Patent application number | Description | Published |
20130119501 | IMAGE PICKUP APPARATUS AND IMAGE PICKUP APPARATUS MANUFACTURING METHOD - An image pickup apparatus includes: an image pickup device disposed in a first principal surface of a silicon substrate, the image pickup device sensing infrared light; an electrode pad disposed on the first principal surface; a front-face wiring connecting the image pickup device and the electrode pad; an external connection terminal disposed on a second principal surface of the silicon substrate; a back-face wiring connecting the electrode pad and the external connection terminal via a substrate through-hole extending from the second principal surface side through the silicon substrate to a back face of the electrode pad; and a light blocking layer disposed on the second principal surface, the light blocking layer covering a trench portion surrounding the image pickup device and a region surrounded by the trench portion. | 05-16-2013 |
20140078280 | IMAGE PICKUP APPARATUS - An image pickup apparatus includes: a solid-state image pickup device partitioned into a light-receiving portion region that generates an image pickup signal of an optical image, a circuit portion region that processes the image pickup signal and generates a driving signal, and a terminal portion region having terminals for inputting/outputting signals with an external apparatus; and an objective optical portion having an objective lens unit including a unit main body having an objective lens group for forming an optical image and a holding barrel where the unit main body is fixed, and a prism that guides the optical image that passes through the objective lens unit to the light-receiving portion region. The prism of the objective optical portion is disposed on the light-receiving portion region of the substrate, and the holding barrel of the objective lens unit is disposed on the circuit portion region. | 03-20-2014 |
20140267893 | IMAGE PICKUP UNIT AND METHOD FOR MANUFACTURING THE SAME - An image pickup unit according to the embodiment includes an image pickup device chip having a rectangular shape in plan view, a transparent substrate which is equal in plan view dimensions to the image pickup device chip and is joined to the image pickup device chip, and a lens unit joined to the transparent substrate with the center of a light receiving portion of the image pickup chip aligned with the optical axis, in which, two locking portions are formed in the transparent substrate and two locked portions of the lens unit which is equal to or smaller than the image pickup device chip in plan view dimensions are fitted into or abut on the corresponding locking portions respectively. | 09-18-2014 |
20150085094 | IMAGE PICKUP APPARATUS, SEMICONDUCTOR APPARATUS, AND IMAGE PICKUP UNIT - An image pickup apparatus includes: an image pickup chip including a light receiving section and electrode pads, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent cover glass having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the cover glass; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the cover glass. | 03-26-2015 |
20150085169 | METHOD FOR PRODUCING IMAGE PICKUP APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer. | 03-26-2015 |
20150087086 | METHOD FOR PRODUCING IMAGE PICKUP APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer. | 03-26-2015 |
20150087088 | METHOD FOR PRODUCING IMAGE PICKUP APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A method for producing an image pickup apparatus includes processes of: cutting an image pickup chip substrate to fabricate a plurality of image pickup chips; bonding the image pickup chips to a glass wafer via a transparent adhesive layer as well as bonding dummy chips to an outer peripheral region of the glass wafer where the image pickup chips are not bonded to fabricate a joined wafer; filling a sealing member between the image pickup chips and the dummy chips; machining the joined wafer to thin a thickness; and cutting the joined wafer. | 03-26-2015 |
20150228678 | IMAGE PICKUP APPARATUS, ENDOSCOPE, SEMICONDUCTOR APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS - An image pickup apparatus includes: an image pickup device chip that has junction terminals, which is connected with an image pickup unit, on a reverse surface; a cable having lead wires connected with the image pickup unit; and a wiring board that includes junction electrodes joined to the junction terminals, terminal electrodes connected with the lead wires, wirings that connect the junction electrodes formed at a central portion and the terminal electrodes formed at extending portions, and a heat transmission pattern formed in a region where the junction electrodes, the terminal electrodes and the wirings are not formed, the extending portions being bent and thereby the wiring board being arranged within a projected plane of the image pickup device chip. | 08-13-2015 |