Patent application number | Description | Published |
20090268867 | MEDICAL X-RAY IMAGING SYSTEM - The solid-state image pick-up device ( | 10-29-2009 |
20100193692 | SOLID STATE IMAGING DEVICE - A solid state imaging device | 08-05-2010 |
20130193313 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device of one embodiment includes a light receiving section including of a plurality of pixels | 08-01-2013 |
20130279649 | SOLID IMAGING DEVICE AND X-RAY CT DEVICE INCLUDING THE SOLID IMAGING DEVICE - The present invention relates to a solid-state imaging device, etc. having a structure for capturing a high-resolution image even when any row selecting wiring is disconnected. The solid-state imaging device ( | 10-24-2013 |
20130279650 | SOLID-STATE IMAGER AND X-RAY CT APPARATUS INCLUDING SAME - The present invention relates to a solid-state imaging device and the like having a structure for capturing a high-resolution image even when any of the reading-out wiring and row selecting wiring is disconnected. The solid-state imaging device ( | 10-24-2013 |
20130284892 | SOLID-STATE IMAGING DEVICE - A vertical shift register section includes M logic circuits for outputting row selection control signals respectively to M row selection wiring lines and shift register circuits disposed for every two row selection wiring lines. The M logic circuits, when a binning control signal Vbin | 10-31-2013 |
20130284893 | SOLID-STATE IMAGING DEVICE AND SOLID-STATE IMAGING DEVICE DRIVING METHOD - A controlling section, by bringing readout switches of pixels of a certain row out of the M rows into a connected state, causes charges generated in the row to be input to integration circuits, causes first holding circuits to hold voltage values output from the integration circuits, and then brings transfer switches into a connected state to transfer the voltage values to the second holding circuits, and thereafter performs in parallel an operation for causing the voltage values to be sequentially output from the second holding circuits and an operation for, by bringing readout switches of pixels of another row into a connected state, causing charges generated in the row to be input to the integration circuits. Accordingly, a solid-state imaging device and a driving method thereof capable of suppressing variations in output characteristics, while solving the problem due to a delay effect are realized. | 10-31-2013 |
20130292549 | SOLID IMAGING DEVICE - A solid-state imaging device includes a photodetecting section including pixels each including a transistor and a photodiode, readout wiring lines connected to the transistors, a signal output section for sequentially outputting voltage values according to the amounts of charges input through the respective readout wiring lines, potential change switches for switching the potentials of the readout wiring lines to a potential Vdr different from input potentials of integration circuits of the signal output section, and a controlling section. The controlling section switches potentials of the readout wiring lines to the different potential Vdr for a predetermined period included in a period, after an elapse of a readout period where voltage values corresponding to the amounts of charges generated in the pixels are sequentially output from the signal output section, until a next readout period is started. | 11-07-2013 |
20130299679 | SOLID-STATE IMAGE PICKUP DEVICE AND METHOD OF DRIVING SOLID-STATE IMAGE PICKUP DEVICE - A controlling section causes a charge of a photodiode to be output to an integration circuit by bringing a readout switch into a connected state, and then brings the readout switch into a non-connected state. Thereafter, a voltage value is output to a holding circuit from the integration circuit. After carrying out the output operation mentioned above, an operation for causing a charge held in an integrating capacitive element to be discharged, and bringing the readout switch into a connected state to cause a charge held in the photodiode to be discharged and an operation for causing voltage values held in the holding circuits to be sequentially output are carried out in parallel. Accordingly, a solid-state imaging device and a method of driving it capable of solving the problems due to a memory effect, a delay effect, and switching noise are realized. | 11-14-2013 |
20130308030 | METHOD FOR CONTROLLING SOLID-STATE IMAGE PICKUP DEVICE - Charges accumulated in pixels contained in one or a plurality of readout object rows that form a partial region of a photodetecting region are selectively read out in each of the L times (L is an integer not less than 2) of imaging frames, and in each of the L times of imaging frames, resetting of charges accumulated in pixels contained in only a part of non-readout object rows is performed, as well as, resetting is performed at least once in a period of the L times of imaging frames for each of the two or more non-readout object rows. Accordingly, a control method for a solid-state imaging element capable of reducing the time required per one imaging frame and reducing load on the peripheral circuit when selectively reading out charges accumulated in pixels in a partial region of the photodetecting region is realized. | 11-21-2013 |
20140037060 | SOLID-STATE IMAGE PICKUP APPARATUS AND X-RAY INSPECTION SYSTEM - A solid-state image pickup apparatus | 02-06-2014 |
20140252241 | SOLID STATE IMAGING DEVICE - A solid state imaging device | 09-11-2014 |
20140353515 | SENSOR UNIT AND SOLID-STATE IMAGING DEVICE - A sensor unit includes a metallic base member, a solid-state imaging element, and amplifier chips. The base member has a first placement surface and a second placement surface. The solid-state imaging element has a photodetecting surface, and is disposed on the first placement surface such that a rear surface and the first placement surface face each other. The amplifier chips are mounted on a substrate disposed on the second placement surface. The base member further has side wall portions facing side surfaces of the solid-state imaging element. The chips and the solid-state imaging element are electrically connected to one another via a bonding wire. The chips are thermally coupled to the base member via a thermal via of the substrate. | 12-04-2014 |