| Patent application number | Description | Published |
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| 20080299497 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - A manufacturing method of a liquid discharge head having therein liquid discharge ports and liquid flow passageways communicated with the discharge ports, includes: providing, by depositing, on a substrate, lamination of first and second material layers containing first and second positive type photosensitive resins, respectively, first material layer containing a light absorber absorbing a light in a specific wavelength range to which first positive type photosensitive resin is photosensitive, second positive type photosensitive resin able to be photosensitive to the light in specific wavelength range; exposing second material layer to light in specific wavelength range thereby forming a pattern made of material of second material layer; exposing first material layer to light in specific wavelength range thereby forming a pattern made of first material layer; forming a coating layer covering obtained patterns formed on substrate; forming discharge ports in coating layer; and removing patterns to eventually obtain flow passageways. | 12-04-2008 |
| 20080309719 | LIQUID DISCHARGE HEAD - A liquid discharge head comprises a discharge port forming member having formed therein a discharge port arranged correspond to an energy generating element which generates energy to eject a liquid and a flow path forming member for forming a flow path to supply ink to the discharge port. At least one of the discharge port forming member and the flow path forming member is made of a cured material of a composition containing an epoxy resin and a phenol resin having a higher oxygen equivalent than that of the epoxy resin. | 12-18-2008 |
| 20080309733 | LIQUID DISCHARGING HEAD, PRODUCING METHOD THEREOF, STRUCTURE, AND PRODUCING METHOD THEREOF - A producing method of a liquid discharging head includes a discharge port discharging a liquid and a flow path communicating with the discharge port, the method comprising the steps of forming a pattern of a shape of the flow path on a substrate, forming a layer of a negative type photosensitive resin composition including a photo-initiated polymerization initiator on the substrate so as to coat the pattern, at least a region of the layer in a vicinity of the substrate including a sensitizing agent of the photo-initiated polymerization initiator, a density of the sensitizing agent in the layer formed to be higher in the region than in a part where the discharge port is formed, forming the discharge port by exposing the layer to pattern the layer, and removing a pattern to form the flow path. | 12-18-2008 |
| 20100255422 | MANUFACTURING METHOD OF LIQUID DISCHARGE HEAD - A manufacturing method of a liquid discharge head having a liquid flow path which communicates with a discharge port for discharging liquid, includes: providing a first layer made of a first photosensitive resin on a substrate; forming a mold of the flow path from the first layer by exposing a part of the first layer and developing the first layer; applying a light absorbent to a surface of the mold; providing a second layer made of a second photosensitive resin to coat the mold applied with the light absorbent; forming an opening that is to be the discharge port in the second layer by exposing a part of the second layer with light having a wavelength that can be absorbed by the light absorbent and developing the second layer; and forming the flow path by removing the mold. | 10-07-2010 |
| 20100255424 | LIQUID DISCHARGE HEAD MANUFACTURING METHOD - Provided is a method for manufacturing a liquid discharge head including a flow path forming member connected to a discharge port on or above a substrate, the method including: providing a layer containing a photosensitive resin on or above the substrate; providing a mask layer that enables reduction of transmission of light with a photosensitive wavelength of the photosensitive resin, at an area on the layer containing the photosensitive resin, the area corresponding to the flow path; performing exposure for the layer containing the photosensitive resin using the mask layer to make the layer containing the photosensitive resin be a pattern having the shape of the flow path; providing a layer that becomes the flow path forming member, so as to cover the pattern; forming the discharge port at a part of the layer that becomes the flow path forming member; and forming the flow path by removing the pattern. | 10-07-2010 |
| Patent application number | Description | Published |
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| 20100045739 | RESIN COMPOSITION, RESIN CURED PRODUCT, AND LIQUID DISCHARGE HEAD - An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): | 02-25-2010 |
| 20100134555 | RESIN COMPOSITION, RESIN CURED PRODUCT, AND LIQUID DISCHARGE HEAD - An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): | 06-03-2010 |
| 20100248156 | RESIN COMPOSITION, RESIN CURED PRODUCT, AND LIQUID DISCHARGE HEAD - An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): | 09-30-2010 |
