picking up the chip. The method includes: sticking the surface protection sheet for dicing onto the surface of the wafer; cutting the sheet together with the wafer; subsequently giving a stimulus to the surface protection sheet for dicing to peel the end of the chip from the dicing tape; and then picking up the chip. | 09-29-2011 |
20130220532 | SELF-ROLLING ADHESIVE FILM - An easily detachable adhesive film, which is deformed into a cylindrical shape by heating to facilitate collection, fails to be sufficiently bonded to the surface of a workpiece, if the surface of the adhesive layer is roughened by the presence of irregularities. Because of this, when water penetrates in dicing, the adhesive layer peels off from the surface of the workpiece and may fail to achieve a surface-protection purpose. In addition, when the easily detachable adhesive film is deformed into a cylindrical shape by heating, detachment stress may not uniformly applied to a workpiece, with the result that the film cannot be smoothly deformed into a cylindrical shape; at the same time, a larger amount of glue remains in the surface of a workpiece than a conventional peel-detachment. A self-rolling adhesive film composed of a multi-layered substrate including at least one thermal contraction film, an adhesive layer and a separator, in which the surface of the adhesive layer after the separator is detached has an arithmetic average roughness Ra of 1.0 μm or less. | 08-29-2013 |
20130224418 | SELF-ROLLING ADHESIVE FILM - A self-rolling adhesive film formed by laminating a substrate film formed of a laminate having at least one thermal contraction film and an adhesive layer on a surface of the substrate film, not formed of a thermal contraction film, in which shear stress between the surface of the thermal contraction film of the substrate film and the adhesive layer thereof is 240 g/mm | 08-29-2013 |
20130240141 | HEAT-RESISTANT PRESSURE-SENSITIVE ADHESIVE TAPE FOR PRODUCTION OF SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE TAPE - The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame. | 09-19-2013 |
20130273716 | METHOD OF DICING SUBSTRATE - In a step of performing dicing by sticking a protective tape for protecting a wafer surface, in order to obtain a dicing method which ensures that there is no paste residue on a chip side face and that the protective tape is prevented from peeling from the wafer during the dicing and which is excellent in productivity, in a step of performing dicing by sticking a surface protective adhesive tape having an energy ray-curable adhesive layer on one surface of a substrate, thereby performing surface protection for the surface of the semiconductor wafer where an integrated circuit is to be formed, the energy ray-curable adhesive layer is cured by radiating energy rays beforehand to an inner circumferential portion of the wafer, and dicing is performed, with the energy ray-curable adhesive layer kept in an uncured condition by ensuring that energy rays are not radiated to an outer peripheral portion. | 10-17-2013 |