Patent application number | Description | Published |
20090206471 | Electronic parts packaging structure and method of manufacturing the same - An electronic parts packaging structure of the present invention includes a wiring substrate having a wiring pattern, a first insulating film which is formed on the wiring substrate and which has an opening portion in a packaging area where an electronic parts is mounted, the electronic parts having a connection terminal flip-chip mounted on the wiring pattern exposed in the opening portion of the first insulating film, a second insulating film for covering the electronic parts, a via hole formed in a predetermined portion of the first and second insulating films on the wiring pattern, and an upper wiring pattern formed on the second insulating film and connected to the wiring pattern through the via hole. | 08-20-2009 |
20100181852 | MOTOR - The invention provides a motor including a terminal block that is insert molded into a core, so as to increase the strength to support the terminal block. A stator has paired inner cores configured by two inner cores facing back to back and each having a disk part and pole teeth. Each of the disk parts is provided with a terminal block holding part. The terminal block is connected with the terminal block holding parts via a resin connection part that is insert molded. The terminal block holding parts are provided with recesses configured by cutouts in portions to face the terminal block, respectively. The resin connection part has a thickness increased by filling the recesses so as to increase the strength at a connection portion thereof. The cutouts in the terminal block holding parts facing back to back are offset with respect to a radial line, terminal block facing ends are generally spaced apart from the terminal block by a constant distance. Therefore, the terminal block is prevented from being unstable. | 07-22-2010 |
20120074578 | SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT MOUNTED BOARD, AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT - A semiconductor element includes connection terminals. The connection terminals are each shaped in such a manner that the transverse cross-sectional area in a portion near the leading end thereof decreases toward the leading end. Specifically, the shape of each of the connection terminals is columnar except for the portion near the leading end, and the side surface in the portion near the leading end of the connection terminal is shaped in a tapered form. Furthermore, a metal layer for improving a solder wettability may be formed at least on the side surface shaped in the tapered form, of the connection terminal. | 03-29-2012 |
20120103663 | WIRING SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes a heat sink to dissipate heat generated in an electronic part mounted in an electronic part loading area on a principal surface of the wiring substrate, an encapsulation resin to cover the heat sink, an inner connection terminal having an end face electrically connected to an electrode of the electronic part, and an outer connection terminal electrically connected to the inner connection terminal via a wiring and having an end face for inputting and outputting of a signal with an external device. The encapsulation resin is arranged to cover a part of the wiring, the inner connection terminal except the end face, and the outer connection terminal except the end face. A surface of the heat sink, the end face of the inner connection terminal, and the end face of the outer connection terminal are flush with and exposed to the principal surface. | 05-03-2012 |
20130126916 | PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE PACKAGE - A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively. | 05-23-2013 |
20130153945 | LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PACKAGE, AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a light-emitting element mounting package including laminating a metallic layer on an insulating layer; forming a light-emitting element mounting area which includes a pair of electroplating films formed by electroplating using the metallic layer as a power supply layer on the metallic layer; forming a light-emitting element mounting portion in which a plurality of wiring portions are separated by predetermined gaps, by removing predetermined portions of the metallic layer, wherein, in the forming the light-emitting element mounting portion, the metallic layer is removed so that one of the pair of electroplating films belongs to one wiring portion of the plurality of wiring portions and another of the pair of electroplating films belongs to another wiring portion adjacent to the one wiring portion. | 06-20-2013 |
20130153946 | LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PACKAGE, AND METHOD OF MANUFACTURING THESE - A light-emitting element mounting package includes a light-emitting element mounting portion that includes a plurality of wiring portions arranged interposing a predetermined gap between the wiring portions facing each other, and an insulating layer on which the light-emitting element mounting portion is mounted, wherein an upper surface of the light-emitting element mounting portion is exposed on the insulating layer, wherein cutout portions are formed on lower sides of side edges of the wiring portions and contact the insulating layer. | 06-20-2013 |
20150200337 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE - A wiring substrate for a semiconductor device includes a heat spreader; a polyimide layer provided with through holes and provided on the heat spreader via an adhesion layer; through wirings formed to fill the through holes of the polyimide layer; a thermal diffusion wiring provided on the polyimide layer and is configured not to be electrically connected to the semiconductor device; an electrical connection wiring provided on the polyimide layer at a same plane with the thermal diffusion wiring and is configured to be electrically connected to the semiconductor device; and an insulating layer provided on the polyimide layer with a first open portion and a second open portion that expose the electrical connection wiring and the thermal diffusion wiring, respectively, the thermal diffusion wiring being formed to extend at an outer side of the second open portion and have a larger area than the electrical connection wiring. | 07-16-2015 |